1-20 of 271
Adhesion
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Sticking to the Point: A Friction and Adhesion Model for Simulated Surfaces

Jun Chen, Christopher DiMattia, Russell M. Taylor, II, Mike Falvo, Pichet Thiansathaporn, Richard Superfine
Proc. ASME. IMECE97, Dynamic Systems and Control, 167-171, November 16–21, 1997
Paper No: IMECE1997-0392
DOI: https://doi.org/10.1115/IMECE1997-0392
View Paper
PDF
Topics: Adhesion, Friction, Physics, Haptics, Stiction
Proceedings Papers

Mechanics of Cell Rolling Adhesion in Shear Flow

Xiaoxiao Lei, Michael B. Lawrence, Cheng Dong
Proc. ASME. IMECE97, Advances in Bioengineering, 173-174, November 16–21, 1997
Paper No: IMECE1997-0284
DOI: https://doi.org/10.1115/IMECE1997-0284
View Paper
PDF
Topics: Adhesion, Shear flow, Leukocytes, Adhesives, Biological tissues, Deformation, Endothelial cells, Hemodynamics, Shear (Mechanics), Shear stress
Proceedings Papers

Measuring the Probability of Receptor Extraction From the Cell Membrane

Scott E. Chesla, Bryan T. Marshall, Cheng Zhu
Proc. ASME. IMECE97, Advances in Bioengineering, 129-130, November 16–21, 1997
Paper No: IMECE1997-0262
DOI: https://doi.org/10.1115/IMECE1997-0262
View Paper
PDF
Topics: Cell membranes, Probability, Membranes, Adhesion, Adhesives
Proceedings Papers

Probabilistic Modeling of Rosette Formation

Mian Long, Cheng Zhu
Proc. ASME. IMECE97, Advances in Bioengineering, 75-76, November 16–21, 1997
Paper No: IMECE1997-0235
DOI: https://doi.org/10.1115/IMECE1997-0235
View Paper
PDF
Topics: Adhesion, Modeling
Proceedings Papers

Adhesions of the Patellar and Quadriceps Tendons: Mathematical Model Simulations

H. Roglic, S. D. Kwak, J. H. Henry, G. A. Ateshian, W. G. Rodkey, J. R. Steadman, V. C. Mow
Proc. ASME. IMECE97, Advances in Bioengineering, 261-262, November 16–21, 1997
Paper No: IMECE1997-0328
DOI: https://doi.org/10.1115/IMECE1997-0328
View Paper
PDF
Topics: Engineering simulation, Simulation, Tendons, Knee, Adhesion, Surgery, Anterior cruciate ligament, Mechanical admittance, Arthroscopy, Biological tissues
Proceedings Papers

The Role of Mechanical Stimulation on Ligament Fibroblast Gene Expression of Extracellular Matrix and Adhesion Proteins

Adam H. Hsieh, Yan Shi, K.-L. Paul Sung
Proc. ASME. IMECE97, Advances in Bioengineering, 171-172, November 16–21, 1997
Paper No: IMECE1997-0283
DOI: https://doi.org/10.1115/IMECE1997-0283
View Paper
PDF
Topics: Adhesion, Fibroblasts, Proteins, Anterior cruciate ligament, Biological tissues, Wounds
Proceedings Papers

Effect of Thermal Residual Stress on the Measurement of the Adhesion Between Polyimide and Underfill Using an Asymmetric Double Cantilever Beam Specimen

Jinbao Jiao, Charan K. Gurumurthy, Edward J. Kramer, Yan Sha, Chung-Yuen Hui, Peter Børgesen
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 97-102, November 16–21, 1997
Paper No: IMECE1997-0504
DOI: https://doi.org/10.1115/IMECE1997-0504
View Paper
PDF
Topics: Adhesion, Cantilever beams, Stress, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture (Process), Ethers (Class of compounds), Thermal expansion
Proceedings Papers

The Effect of Temperature and Humidity Exposure on Adhesion

R. A. Pearson, R. M. Hydro, T. B. Lloyd, H. F. Nied
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 1-6, November 16–21, 1997
Paper No: IMECE1997-0493
DOI: https://doi.org/10.1115/IMECE1997-0493
View Paper
PDF
Topics: Adhesion, Temperature, Adhesives, Silver, Copper, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture (Process), Cantilever beams
Proceedings Papers

Investigation of Underfill Adhesion in Plastic Flip-Chip Packages

Xiang Dai, Mark V. Brillhart, Paul S. Ho
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 115-124, November 16–21, 1997
Paper No: IMECE1997-0506
DOI: https://doi.org/10.1115/IMECE1997-0506
View Paper
PDF
Topics: Adhesion, Flip-chip packages, Delamination, Failure, Flip-chip, Flip-chip assemblies, Fracture mechanics, Junctions, Manufacturing, Polymers
Proceedings Papers

Interfacial Fracture Toughness in Plastic Packages

L. T. Nguyen, G. Lee, C. Jones, T. R. Hsu, R. Fang, A. Y. Kuo, W. T. Chen
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 15-24, November 16–21, 1997
Paper No: IMECE1997-0495
DOI: https://doi.org/10.1115/IMECE1997-0495
View Paper
PDF
Topics: Fracture toughness, Design, Testing, Adhesion, Coating processes, Coatings, Composite building materials, Copper alloys, Databases, Fracture (Materials)
Proceedings Papers

Comparison of Acoustic Microscope, X-Ray Radiography, Dye Penetrant and Destructive Physical Analysis Data for Die Attachment Analysis

Duane A. Gilmour, James F. Reilly, Donald W. Calabrese
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 175-181, November 16–21, 1997
Paper No: IMECE1997-0514
DOI: https://doi.org/10.1115/IMECE1997-0514
View Paper
PDF
Topics: Acoustics, Microscopes, X-rays, Microscopy, Silicon, Adhesion, Energy dissipation, Testing, Delamination, Density
Proceedings Papers

Adhesion and Reliability of Polymer/Inorganic Interfaces in Microelectronic Applications

J. M. Snodgrass, S.-Y. Kook, A. Kirtikar, R. H. Dauskardt
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 33-39, November 16–21, 1997
Paper No: IMECE1997-0497
DOI: https://doi.org/10.1115/IMECE1997-0497
View Paper
PDF
Topics: Adhesion, Polymers, Reliability, Fracture (Materials), Fracture (Process), Fatigue, Fracture toughness, Cycles, Deformation, Fracture mechanics
Proceedings Papers

The Effect of Underfill Delamination on the Reliability of Flip Chip Modules

Sven Rzepka, Matt A. Korhonen, Ekkehard Meusel, Che-Yu Li
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 73-83, November 16–21, 1997
Paper No: IMECE1997-0502
DOI: https://doi.org/10.1115/IMECE1997-0502
View Paper
PDF
Topics: Delamination, Flip-chip, Flip-chip devices, Reliability, Solders, Tension, Failure, Solder joints, Adhesion, Compressive stress
Proceedings Papers

Characterizing Adhesion of Thermal Barrier Coatings

Vijay Gupta, Allen Yu
Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 399-400, November 16–21, 1997
Paper No: IMECE1997-0691
DOI: https://doi.org/10.1115/IMECE1997-0691
View Paper
PDF
Topics: Adhesion, Thermal barrier coatings, Stress, Coating processes, Coatings, Compressive stress, Lasers, Composite materials, Disks, Displacement
Proceedings Papers

Self-Healing Composites Using Embedded Microspheres

D. Jung, A. Hegeman, N. R. Sottos, P. H. Geubelle, S. R. White
Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 265-275, November 16–21, 1997
Paper No: IMECE1997-0673
DOI: https://doi.org/10.1115/IMECE1997-0673
View Paper
PDF
Topics: Composite materials, Fracture (Materials), Maintenance, Fracture toughness, Polyester fabrics, Adhesion, Cantilever beams, Elastic moduli, Molecular weight, Resins
Proceedings Papers

Effect of Sandblasting on Adhesion Strength of Diamond Coatings

Bi Zhang, Lanying Zhou
Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 279-286, November 16–21, 1997
Paper No: IMECE1997-0674
DOI: https://doi.org/10.1115/IMECE1997-0674
View Paper
PDF
Topics: Adhesion, Diamond films, Diamonds, Coatings, Nucleation (Physics), Atoms, Cutting tools, Density, Failure, Theoretical analysis
Proceedings Papers

Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs

Y. Feng, V. R. Raju, E. Suhir
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 89-139, November 16–21, 1997
Paper No: IMECE1997-0817
DOI: https://doi.org/10.1115/IMECE1997-0817
View Paper
PDF
Topics: Failure, Adhesion, Fracture mechanics, Manufacturing, Mechanical behavior, Microelectronic devices, Modeling, Molding, Reliability, Surfaces (Materials)
Proceedings Papers

Molecular Mechanisms of Monocyte Adhesion to Cytokine Stimulated Endothelial Cells Under Physiological Flow Conditions

Sharad Kukreti, Larry V. McIntire, C. Wayne Smith
Proc. ASME. IMECE97, Advances in Bioengineering, 81-82, November 16–21, 1997
Paper No: IMECE1997-0238
DOI: https://doi.org/10.1115/IMECE1997-0238
View Paper
PDF
Topics: Adhesion, Endothelial cells, Flow (Dynamics), Physiology, Adhesives, Shear stress
Proceedings Papers

Hydrodynamics in Cell Rolling and Adhesion

Yihua Zhao, Richard Skalak, Shu Chien
Proc. ASME. IMECE97, Advances in Bioengineering, 79-80, November 16–21, 1997
Paper No: IMECE1997-0237
DOI: https://doi.org/10.1115/IMECE1997-0237
View Paper
PDF
Topics: Adhesion, Hydrodynamics, Biological cells, Design, Leukocytes
Proceedings Papers

Probabilistic Modeling of Formation and Breakage of Cell Aggregates in a Shear Field

Mian Long, Harry L. Goldsmith, Cheng Zhu
Proc. ASME. IMECE97, Advances in Bioengineering, 77-78, November 16–21, 1997
Paper No: IMECE1997-0236
DOI: https://doi.org/10.1115/IMECE1997-0236
View Paper
PDF
Topics: Modeling, Shear (Mechanics), Adhesion, Adhesives, Erythrocytes, Latex, Probability, Statistics, Steady state, Stress