Advances in semiconductor technology and trends in slim and light electronic systems have led to a significant increase in heat dissipation density of the electronic devices. Therefore, effective cooling technology is essential for reliable operation of electronic components. Among various cooling systems, natural convection heat sinks have been proven to be appropriate because of their inherent simplicity, reliability, and low long-term cost. The present study is focused on natural convective heat transfer from the cylindrical heat sink. Especially, the branched fins, which are motivated by the branched design of nature shown in trees and lungs, are used. The heating power and surface temperature are measured for various types of branched fins and numbers of fins. The result showed that the branched fin dissipates 20% more heat compared to the normal plate fins. Therefore, heat sinks with branched fins have a potential as a next-generation cooling device.

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