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Proceedings Papers

An Experimental Study on Heat Transfer Performance of Jet Impingement Arrays

Zhen Cao, Bengt Sundén, Jiahong Fu

Proc. ASME. HT2022, ASME 2022 Heat Transfer Summer Conference, V001T12A003, July 11–13, 2022

Paper No: HT2022-81617

DOI: https://doi.org/10.1115/HT2022-81617

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Topics: Heat transfer, Impingement cooling, Liquid crystals, Cooling, Computer cooling, Electronics, Heating, Thermal management

Proceedings Papers

A Comparative Study of 1-D and 3-D Simulation Methodologies To Predict the Thermal Performance of a Power Electronics Hardware

Ankit Tiwari, Craig Whitaker, Brian Kendall

Proc. ASME. HT2021, ASME 2021 Heat Transfer Summer Conference, V001T06A001, June 16–18, 2021

Paper No: HT2021-62306

DOI: https://doi.org/10.1115/HT2021-62306

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Topics: Computational fluid dynamics, Electronics, Hardware, Heat transfer, Simulation, Radiation (Physics), Thermal analysis, Convection, Heat sinks, Temperature

Proceedings Papers

A Novel Fast Predicting Technique for the Absorptivity of Surface Coating

Emir Özkökdemir, Berkay Filiz, Yener Usul

Proc. ASME. HT2021, ASME 2021 Heat Transfer Summer Conference, V001T12A001, June 16–18, 2021

Paper No: HT2021-61956

DOI: https://doi.org/10.1115/HT2021-61956

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Topics: Coating processes, Coatings, Solar radiation, Aluminum plate, Simulation, Electronics, Errors, Finite element analysis, Finite element model, Heat capacity

Proceedings Papers

Experimental Investigation of a PCM-Based Topology Optimized Heat Sink for Passive Cooling of Electronics

Jin Yao Ho, Kai Choong Leong

Proc. ASME. HT2020, ASME 2020 Heat Transfer Summer Conference, V001T09A013, July 13–15, 2020

Paper No: HT2020-9143

DOI: https://doi.org/10.1115/HT2020-9143

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Topics: Cooling, Electronics, Heat sinks, Topology, Heat, Temperature, Aluminum alloys, Energy dissipation, Flux (Metallurgy), Lasers

Proceedings Papers

Transient Determination on the Bulk Thermal Conductivity of Sub-Millimeter Thin Films of Composite Phase Change Thermal Interfacial Materials

Yu-Hong Zhang, Biao Feng, Jing Tu, Li-Wu Fan

Proc. ASME. HT2019, ASME 2019 Heat Transfer Summer Conference, V001T14A001, July 14–17, 2019

Paper No: HT2019-3520

DOI: https://doi.org/10.1115/HT2019-3520

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Topics: Composite materials, Thermal conductivity, Thin films, Transients (Dynamics), Thermal management, Contact resistance, Design, Electronics, Instrumentation, Phase change materials

Proceedings Papers

ASETS-II Oscillating Heat Pipe Space Flight Experiment: Ground Truth Results

Brent S. Taft, Sally M. Smith

Proc. ASME. HT2017, Volume 1: Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems, V001T01A001, July 9–12, 2017

Paper No: HT2017-4706

DOI: https://doi.org/10.1115/HT2017-4706

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Topics: Heat pipes, Space flight, Flight, Hardware, Testing, Uncertainty, Boundary-value problems, Design, Electronics, Fluids

Proceedings Papers

Heat Transfer Analysis of Graphite Foam Embedded Vapor Chamber for Cooling of Power Electronics in Electric Vehicles

Anand K. Patel, Weihuan Zhao

Paper No: HT2017-4731

DOI: https://doi.org/10.1115/HT2017-4731

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Topics: Cooling, Electric vehicles, Electronics, Graphite, Heat transfer, Vapors, Heat, Flat heat pipes, Copper, Heat flux

Proceedings Papers

Numerical Analysis of Thermal Transport in Nano Fluidic Porous Filled Heat Exchangers for Electronics Cooling

Carlos Zing, Shadi Mahjoob

Paper No: HT2017-4966

DOI: https://doi.org/10.1115/HT2017-4966

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Topics: Computer cooling, Heat exchangers, Numerical analysis, Water, Coolants, Cooling, Copper, Electronics, Nanofluids, Operating temperature

Proceedings Papers

Investigation of the Thermal Behaviour of Thin Phase Change Material Packages as a Solution to Temperature Control in Electronics

Benjamin Sponagle, Simon Maranda, Dominic Groulx

Paper No: HT2017-4801

DOI: https://doi.org/10.1115/HT2017-4801

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Topics: Electronics, Phase change materials, Temperature control, Temperature, Computer simulation, Electronic systems, Finite element methods, Thermal energy storage, Thermal management

Proceedings Papers

Numerical Evaluation of Multiple Phase Change Materials for Pulsed Electronics Applications

David Gonzalez-Nino, Lauren M. Boteler, Dimeji Ibitayo, Nicholas R. Jankowski, Pedro O. Quintero

Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T11A004, July 10–14, 2016

Paper No: HT2016-7223

DOI: https://doi.org/10.1115/HT2016-7223

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Topics: Electronics, Phase change materials, Heat, Tin, Transients (Dynamics), Stress, Thermal conductivity, Absorption, Finite difference methods, Gallium

Proceedings Papers

Recent Advances in High-Flux, Two-Phase Thermal Management

Issam Mudawar

Proc. ASME. HT2013, Volume 2: Heat Transfer Enhancement for Practical Applications; Heat and Mass Transfer in Fire and Combustion; Heat Transfer in Multiphase Systems; Heat and Mass Transfer in Biotechnology, V002T07A041, July 14–19, 2013

Paper No: HT2013-17046

DOI: https://doi.org/10.1115/HT2013-17046

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Topics: Algorithms, Avionics, Computers, Coolants, Cooling, Cooling systems, Data centers, Databases, Design, Electric vehicles

Proceedings Papers

Flow Boiling Dynamics of Water and Nanofluids in a Single Microchannel at Different Heat Fluxes

Zachary Edel, Abhijit Mukherjee

Paper No: HT2013-17492

DOI: https://doi.org/10.1115/HT2013-17492

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Topics: Boiling, Dynamics (Mechanics), Flow (Dynamics), Flux (Metallurgy), Heat, Microchannels, Nanofluids, Water, Bubbles, Nanoparticles

Proceedings Papers

Experimental Investigation of the Effect of Synthetic Jets on Local Heat Transfer Coefficients in Minichannels During Laminar and Turbulent Flow Conditions

David M. Sykes, Andrew L. Carpenter, Gregory S. Cole

Paper No: HT2013-17428

DOI: https://doi.org/10.1115/HT2013-17428

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Topics: Heat transfer coefficients, Jets, Turbulence, Flow (Dynamics), Pressure, Heat transfer, Laminar flow, Microchannels, Wall temperature, Boundary layers

Proceedings Papers

Thermal Contact Conductance of Radiation-Aged Thermal Interface Materials for Space Applications

Robert A. Sayer, Timothy P. Koehler, Scott M. Dalton, Thomas W. Grasser, Ronald L. Akau

Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A002, July 14–19, 2013

Paper No: HT2013-17408

DOI: https://doi.org/10.1115/HT2013-17408

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Topics: Contact resistance, Radiation (Physics), Design, Gamma rays, Electronics, Flow (Dynamics), Heat, Heat transfer, Irradiation (Radiation exposure), Pressure

Proceedings Papers

3D Thermal Resistance Network Method for the Design of Highly Integrated Packages

Lauren Boteler, Andrew Smith

Paper No: HT2013-17575

DOI: https://doi.org/10.1115/HT2013-17575

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Topics: Design, Thermal resistance, Packaging, Resistors, Temperature, Cooling, Dimensions, Electronics, Computer simulation, Energy dissipation

Proceedings Papers

Thermally-Induced Dispersion of Coolant Mixtures Through Heated Layered Materials

B. S. Tilley

Paper No: HT2013-17737

DOI: https://doi.org/10.1115/HT2013-17737

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Topics: Coolants, Laminates, Microscale devices, Fluids, Geometry, Heat, Design, Electronics, Flow (Dynamics), Heat sinks

Proceedings Papers

An Experimental Study of a Multi-Device Jet Impingement Cooler With Phase Change Using HFE-7100

Shailesh N. Joshi, Matthew J. Rau, Ercan M. Dede, Suresh V. Garimella

Paper No: HT2013-17059

DOI: https://doi.org/10.1115/HT2013-17059

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Topics: Cooling, Critical heat flux, Density, Design, Electronics, Fluids, Flux (Metallurgy), Heart failure, Heat, Heat transfer

Proceedings Papers

A Numerical Study of a Single Unsteady Laminar Slot Jet in a Confined Structure

Omidreza Ghaffari, M. Baris Dogruoz, Mehmet Arik

Paper No: HT2013-17833

DOI: https://doi.org/10.1115/HT2013-17833

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Topics: Cooling, Electronics, Flow (Dynamics), Heat transfer, Jets, Nozzles, Pressure, Transients (Dynamics)

Proceedings Papers

Hot Water Cooled Electronics for High Exergetic Utility

Severin Zimmermann, Manish K. Tiwari, Ingmar Meijer, Bruno Michel, Dimos Poulikakos

Proc. ASME. HT2012, Volume 1: Heat Transfer in Energy Systems; Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat and Mass Transfer in Biotechnology; Environmental Heat Transfer; Visualization of Heat Transfer; Education and Future Directions in Heat Transfer, 373-380, July 8–12, 2012

Paper No: HT2012-58432

DOI: https://doi.org/10.1115/HT2012-58432

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Topics: Electronics, Hot water, Heat sinks, Cooling, Data centers, Coolants, Heat, Temperature, Engineering prototypes, Manifolds

Proceedings Papers

Numerical Modeling of a Micro-Scale Stirling Cooler

Dongzhi Guo, Alan J. H. McGaughey, Jinsheng Gao, Gary K. Fedder, Minyoung Lee, Shi-Chune Yao

Paper No: HT2012-58361

DOI: https://doi.org/10.1115/HT2012-58361

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Topics: Computer simulation, Microscale devices, Porous materials, Cooling, Columns (Structural), Geometry, Heat transfer, Porosity, Compressible flow, Coolers

2 3 4

NARROW

An Experimental Study on Heat Transfer Performance of Jet Impingement Arrays

A Comparative Study of 1-D and 3-D Simulation Methodologies To Predict the Thermal Performance of a Power Electronics Hardware

A Novel Fast Predicting Technique for the Absorptivity of Surface Coating

Experimental Investigation of a PCM-Based Topology Optimized Heat Sink for Passive Cooling of Electronics

Transient Determination on the Bulk Thermal Conductivity of Sub-Millimeter Thin Films of Composite Phase Change Thermal Interfacial Materials

ASETS-II Oscillating Heat Pipe Space Flight Experiment: Ground Truth Results

Heat Transfer Analysis of Graphite Foam Embedded Vapor Chamber for Cooling of Power Electronics in Electric Vehicles

Numerical Analysis of Thermal Transport in Nano Fluidic Porous Filled Heat Exchangers for Electronics Cooling

Investigation of the Thermal Behaviour of Thin Phase Change Material Packages as a Solution to Temperature Control in Electronics

Numerical Evaluation of Multiple Phase Change Materials for Pulsed Electronics Applications

Recent Advances in High-Flux, Two-Phase Thermal Management

Flow Boiling Dynamics of Water and Nanofluids in a Single Microchannel at Different Heat Fluxes

Experimental Investigation of the Effect of Synthetic Jets on Local Heat Transfer Coefficients in Minichannels During Laminar and Turbulent Flow Conditions

Thermal Contact Conductance of Radiation-Aged Thermal Interface Materials for Space Applications

3D Thermal Resistance Network Method for the Design of Highly Integrated Packages

Thermally-Induced Dispersion of Coolant Mixtures Through Heated Layered Materials

An Experimental Study of a Multi-Device Jet Impingement Cooler With Phase Change Using HFE-7100

A Numerical Study of a Single Unsteady Laminar Slot Jet in a Confined Structure

Hot Water Cooled Electronics for High Exergetic Utility

Numerical Modeling of a Micro-Scale Stirling Cooler

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