MicroJoinery is an attractive concept to create precise translational movement for such components as optomechanical micro-accessories due to the readiness of silicon etching techniques. Basic fabrication of the dovetail MicroJoints uses anisotropic etching of (100) silicon wafers and fusion bonding. This paper focuses on a new fabrication method of self-assembly of the translational stage using a sacrificial layer and an electroplated microriveting technique, eliminating the need for wafer bonding and manual assembly. The slider is made from a double-side polished wafer and slides on substrate guided by a guide rail. The clearance between the sliding parts defined by the thickness of sacrificial layer is much smaller and repeatable than what bulk micromachining and manual assembly could provide. The coefficient of static friction was measured to be 0.42–0.78 in air for the self-assembled microslider with an added weight (3.5 g). For manually assembled dovetail MicroJoinery devices coated with silicon nitride, friction coefficient of around 0.302 was obtained.

This content is only available via PDF.
You do not currently have access to this content.