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Proceedings Papers
In This Volume
Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B
Micro- and Nano-Systems Engineering and Packaging
Applied Mechanics and Materials
Bio-MEMS and NEMS
Carbon-Based Nano-Materials and Devices
Computational Studies on MEMS and Nanostructures
Design, Fabrication, Dynamics, and Control of Micro and Nano Systems
Design of DNA Origami Machines and Mechanisms
Topics:
Design
,
DNA
,
Machinery
,
Nanoscale phenomena
,
Geometry
,
Manufacturing
,
Hinges
,
Kinematics
,
Linkages
,
Construction
Emerging Technologies
Manufacturing, Materials and Processes in Electronics and Photonics Packaging
Evaluation of a Novel Anisotropic Conductive Adhesive Shear Under Multiple Tin-Lead and Lead-Free Reflow Cycles for Package-on-Package (POP) Assembly
Topics:
Adhesives
,
Anisotropy
,
Cycles
,
Manufacturing
,
Package on package
,
Shear (Mechanics)
,
Solders
,
Reliability
,
Hardening (Curing)
,
Particulate matter
Micro and Nano Devices
Micro/NanoScale Phononic Crystals and Acoustic Metamaterials: Fundamentals, Devices and Applications
Microfluidics 2012 Fluid Engineering in Micro- and Nanosystems
Design of a Microfluidic Device to Induce Noise Damage in Hair Cells of the Zebrafish Lateral Line
Hyuck-Jin Kwon, Yuhao Xu, Stephen A. Solovitz, Wei Xue, Alexander G. Dimitrov, Allison B. Coffin, Jie Xu
Topics:
Damage
,
Design
,
Microfluidics
,
Noise (Sound)
,
Flow (Dynamics)
,
Computational fluid dynamics
,
Boundary layers
,
Simulation
,
Dimensions
,
Ear
Design and Fabrication of Rock-Based Micromodel
Daniel S. Park, Saade Bou-Mikael, Sean King, Karsten E. Thompson, Clinton S. Willson, Dimitris E. Nikitopoulos
Topics:
Design
,
Manufacturing
,
Rocks
,
Computational fluid dynamics
,
Flow (Dynamics)
,
Engineering simulation
,
Optimization
,
Particulate matter
,
Polymers
,
Simulation
Modeling and Simulation in Electronics and Photonics Packaging
NanoEngineering for Energy and Sustainability
Nanomaterials and Nanostructures for Energy Applications
Nanostructured Materials Symposium
Posters
Power Harvesting MEMS/NEMS
Quality and Reliability of Electronics/Photonics Packaging, MEMS and NEMS
Inverse Derivation of Constants for the Constitutive Equation and Fatigue Model of Pb-Free Solder Joints Based on Experiment Results, Finite Element Simulation and Virtual Optimization Methodology
Topics:
Fatigue
,
Finite element analysis
,
Lead-free solders
,
Optimization
,
Simulation
,
Solders
,
Ball-Grid-Array packaging
,
Creep
,
Fatigue life
,
Reliability
Scalable Methods for Processing Nano-Engineered Materials, Structures, and Devices
Size Scale Effects in Micro/Nano Structured Materials and Composites
Thermal Management in Electronics
Effect of Phonon Confinement on the Dispersion Relation and Heat Capacity in Nanoscale Si Membranes
J. Cuffe, E. Chávez, A. Shchepetov, P.-O. Chapuis, E. H. El Boudouti, F. Alzina, Y. Pennec, B. Djafari-Rouhani, M. Prunnila, J. Ahopelto, C. M. Sotomayor Torres
Topics:
Dispersion relations
,
Heat capacity
,
Membranes
,
Nanoscale phenomena
,
Phonons
,
Density
,
Thermal conductivity
,
Acoustics
,
Bulk solids
,
Dimensions
System-Level Design for Liquid Cooled Chiller-Less Data Center
Pritish R. Parida, Timothy Chainer, Madhusudan Iyengar, Milnes David, Mark Schultz, Michael Gaynes, Vinod Kamath, Bejoy Kochuparambil, Robert Simons, Roger Schmidt
Topics:
Data centers
,
Design
,
Cooling
,
Energy consumption
,
Air conditioning
,
Computer simulation
,
Computers
,
Electronics
,
Refrigeration
,
Test facilities