The objective this paper is to improve concurrent engineering of electronic packaging design problems by addressing issues of integrating manufacturing as a discipline in multidisciplinary design analysis and optimization (MDA/O) problems. To met this goal, MDA/O and electronic package manufacturing analysis modules are examined. Manufacturing can participate as a discipline in MDA/O problems if analysis capability exists to relate design variables to quantitative manufacturing performance metrics. Analysis modules for sheet metal enclosure and printed circuit board fabrication were found to meet these requirements. In formulating MDA/O problems with manufacturing as a discipline, questions arise about the role of manufacturing analysis, design variables selection, performance metrics, and constraint definitions. Answering these questions is the subject of continuing research.

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