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Research Papers

Application of the Transient Heat Transfer Measurement Technique in a Low Aspect Ratio Pin Fin Cooling Channel

[+] Author and Article Information
Meriam Axtmann

Institute of Aerospace Thermodynamics (ITLR),
University of Stuttgart,
Pfaffenwaldring 31,
Stuttgart 70569, Germany
e-mail: meriam.axtmann@itlr.uni-stuttgart.de

Jens von Wolfersdorf

Professor
Institute of Aerospace Thermodynamics (ITLR),
University of Stuttgart,
Pfaffenwaldring 31,
Stuttgart 70569, Germany
e-mail: jvw@uitlr.uni-stuttgart.de

Georg Meyer

Institute of Aerospace Thermodynamics (ITLR),
University of Stuttgart,
Pfaffenwaldring 31,
Stuttgart 70569, Germany

1Corresponding author.

Manuscript received July 16, 2015; final manuscript received August 6, 2015; published online September 23, 2015. Editor: Kenneth C. Hall.

J. Turbomach 137(12), 121006 (Sep 23, 2015) (9 pages) Paper No: TURBO-15-1151; doi: 10.1115/1.4031267 History: Received July 16, 2015; Revised August 06, 2015

This study investigates on heat transfer enhancement in pin fin cooling channels. Experiments are conducted in a staggered pin fin array consisting of 15 rows. Heat transfer measurements are conducted in the pin fin cooling channel using the transient liquid crystal technique. The reference temperature is approximated by the fluid bulk temperature, acquired by thermocouples at specific positions. Thermal inertia of the used thermocouples is considered. One other problem that occurs while using relatively long thermocouples in short aspect ratio ducts is the heat conduction along the wires, the so-called stem effect. This can lead to erroneous temperature measurements. The impact of the thermocouple immersion length on the temperature measurement is investigated. A detailed assessment of the space and timewise varying temperature distribution is conducted for the appropriate reference temperature. This paper gives an overview about the experimental setup and the used transient measurement technique. Results are represented in terms of temperature distribution, heat transfer distribution, and averaged Nusselt number at the endwall.

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References

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Figures

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Fig. 1

Schematic view of the test rig

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Fig. 2

Pin fin array instrumentation with thermocouples

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Fig. 3

Stream normalized fluid temperature field at thermocouples positions

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Fig. 4

Stem effect for different thermocouples

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Fig. 5

Sketch of thermocouple insertion

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Fig. 6

Comparison between two different thermocouple insertion fashions

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Fig. 7

Impact of the root heater on the temperature measurement

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Fig. 8

Boundary conditions of simulated thermocouple

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Fig. 9

Comparison between measuring tip temperatures with different immersion lengths

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Fig. 10

Fluid temperature distribution versus time along array centerline

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Fig. 11

Comparison of the dimensionless temperature profile between a transient experiment at various times and steady state simulation

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Fig. 12

Interpolated fluid temperature at one point in time, ReD,max = 5000

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Fig. 13

Local heat transfer distribution on the endwall for ReD,max = 5000

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Fig. 14

Row resolved averaged heat transfer distribution

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Fig. 15

Comparison of the array averaged experimental data with correlations

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