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Proceedings Papers

Acoustic Emission Detection of Circumferential UV-Mechanical Failure of Glass Epoxy Composites

Yilin Yuan, Gongtian Shen, Fei Xie, Junjiao Zhang, Pengcheng Gan, Yongna Shen, Kuan Su

Proc. ASME. IMECE2022, Volume 1: Acoustics, Vibration, and Phononics, V001T01A017, October 30–November 3, 2022

Paper No: IMECE2022-95365

DOI: https://doi.org/10.1115/IMECE2022-95365

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Topics: Acoustic emissions, Composite materials, Computerized tomography, Epoxy adhesives, Epoxy resins, Failure, Glass, Ultraviolet radiation

Proceedings Papers

Effect of Autoclave Cure Temperature, Pressure, and Time on the Glass Transition Temperature and the Degree of Cure of Epoxy Film Adhesive Joints

Sayed A. Nassar, Shraddha Jagatap, Nitesh Hirulkar

Proc. ASME. IMECE2022, Volume 2A: Advanced Manufacturing, V02AT02A031, October 30–November 3, 2022

Paper No: IMECE2022-94434

DOI: https://doi.org/10.1115/IMECE2022-94434

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Topics: Adhesive joints, Epoxy adhesives, Epoxy resins, Glass transition, Pressure, Temperature, Adhesives, Aluminum, Bond strength, Bonding

Proceedings Papers

Effect of Salt Spray Cyclic Corrosion on the Mechanical and Reversibility Performance of Mixed Material Joints With Modified Adhesive

Matthew Burczyk, Sayed A. Nassar

Proc. ASME. IMECE2022, Volume 2A: Advanced Manufacturing, V02AT02A032, October 30–November 3, 2022

Paper No: IMECE2022-94447

DOI: https://doi.org/10.1115/IMECE2022-94447

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Topics: Adhesives, Corrosion, Sprays, Particulate matter, Aluminum, Carbon, Cycles, Epoxy adhesives, Epoxy resins, Fibers

Proceedings Papers

Evaluation of Graded Recycled Glass/Epoxy Composite

Ahmed H. Hegazy, Mahmoud E. Abd El-Latief, Omar Khalaf, Mostafa Shazly

Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A013, October 30–November 3, 2022

Paper No: IMECE2022-95733

DOI: https://doi.org/10.1115/IMECE2022-95733

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Topics: Bending strength, Composite materials, Epoxy adhesives, Epoxy resins, Fillers (Materials), Fracture toughness, Glass, Glass reinforced plastics, Recycling, Particulate matter

Proceedings Papers

Cellulose Nanofibers (CNF)/Carbon Fiber Composites With Enhanced Flexural Strength for Structural Applications

Siddharth Bhaganagar, Pias Kumar Biswas, Mangilal Agarwal, Hamid Dalir

Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A014, October 30–November 3, 2022

Paper No: IMECE2022-95772

DOI: https://doi.org/10.1115/IMECE2022-95772

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Topics: Bending strength, Carbon fibers, Composite materials, Epoxy adhesives, Epoxy resins, Nanofibers

Proceedings Papers

Development of a Predictive Model and Optimization for the Kerf Properties and Delamination Length in AWJM of Kevlar Epoxy Composite

Puneet Kumar, Sachin Salunkhe, Ragavanantham Shanmugam, Basanta Kumar Bhuyan, Anil Kumar Dahiya, Yuvaraj N.

Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A016, October 30–November 3, 2022

Paper No: IMECE2022-96214

DOI: https://doi.org/10.1115/IMECE2022-96214

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Topics: Composite materials, Delamination, Epoxy adhesives, Epoxy resins, Machining, Optimization, Response surface methodology, Water

Proceedings Papers

Statistical Analysis of Strain Rate Dependency of the Mechanical Properties of Unidirectional CFRE Materials

Charbel Y. Seif, Ilige S. Hage, Re-Mi Hage, Ahmad M. R. Baydoun, Ramsey F. Hamade

Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A008, October 30–November 3, 2022

Paper No: IMECE2022-94402

DOI: https://doi.org/10.1115/IMECE2022-94402

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Topics: Carbon fibers, Epoxy adhesives, Epoxy resins, Laminates, Mechanical properties, Statistical analysis, Composite materials, Density, Stiffness, Bending strength

Proceedings Papers

Investigation on the Impact of Morphology and Arrangement of Graphene Nanoplatelet on Mechanical Behavior of Epoxy Nanocomposites

Olanrewaju Aluko

Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T12A034, October 30–November 3, 2022

Paper No: IMECE2022-94845

DOI: https://doi.org/10.1115/IMECE2022-94845

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Topics: Engineering simulation, Epoxy adhesives, Epoxy resins, Graphene, Mechanical behavior, Micromechanics (Engineering), Nanocomposites, Simulation

Proceedings Papers

Exploring Alternative Methods for Simulating Lightning Mechanical Damage Effects on Carbon/Epoxy Laminates

Juhyeong Lee, Bin Yang, KunKun Fu

Paper No: IMECE2022-88057

DOI: https://doi.org/10.1115/IMECE2022-88057

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Topics: Carbon, Damage, Epoxy adhesives, Epoxy resins, Laminates, Lightning

Proceedings Papers

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties

Anthony J. Rafanelli

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 207-217, November 16–21, 1997

Paper No: IMECE1997-0820

DOI: https://doi.org/10.1115/IMECE1997-0820

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Topics: Epoxy adhesives, Epoxy resins, Fracture toughness, Reliability, Solders, Adhesives, Bonding, Creep, Fatigue, Fracture (Materials)

Proceedings Papers

Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles

M. Uschitsky, E. Suhir

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 141-170, November 16–21, 1997

Paper No: IMECE1997-0818

DOI: https://doi.org/10.1115/IMECE1997-0818

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Topics: Diffusion (Physics), Epoxy adhesives, Epoxy resins, Molding, Particulate matter, Fillers (Materials), Stress, Weight (Mass), Electronic packaging, Indium compounds

Proceedings Papers

Predicted Thermally Induced Stresses in a Glass Fiber Epoxy Bonded Into an Elliptical Enclosure

M. Uschitsky, E. Suhir

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 33-54, November 16–21, 1997

Paper No: IMECE1997-0813

DOI: https://doi.org/10.1115/IMECE1997-0813

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Topics: Epoxy adhesives, Epoxy resins, Glass fibers, Stress, Fibers, Buckling, Delamination, Design, Metals, Optical fiber

Proceedings Papers

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

M. Uschitsky, E. Suhir, G. W. Kammlott

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 171-206, November 16–21, 1997

Paper No: IMECE1997-0819

DOI: https://doi.org/10.1115/IMECE1997-0819

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Topics: Composite materials, Molding, Thermoelasticity, Fillers (Materials), Thermal stresses, Epoxy adhesives, Epoxy resins, Design, Integrated circuits, Reliability

Proceedings Papers

Structural Integrity of Optical Fibers in Connectors

Wilton W. King, Bruce G. LeFevre, A. Guy Hardee

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 261-269, November 16–21, 1997

Paper No: IMECE1997-0825

DOI: https://doi.org/10.1115/IMECE1997-0825

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Topics: Epoxy adhesives, Epoxy resins, Fibers, Finite element analysis, Fracture (Materials), Fracture (Process), Optical fiber, Reliability, Stress analysis (Engineering), Structural analysis

Proceedings Papers

Microgasketing and Room Temperature Wafer Joining for Liquid-Filled MEMS Devices

Jonathan Simon, Long-Sun Huang, Balaji Sridharan, Chang-Jin Kim

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 29-34, November 16–21, 1997

Paper No: IMECE1997-0935

DOI: https://doi.org/10.1115/IMECE1997-0935

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Topics: Joining, Microelectromechanical systems, Semiconductor wafers, Temperature, Adhesives, Low temperature, Reservoirs, Sealing (Process), Epoxy adhesives, Hardening (Curing)

Proceedings Papers

Investigation of the Lead-On-Chip Package’s Reliability

P.-H. Tsao, L. C. Chang, T. C. Chen, Chender Haung, C. Z. Chen

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 347-351, November 16–21, 1997

Paper No: IMECE1997-1109

DOI: https://doi.org/10.1115/IMECE1997-1109

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Topics: Reliability, Epoxy adhesives, Epoxy resins, Silicon chips, Crack propagation, Failure mechanisms, Finite element analysis, Fracture (Materials), Manufacturing, Molding

Proceedings Papers

Energy Absorption and Dissipation Characteristics of Pultruded Glass-Graphite/Epoxy Hybrid Composite Beams

Murthy V. S. L. N. Kowsika, P. Raju Mantena, K. Balasubramaniam

Proc. ASME. IMECE97, Noise Control and Acoustics, 99-116, November 16–21, 1997

Paper No: IMECE1997-1035

DOI: https://doi.org/10.1115/IMECE1997-1035

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Topics: Absorption, Composite building materials, Energy dissipation, Epoxy adhesives, Epoxy resins, Glass, Graphite, Pultrusion, Delamination, Composite materials

Proceedings Papers

The Effect of Toughened Composites on the Static Buckling Load and Buckled Position of Composite Laminated Plates

Hongyu Jia, Craig A. Rogers

Proc. ASME. IMECE97, Noise Control and Acoustics, 139-145, November 16–21, 1997

Paper No: IMECE1997-1038

DOI: https://doi.org/10.1115/IMECE1997-1038

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Topics: Buckling, Composite materials, Plates (structures), Stress, Graphite, Epoxy adhesives, Epoxy resins, Failure analysis, Fibers, Potential energy

Proceedings Papers

Ultrasonic and Acoustic Emission NDE of a Graphite/Epoxy T-Joint

Vinay Dayal

Proc. ASME. IMECE97, Noise Control and Acoustics, 155-160, November 16–21, 1997

Paper No: IMECE1997-1040

DOI: https://doi.org/10.1115/IMECE1997-1040

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Topics: Acoustic emissions, Epoxy adhesives, Epoxy resins, Graphite, Nondestructive evaluation, Buckling, Composite materials, Compression, Delamination

Proceedings Papers

Analysis and Characterization of Ply Lay-Up in Fiber Reinforced Composites Using Ultrasonic Plate Wave Dispersion Curves

Navin S. Rao, Krishnan Balasubramaniam

Proc. ASME. IMECE97, Noise Control and Acoustics, 161-166, November 16–21, 1997

Paper No: IMECE1997-1041

DOI: https://doi.org/10.1115/IMECE1997-1041

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Topics: Dispersion (Optics), Fiber reinforced composites, Leakage, Optimization, Acoustics, Composite materials, Epoxy adhesives, Epoxy resins, Fibers, Fluids

NARROW

Acoustic Emission Detection of Circumferential UV-Mechanical Failure of Glass Epoxy Composites

Effect of Autoclave Cure Temperature, Pressure, and Time on the Glass Transition Temperature and the Degree of Cure of Epoxy Film Adhesive Joints

Effect of Salt Spray Cyclic Corrosion on the Mechanical and Reversibility Performance of Mixed Material Joints With Modified Adhesive

Evaluation of Graded Recycled Glass/Epoxy Composite

Cellulose Nanofibers (CNF)/Carbon Fiber Composites With Enhanced Flexural Strength for Structural Applications

Development of a Predictive Model and Optimization for the Kerf Properties and Delamination Length in AWJM of Kevlar Epoxy Composite

Statistical Analysis of Strain Rate Dependency of the Mechanical Properties of Unidirectional CFRE Materials

Investigation on the Impact of Morphology and Arrangement of Graphene Nanoplatelet on Mechanical Behavior of Epoxy Nanocomposites

Exploring Alternative Methods for Simulating Lightning Mechanical Damage Effects on Carbon/Epoxy Laminates

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties

Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles

Predicted Thermally Induced Stresses in a Glass Fiber Epoxy Bonded Into an Elliptical Enclosure

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

Structural Integrity of Optical Fibers in Connectors

Microgasketing and Room Temperature Wafer Joining for Liquid-Filled MEMS Devices

Investigation of the Lead-On-Chip Package’s Reliability

Energy Absorption and Dissipation Characteristics of Pultruded Glass-Graphite/Epoxy Hybrid Composite Beams

The Effect of Toughened Composites on the Static Buckling Load and Buckled Position of Composite Laminated Plates

Ultrasonic and Acoustic Emission NDE of a Graphite/Epoxy T-Joint

Analysis and Characterization of Ply Lay-Up in Fiber Reinforced Composites Using Ultrasonic Plate Wave Dispersion Curves

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