With the advent of higher signaling frequencies on today’s motherboard, evolution suggests that the electronic industry is near a phase transition of going from through hole mount to surface mount connectors. Current computer infrastructure supports assembly of motherboards using through hole mount connectors from a historical standpoint. This legacy has led placement equipment manufacturers to develop fabrication machines that do not consider long, thin devices such as a PCI or DIMM connector. The reassessment of the world’s method of motherboard manufacturing presents a challenge. Hence the question arises, what is the realistic lifetime of a through hole mount connector and what are the assembly and reliability issues associated with a proposed replacement such as a surface mount connector. This paper addresses the basic reliability concerns of a long, thin, surface mount PCI connector both with, and without retention features.
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ASME 2002 International Mechanical Engineering Congress and Exposition
November 17–22, 2002
New Orleans, Louisiana, USA
Conference Sponsors:
- Materials Division
ISBN:
0-7918-3640-1
PROCEEDINGS PAPER
Manufacturability of Large SMT Connectors
Stacey N. Serafin,
Stacey N. Serafin
State University of New York at Buffalo, Buffalo, NY
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Terrance Dishongh
Terrance Dishongh
Intel Corporation, Hillsboro, OR
Search for other works by this author on:
Stacey N. Serafin
State University of New York at Buffalo, Buffalo, NY
Terrance Dishongh
Intel Corporation, Hillsboro, OR
Paper No:
IMECE2002-33073, pp. 237-240; 4 pages
Published Online:
June 3, 2008
Citation
Serafin, SN, & Dishongh, T. "Manufacturability of Large SMT Connectors." Proceedings of the ASME 2002 International Mechanical Engineering Congress and Exposition. Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials. New Orleans, Louisiana, USA. November 17–22, 2002. pp. 237-240. ASME. https://doi.org/10.1115/IMECE2002-33073
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