This article investigates the use of femtosecond laser induced surface morphology on silicon wafer surface in water confinement. Unlike irradiation of silicon surfaces in the air, there are no laser induced periodic structures, but irregular roughness is formed when the silicon wafer is ablated under water. The unique discovery of a smoothly processed silicon surface in water confinement under certain laser parameter combinations may help improve laser direct micromachining surface quality in industrial applications.
Femtosecond Laser-Induced Silicon Surface Morphology in Water
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Han, Y, Lin, C, & Tsai, H. "Femtosecond Laser-Induced Silicon Surface Morphology in Water." Proceedings of the ASME 2008 International Mechanical Engineering Congress and Exposition. Volume 10: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B, and C. Boston, Massachusetts, USA. October 31–November 6, 2008. pp. 1741-1744. ASME. https://doi.org/10.1115/IMECE2008-67923
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