The temperature evolution of nanoparticle packings on a substrate under high laser power is investigated both experimentally and via numerical simulations. Numerical modeling of temperature distributions in copper nanoparticle packings on a glass substrate is performed and results are compared with experiment under 2.6 kW/cm2 laser power. A coupled electromagnetic-heat transfer model is implemented to understand the nanoparticle temperature distribution. Very good agreement between the coupled electromagnetic-heat transfer model and the experimental results is obtained by matching the interfacial thermal conductance, G, between the nanoparticles using the experimental result in the coupled electromagnetic-heat transfer model.
Heat Transfer Modeling of Nanoparticle Packings on a Substrate
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Yuksel, A, Yu, ET, Cullinan, M, & Murthy, J. "Heat Transfer Modeling of Nanoparticle Packings on a Substrate." Proceedings of the ASME 2018 International Mechanical Engineering Congress and Exposition. Volume 8B: Heat Transfer and Thermal Engineering. Pittsburgh, Pennsylvania, USA. November 9–15, 2018. V08BT10A050. ASME. https://doi.org/10.1115/IMECE2018-88642
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