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Proceedings Papers

Stacking Sequence Effects on the Process-Induced Free-Edge Stresses in Thermoplastic Composite Laminates

Moshe M. Domb, Jorn S. Hansen

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 93-98, November 16–21, 1997

Paper No: IMECE1997-0712

DOI: https://doi.org/10.1115/IMECE1997-0712

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Topics: Laminates, Stress, Thermoplastic composites, Cooling, Cycles, Residual stresses, Annealing, Computer simulation, Design, Fracture (Materials)

Proceedings Papers

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties

Anthony J. Rafanelli

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 207-217, November 16–21, 1997

Paper No: IMECE1997-0820

DOI: https://doi.org/10.1115/IMECE1997-0820

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Topics: Epoxy adhesives, Epoxy resins, Fracture toughness, Reliability, Solders, Adhesives, Bonding, Creep, Fatigue, Fracture (Materials)

Proceedings Papers

Models of Fracture-Matrix Interactions During Multiphase Heat and Mass Flow in Unsaturated Fractured Porous Media

Clifford K. Ho

Proc. ASME. IMECE97, Fluids Engineering, 401-412, November 16–21, 1997

Paper No: IMECE1997-0798

DOI: https://doi.org/10.1115/IMECE1997-0798

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Topics: Flow (Dynamics), Fracture (Materials), Fracture (Process), Heat, Porous materials, Permeability, Electrical conductance, Engineering simulation, Numerical analysis, Simulation

Proceedings Papers

Experimental Observation of Fatigue-Creep Fracture Development in Solder Joints of Different Standoffs

D. R. Liu

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 249-259, November 16–21, 1997

Paper No: IMECE1997-0824

DOI: https://doi.org/10.1115/IMECE1997-0824

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Topics: Creep, Fatigue, Fracture (Materials), Fracture (Process), Solder joints, Temperature, Printed circuit boards, Damage, Melting, Separation (Technology)

Proceedings Papers

Structural Integrity of Optical Fibers in Connectors

Wilton W. King, Bruce G. LeFevre, A. Guy Hardee

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 261-269, November 16–21, 1997

Paper No: IMECE1997-0825

DOI: https://doi.org/10.1115/IMECE1997-0825

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Topics: Epoxy adhesives, Epoxy resins, Fibers, Finite element analysis, Fracture (Materials), Fracture (Process), Optical fiber, Reliability, Stress analysis (Engineering), Structural analysis

Proceedings Papers

A Hybrid Technique for Coupling Chemical Kinetics and Hydrodynamics Computations in Multi-Phase Reacting Flow Systems

S. L. Chang, S. A. Lottes, C. Q. Zhou, M. Petrick

Proc. ASME. IMECE97, Heat Transfer: Volume 2, 149-157, November 16–21, 1997

Paper No: IMECE1997-0877

DOI: https://doi.org/10.1115/IMECE1997-0877

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Topics: Chemical kinetics, Computation, Flow (Dynamics), Hydrodynamics, Flow simulation, Computational fluid dynamics, Pipeline risers, Risers (Casting), Chemical reactions, Combustion chambers

Proceedings Papers

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Prema Palaniappan, Daniel F. Baldwin

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 7-14, November 16–21, 1997

Paper No: IMECE1997-1221

DOI: https://doi.org/10.1115/IMECE1997-1221

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Topics: Density, Electronics, Flip-chip, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture (Process), Glass transition, Manufacturing, Printed circuit boards

Proceedings Papers

Calibrated Fracture Process Zone Models for Polyimide/Metal Blisters

A. Shirani, K. M. Liechti, F. J. Boerio

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 131-133, November 16–21, 1997

Paper No: IMECE1997-1238

DOI: https://doi.org/10.1115/IMECE1997-1238

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Topics: Fracture (Materials), Fracture (Process), Metals, Adhesives, Aluminum, Modeling

Proceedings Papers

Thermo-Mechanical Analysis of Solder-Sealed Electronic Modules During Power Cycling

Raed A. Sherif, David L. Edwards, Michael J. Ellsworth, Jr.

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 7-12, November 16–21, 1997

Paper No: IMECE1997-1209

DOI: https://doi.org/10.1115/IMECE1997-1209

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Topics: Solders, Thermomechanics, Ceramics, Cracking (Materials), Cycles, Design, Energy dissipation, Fatigue life, Finite element methods, Finite element model

Proceedings Papers

Adhesion and Reliability of Polymer/Inorganic Interfaces in Microelectronic Applications

J. M. Snodgrass, S.-Y. Kook, A. Kirtikar, R. H. Dauskardt

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 33-39, November 16–21, 1997

Paper No: IMECE1997-0497

DOI: https://doi.org/10.1115/IMECE1997-0497

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Topics: Adhesion, Polymers, Reliability, Fracture (Materials), Fracture (Process), Fatigue, Fracture toughness, Cycles, Deformation, Fracture mechanics

Proceedings Papers

Free-Edge Stress Intensity Factors for Edge-Loaded Bimaterial Layers

Nathan W. Klingbeil, Jack L. Beuth

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 153-162, November 16–21, 1997

Paper No: IMECE1997-0511

DOI: https://doi.org/10.1115/IMECE1997-0511

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Topics: Stress, Design, Stress singularity, Finite element analysis, Fracture (Materials), Fracture (Process), Pressure, Strips

Proceedings Papers

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

E. Madenci, S. Shkarayev, R. Mahajan

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 61-71, November 16–21, 1997

Paper No: IMECE1997-0501

DOI: https://doi.org/10.1115/IMECE1997-0501

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Topics: Failure, Flip-chip packages, Stress, Design, Electronic packages, Thermomechanics, Adhesive joints, Cracking (Materials), Fillers (Materials), Finite element analysis

Proceedings Papers

Strength and Stability Analyses of Retaining Structure Models for the Fracturing Fluid Characterization Facility

Alfred G. Striz, Keyur Thakore

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 109-117, November 16–21, 1997

Paper No: IMECE1997-0528

DOI: https://doi.org/10.1115/IMECE1997-0528

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Topics: Fluids, Fracture (Process), Stability, Buckling, Pressure, Finite element methods, Plates (structures), Boundary-value problems, Design, Engineering standards

Proceedings Papers

Nondestructive Evaluation of Fiberglass Reinforced Plastic Subjected to Localized Heat Damage, Using Acoustic Emission

H. Nayeb-Hashemi, P. Kisnomo, N. Saniei

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 119-131, November 16–21, 1997

Paper No: IMECE1997-0529

DOI: https://doi.org/10.1115/IMECE1997-0529

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Topics: Acoustic emissions, Damage, Glass reinforced plastics, Heat, Nondestructive evaluation, Lasers, Fibers, Composite materials, Failure, Fracture (Materials)

Proceedings Papers

Scientific Implications in High Peak Power Nd:YAG Laser Material Removal of Al-30%SiC Composite

K. Nagarathnam, X. Chen, J. Mazumder

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 389-398, November 16–21, 1997

Paper No: IMECE1997-0553

DOI: https://doi.org/10.1115/IMECE1997-0553

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Topics: Composite materials, Nd-YAG lasers, Lasers, Drilling, Manufacturing, Q-switching, Wavelength, Aeronautics, Cracking (Materials), Cross section (Physics)

Proceedings Papers

Sustained-Load Cracking in Mill Annealed Ti-6Al-4V at Room Temperature

Youri Lenets, James P. Thomas, Theodore Nicholas

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 315-321, November 16–21, 1997

Paper No: IMECE1997-0547

DOI: https://doi.org/10.1115/IMECE1997-0547

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Topics: Cracking (Materials), Fracture (Process), Stress, Temperature, Fracture (Materials), Diffusion processes, Fatigue, Forging, Fracture mechanics, Hydrogen

Proceedings Papers

Experimental and Numerical Analysis of Ceramics With Microcracking

Gang Yin, Ling Xu, Lin Jiang

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 463-468, November 16–21, 1997

Paper No: IMECE1997-0702

DOI: https://doi.org/10.1115/IMECE1997-0702

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Topics: Ceramics, Numerical analysis, Fracture (Materials), Fracture (Process), Simulation, Damage, Damage mechanics, Finite element analysis, Microcracks, Structures

Proceedings Papers

Stress Redistribution and Notch Sensitivity in Ceramic Matrix Composites (CMCs)

Thomas J. Mackin, Mark C. Roberts, David Anderson

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 357-360, November 16–21, 1997

Paper No: IMECE1997-0683

DOI: https://doi.org/10.1115/IMECE1997-0683

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Topics: Ceramic matrix composites, Stress, Damage, Fibers, Failure, Fracture (Materials), Ceramic composites, Composite materials, Cracking (Materials), Fracture (Process)

Proceedings Papers

Observation and Prediction of Damage Evolution in Continuous Fiber Titanium Matrix Composites

David H. Allen, James W. Foulk, III, Kayleen L. E. Helms

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 109-116, November 16–21, 1997

Paper No: IMECE1997-0655

DOI: https://doi.org/10.1115/IMECE1997-0655

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Topics: Composite materials, Damage, Fibers, Titanium, Embrittlement, Failure, Crack propagation, Cracking (Materials), Fatigue, Fracture (Process)

Proceedings Papers

High Strain Rate Normal Indentation of Ceramics: Implications for Material Removal Mechanisms

Ghatu Subhash, Brian J. Koeppel, Richard J. Anton, Yonggang Y. Huang, Abhijit Chandra

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 417-424, November 16–21, 1997

Paper No: IMECE1997-0695

DOI: https://doi.org/10.1115/IMECE1997-0695

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Topics: Ceramics, Dynamic testing (Materials), Cracking (Materials), Failure, Fracture (Process), Fracture mechanics, Grinding, Stress

2 3 4 5

NARROW

Stacking Sequence Effects on the Process-Induced Free-Edge Stresses in Thermoplastic Composite Laminates

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties

Models of Fracture-Matrix Interactions During Multiphase Heat and Mass Flow in Unsaturated Fractured Porous Media

Experimental Observation of Fatigue-Creep Fracture Development in Solder Joints of Different Standoffs

Structural Integrity of Optical Fibers in Connectors

A Hybrid Technique for Coupling Chemical Kinetics and Hydrodynamics Computations in Multi-Phase Reacting Flow Systems

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Calibrated Fracture Process Zone Models for Polyimide/Metal Blisters

Thermo-Mechanical Analysis of Solder-Sealed Electronic Modules During Power Cycling

Adhesion and Reliability of Polymer/Inorganic Interfaces in Microelectronic Applications

Free-Edge Stress Intensity Factors for Edge-Loaded Bimaterial Layers

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

Strength and Stability Analyses of Retaining Structure Models for the Fracturing Fluid Characterization Facility

Nondestructive Evaluation of Fiberglass Reinforced Plastic Subjected to Localized Heat Damage, Using Acoustic Emission

Scientific Implications in High Peak Power Nd:YAG Laser Material Removal of Al-30%SiC Composite

Sustained-Load Cracking in Mill Annealed Ti-6Al-4V at Room Temperature

Experimental and Numerical Analysis of Ceramics With Microcracking

Stress Redistribution and Notch Sensitivity in Ceramic Matrix Composites (CMCs)

Observation and Prediction of Damage Evolution in Continuous Fiber Titanium Matrix Composites

High Strain Rate Normal Indentation of Ceramics: Implications for Material Removal Mechanisms

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