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Proceedings Papers

Thermal Performance of a Flat Plate Heat Pipe With Gradient Wettability

Ping-Hei Chen, Hung-Hsia Chen, Bo-Rui Huang, Long-Sheng Kuo
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T20A001, July 14–19, 2013
Paper No: HT2013-17033
DOI: https://doi.org/10.1115/HT2013-17033
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Topics: Flat plates, Heat pipes, Evaporation, Heat transfer, Copper, Fluids, Furnaces, Gravity (Force), Nanoparticles, Sol-gel processing
Proceedings Papers

Aerogel for Microsystems Thermal Insulation: System Design and Process Development

Brian Smith, David Romero, Damena Agonafer, Jason Gu, Cristina H. Amon
Proc. ASME. HT2005, Heat Transfer: Volume 4, 753-762, July 17–22, 2005
Paper No: HT2005-72663
DOI: https://doi.org/10.1115/HT2005-72663
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Topics: Design, Microelectromechanical systems, Thermal insulation, Microelectronic devices, Crystals, Modeling, Sensors, Computer simulation, Electrical properties, Electronic systems