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Proceedings Papers

The Importance of Viscous Dissipation in Micro-Tube and Micro-Gap Flows

Herman D. Haustein, Barak Kashi
Proc. ASME. ICNMM2018, ASME 2018 16th International Conference on Nanochannels, Microchannels, and Minichannels, V001T01A004, June 10–13, 2018
Paper No: ICNMM2018-7704
https://doi.org/10.1115/ICNMM2018-7704
View Paper titled, The Importance of Viscous Dissipation in Micro-Tube and Micro-Gap Flows
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Topics: Energy dissipation, Flow (Dynamics), Cooling, Convection, Density, Forced convection, Gas flow, Heat, Heat flux, Heat transfer coefficients
Proceedings Papers

Vortex Laden Flows in a Micro-Gap for Enhanced Direct Chip Cooling

Amir Gorodetsky, Herman D. Haustein
Proc. ASME. ICNMM2016, ASME 2016 14th International Conference on Nanochannels, Microchannels, and Minichannels, V001T02A003, July 10–14, 2016
Paper No: ICNMM2016-8047
https://doi.org/10.1115/ICNMM2016-8047
View Paper titled, Vortex Laden Flows in a Micro-Gap for Enhanced Direct Chip Cooling
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Topics: Cooling, Flow (Dynamics), Vortices, Heat transfer, Energy dissipation, Excitation, Jets, Pressure drop, Simulation, Vortex shedding
Proceedings Papers

Experimental Characterization and Modeling of Capillary-Pumped Thin-Film Evaporation From Micropillar Wicks

Solomon Adera, Dion Antao, Rishi Raj, Evelyn N. Wang
Proc. ASME. ICNMM2016, ASME 2016 14th International Conference on Nanochannels, Microchannels, and Minichannels, V001T09A005, July 10–14, 2016
Paper No: ICNMM2016-8085
https://doi.org/10.1115/ICNMM2016-8085
View Paper titled, Experimental Characterization and Modeling of Capillary-Pumped Thin-Film Evaporation From Micropillar Wicks
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Topics: Evaporation, Experimental characterization, Modeling, Thin films, Heat, Nucleate boiling, Cooling, Thermal management, Capillarity, Design
Proceedings Papers

Microchannel Design Study for 3D Microelectronics Cooling Using a Hybrid Analytical and Finite Element Method

L.-M. Collin, V. Fiori, P. Coudrain, S. L. Lhostis, S. Chéramy, J.-P. Colonna, B. Mathieu, A. Souifi, L. G. Fréchette
Proc. ASME. ICNMM2015, ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, V001T07A005, July 6–9, 2015
Paper No: ICNMM2015-48830
https://doi.org/10.1115/ICNMM2015-48830
View Paper titled, Microchannel Design Study for 3D Microelectronics Cooling Using a Hybrid Analytical and Finite Element Method
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Topics: Cooling, Design, Finite element methods, Microchannels, Microelectronic devices, Heat, Modeling, Computer software, Finite element analysis, Copper
Proceedings Papers

Effect of Channel Width on Pool Boiling Enhancement of Open Microchannels With Selective Sintered Porous Coatings

Arvind Jaikumar, Satish G. Kandlikar
Proc. ASME. ICNMM2015, ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, V001T04A028, July 6–9, 2015
Paper No: ICNMM2015-48477
https://doi.org/10.1115/ICNMM2015-48477
View Paper titled, Effect of Channel Width on Pool Boiling Enhancement of Open Microchannels With Selective Sintered Porous Coatings
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Topics: Coatings, Microchannels, Pool boiling, Critical heat flux, Atmospheric pressure, Boiling, Bonding, Cooling, Heat flux, Heat transfer
Proceedings Papers

Critical Heat Flux of Graphene Coated Copper Surface at High Pressures

Nanxi Li, Amy Rachel Betz
Proc. ASME. ICNMM2015, ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, V001T04A030, July 6–9, 2015
Paper No: ICNMM2015-48509
https://doi.org/10.1115/ICNMM2015-48509
View Paper titled, Critical Heat Flux of Graphene Coated Copper Surface at High Pressures
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Topics: Copper, Critical heat flux, Graphene, Pressure, Cylinders, Fluids, Heat flux, Pool boiling, Atmospheric pressure, Boiling
Proceedings Papers

Start-Up and Transient Behavior of an Oscillating Heat Pipe

Sagar Babu Paudel, Gregory J. Michna
Proc. ASME. ICNMM2015, ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, V001T07A001, July 6–9, 2015
Paper No: ICNMM2015-48438
https://doi.org/10.1115/ICNMM2015-48438
View Paper titled, Start-Up and Transient Behavior of an Oscillating Heat Pipe
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Topics: Heat pipes, Transients (Dynamics), Methanol, Fluids, Temperature, Heat, Stress, Water, Cooling, Electronics
Proceedings Papers

CFD Analysis of Flow Boiling in a Silicon Microchannel With Non-Uniform Heat Flux

Daniel Lorenzini, Yogendra K. Joshi
Proc. ASME. ICNMM2015, ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, V001T07A014, July 6–9, 2015
Paper No: ICNMM2015-48098
https://doi.org/10.1115/ICNMM2015-48098
View Paper titled, CFD Analysis of Flow Boiling in a Silicon Microchannel With Non-Uniform Heat Flux
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Topics: Boiling, Computational fluid dynamics, Flow (Dynamics), Heat flux, Microchannels, Silicon, Heat, Flux (Metallurgy), Microelectronic devices, Cooling
Proceedings Papers

Effect of Inclination Angle on Pulsating Heat Pipe Performance

Sagar Babu Paudel, Gregory J. Michna
Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T05A006, August 3–7, 2014
Paper No: ICNMM2014-22016
https://doi.org/10.1115/ICNMM2014-22016
View Paper titled, Effect of Inclination Angle on Pulsating Heat Pipe Performance
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Topics: Heat pipes, Flux (Metallurgy), Heat, Thermal resistance, Computer cooling, Construction, Copper, Heat transfer, Microelectronic devices, Pressure
Proceedings Papers

Microfluidics Device Manufacturing Using the Technique of 3D Printing

Walter Duarte de Araújo Filho, Rigoberto E. M. Morales, Fábio K. Schneider, Luciana Martins P. de Araújo
Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T15A002, August 3–7, 2014
Paper No: ICNMM2014-21540
https://doi.org/10.1115/ICNMM2014-21540
View Paper titled, Microfluidics Device Manufacturing Using the Technique of 3D Printing
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Topics: Additive manufacturing, Manufacturing, Microfluidics, Microbubbles, Microelectromechanical systems, Ceramics, Glass, Microelectronic devices, Polymers, Printing
Proceedings Papers

Heat Transfer Enhancement During Pool Boiling of Water Over Horizontal and Vertical Tubes With Micro Structured Surfaces

Jeet S. Mehta, Satish G. Kandlikar
Proc. ASME. ICNMM2012, ASME 2012 10th International Conference on Nanochannels, Microchannels, and Minichannels, 71-80, July 8–12, 2012
Paper No: ICNMM2012-73175
https://doi.org/10.1115/ICNMM2012-73175
View Paper titled, Heat Transfer Enhancement During Pool Boiling of Water Over Horizontal and Vertical Tubes With Micro Structured Surfaces
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Topics: Heat transfer, Pool boiling, Water, Bubbles, Boilers, Cooling, Drugs, Dynamics (Mechanics), Heat, Lasers
Proceedings Papers

A Novel Thermo-Hydraulic Test Platform for Micropillared Array Thermal Wick Optimization

Collier Miers, Geoff Wehmeyer, Carlos H. Hidrovo
Proc. ASME. ICNMM2012, ASME 2012 10th International Conference on Nanochannels, Microchannels, and Minichannels, 827-834, July 8–12, 2012
Paper No: ICNMM2012-73192
https://doi.org/10.1115/ICNMM2012-73192
View Paper titled, A Novel Thermo-Hydraulic Test Platform for Micropillared Array Thermal Wick Optimization
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Topics: Columns (Structural), Condensers (steam plant), Coolants, Cooling, Evaporation, Flow (Dynamics), Geometry, Gravity (Force), Heat, Heat pipes
Proceedings Papers

The Effect of Chaotic Mixing on Heat Transfer in Continuous Thermal Processes at Low Peclet Numbers

M. F. M. Speetjens
Proc. ASME. ICNMM2010, ASME 2010 8th International Conference on Nanochannels, Microchannels, and Minichannels: Parts A and B, 559-567, August 1–5, 2010
Paper No: FEDSM-ICNMM2010-30797
https://doi.org/10.1115/FEDSM-ICNMM2010-30797
View Paper titled, The Effect of Chaotic Mixing on Heat Transfer in Continuous Thermal Processes at Low Peclet Numbers
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Topics: Heat transfer, Transients (Dynamics), Chaos, Fluids, Temperature, Cavity flows, Convection, Cooling, Flow (Dynamics), Fluctuations (Physics)
Proceedings Papers

A Parametric Investigation of Operating Limits in Heat Pipes Using Novel Metal Foams as Wicks

Mahmood R. S. Shirazy, Luc G. Fre´chette
Proc. ASME. ICNMM2010, ASME 2010 8th International Conference on Nanochannels, Microchannels, and Minichannels: Parts A and B, 575-583, August 1–5, 2010
Paper No: FEDSM-ICNMM2010-31268
https://doi.org/10.1115/FEDSM-ICNMM2010-31268
View Paper titled, A Parametric Investigation of Operating Limits in Heat Pipes Using Novel Metal Foams as Wicks
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Topics: Heat pipes, Metal foams, Boiling, Cooling, Flat heat pipes, Foams (Chemistry), Heat transfer, Copper powders, Design, Dimensionless numbers
Proceedings Papers

Fuzzy Logic Approach for Controlling Temperature in Electroosmotic Flow Fields

Saeid Movahed, Mohammad Eghtesad, Reza Kamali
Proc. ASME. ICNMM2009, ASME 2009 7th International Conference on Nanochannels, Microchannels and Minichannels, 227-233, June 22–24, 2009
Paper No: ICNMM2009-82201
https://doi.org/10.1115/ICNMM2009-82201
View Paper titled, Fuzzy Logic Approach for Controlling Temperature in Electroosmotic Flow Fields
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Topics: Electroosmosis, Fuzzy logic, Temperature control, Flow (Dynamics), Cooling, Heat, Heat sinks, Heating, Joules, Boundary-value problems
Proceedings Papers

Cooling of Microelectronic Devices Packaged in a Single Chip Module Using Single Phase Refrigerant R-123

Tushara Pasupuleti, Satish G. Kandlikar
Proc. ASME. ICNMM2009, ASME 2009 7th International Conference on Nanochannels, Microchannels and Minichannels, 281-285, June 22–24, 2009
Paper No: ICNMM2009-82262
https://doi.org/10.1115/ICNMM2009-82262
View Paper titled, Cooling of Microelectronic Devices Packaged in a Single Chip Module Using Single Phase Refrigerant R-123
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Topics: Cooling, Microelectronic devices, Refrigerants, Fluids, Water, Cooling systems, Microchannels, Damage, Heat transfer, Leakage
Proceedings Papers

Optimization of Transitional Nano-Channel Cooling Heat Sink Using a Genetic Algorithm

Reza Kamali, Saeid Movahed
Proc. ASME. ICNMM2008, ASME 2008 6th International Conference on Nanochannels, Microchannels, and Minichannels, 1425-1430, June 23–25, 2008
Paper No: ICNMM2008-62247
https://doi.org/10.1115/ICNMM2008-62247
View Paper titled, Optimization of Transitional Nano-Channel Cooling Heat Sink Using a Genetic Algorithm
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Topics: Cooling, Genetic algorithms, Heat sinks, Optimization, Design, Cooling systems, Energy management, Fluid dynamics, Heat, Instrumentation
Proceedings Papers

Photonics on a Silicon Chip

Michal Lipson, Sasikanth Manipatruni, Kyle Preston, Carl Poitras
Proc. ASME. ICNMM2008, ASME 2008 6th International Conference on Nanochannels, Microchannels, and Minichannels, 1877-1880, June 23–25, 2008
Paper No: ICNMM2008-62383
https://doi.org/10.1115/ICNMM2008-62383
View Paper titled, Photonics on a Silicon Chip
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Topics: Photonics, Silicon chips, Silicon, Microelectronic devices, Optical interconnections, Optics, Photonic components, Switches, Wavelength
Proceedings Papers

Numerical and Experimental Research on Fluid Flow and Heat Transfer in Miniscale Channels

Wenguang Geng, Baoming Chen
Proc. ASME. ICNMM2007, ASME 5th International Conference on Nanochannels, Microchannels, and Minichannels, 739-748, June 18–20, 2007
Paper No: ICNMM2007-30079
https://doi.org/10.1115/ICNMM2007-30079
View Paper titled, Numerical and Experimental Research on Fluid Flow and Heat Transfer in Miniscale Channels
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Topics: Fluid dynamics, Heat transfer, Coolants, Flow (Dynamics), Temperature, Computer simulation, Cooling systems, Energy dissipation, Heat, Microelectronic devices
Proceedings Papers

Manifold Microchannel Cooler for Direct Backside Liquid Cooling of SiC Power Devices

Lauren Everhart, Nicholas Jankowski, Bruce Geil, Andrew Bayba, Dimeji Ibitayo, Patrick McCluskey
Proc. ASME. ICNMM2007, ASME 5th International Conference on Nanochannels, Microchannels, and Minichannels, 285-292, June 18–20, 2007
Paper No: ICNMM2007-30190
https://doi.org/10.1115/ICNMM2007-30190
View Paper titled, Manifold Microchannel Cooler for Direct Backside Liquid Cooling of SiC Power Devices
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Topics: Cooling, Manifolds, Microchannels, Design, Engineering simulation, Manufacturing, Pressure drop, Simulation, Flow (Dynamics), Heat