Topics: Diffraction, Metals, Nanoparticles, Thermal energy transport, Packings (Cushioning), Manufacturing, Absorption, Copper, Electromagnetic scattering, Additive manufacturing

Topics: Design, Thermal resistance, Packaging, Resistors, Temperature, Cooling, Dimensions, Electronics, Computer simulation, Energy dissipation

Topics: Computer cooling, Heat pipes, Instrumentation, Methanol, Space vehicles, Water, Heat, Copper, Electronics, Contamination

Topics: Electronics, Temperature, Transients (Dynamics), Condensation, Corrosion, Design, Electronic systems, Electronic products, Engineers, Experimental characterization

Topics: Heat, Printed circuit boards, Thermal management, Separation (Technology), Computational fluid dynamics, Density, Experimental design, Geometry, Maintenance, Natural convection

Topics: Computer cooling, Heat conduction, Packaging, Composite materials, Polymers, Semiconductors (Materials), Thermal resistance, Thin films

Topics: Ball-Grid-Array packages, Design, Genetic algorithms, Optimization, Thermomechanics, Ball-Grid-Array packaging, Electronic packages, Electronic packaging, Electronics, Leakage

Topics: Lasers, MEMS packaging, Modeling, Sealing (Process), Temperature, Heat, Intermetallic compounds, Microelectromechanical systems, Heating, Melting

Topics: Ball-Grid-Array packaging, Design, Electronic packaging, Optimization, Artificial neural networks, Electronic products, Engineering disciplines, Leakage, Packaging, Tradeoffs