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Proceedings Papers

Contact Area and Thermal Contact Resistance in an Ideal Bolted Joint: Part 2 — Study of Thermal Contact Resistance

Chang J. Park, Deborah A. Kaminski

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 99-108, November 16–21, 1997

Paper No: IMECE1997-1219

DOI: https://doi.org/10.1115/IMECE1997-1219

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Topics: Bolted joints, Contact resistance, Plates (structures), Boundary-value problems, Copper, Pressure, Cooling, Design, Finishes, Geometry

Proceedings Papers

Characterisation of Open-Cell Aluminum Alloy Foams as Heat Sinks for High Power Electronic Devices

A.-F. Bastawros, A. G. Evans

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 1-6, November 16–21, 1997

Paper No: IMECE1997-1208

DOI: https://doi.org/10.1115/IMECE1997-1208

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Topics: Aluminum alloys, Foams (Chemistry), Heat sinks, Cross-flow, Cylinders, Dimensions, Fluid dynamics, Fluids, Heat transfer coefficients, Pressure drop

Proceedings Papers

The Recommended Geometry for Laminar Microchannel Heat Sinks

Jeffrey J. Lienau

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 47-54, November 16–21, 1997

Paper No: IMECE1997-1213

DOI: https://doi.org/10.1115/IMECE1997-1213

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Topics: Geometry, Heat sinks, Microchannels, Design, Coolants, Cooling, Heat flux, Heat transfer, Integrated circuits, Optical instruments

Proceedings Papers

Natural Convection Heat Sink With Heated Shroud

Andrew T. Morrison, S. M. You

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 83-88, November 16–21, 1997

Paper No: IMECE1997-1217

DOI: https://doi.org/10.1115/IMECE1997-1217

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Topics: Heat sinks, Natural convection, Heat, Stress, Boundary layers, Clearances (Engineering), Heat flux, Heat transfer, Laminar flow, Plates (structures)

Proceedings Papers

The Effect of Thermoelectric Cooler Mounting Orientation on Cooling Efficiency

Thomas E. Welling, Jr., Cheryl A. Bell, Muthar Al-Ubaidi

Proc. ASME. IMECE97, Advanced Energy Systems, 303-310, November 16–21, 1997

Paper No: IMECE1997-1002

DOI: https://doi.org/10.1115/IMECE1997-1002

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Topics: Cooling, Thermoelectric coolers, Heat sinks, Ducts, Cooling systems, System efficiency, Flow (Dynamics), Geometry, Heat exchangers, Heat pumps

Proceedings Papers

Absorption Heat Pump Performance Improvement Through Ground Coupling

Srinivas Garimella

Proc. ASME. IMECE97, Advanced Energy Systems, 327-335, November 16–21, 1997

Paper No: IMECE1997-1005

DOI: https://doi.org/10.1115/IMECE1997-1005

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Topics: Absorption, Heat pumps, Cooling, Heat, Heating, Heating and cooling, Stress, Climate, Combustion, Equilibrium (Physics)

Proceedings Papers

Experimental Investigation of Metallic Fibrous Heat Sinks for External Cooling of an Electronic Package

D. Angirasa, F. Pyrtle, III, G. P. Peterson

Proc. ASME. IMECE97, Heat Transfer: Volume 1, 279-285, November 16–21, 1997

Paper No: IMECE1997-0853

DOI: https://doi.org/10.1115/IMECE1997-0853

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Topics: Cooling, Electronic packages, Heat sinks, Temperature, Aluminum, Computer cooling, Heat, Heat transfer, Porosity, Reynolds number

Proceedings Papers

Heat Spreaders for High-Power Electronics Employing Boiling Mechanisms in a Narrow Space

M. Gao, Y. Cao

Proc. ASME. IMECE98, Advanced Energy Systems, 503-508, November 15–20, 1998

Paper No: IMECE1998-0879

DOI: https://doi.org/10.1115/IMECE1998-0879

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Topics: Boiling, Electronics, Flat heat pipes, Heat transfer, Cooling, Fluids, Heat, Heat flux, Copper, Design

Proceedings Papers

Temperature Effect on Power MOSFET Devices

W. Lu, L. C. Chow, K. B. Sundaram

Proc. ASME. IMECE98, Advanced Energy Systems, 467-473, November 15–20, 1998

Paper No: IMECE1998-0875

DOI: https://doi.org/10.1115/IMECE1998-0875

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Topics: MOSFET transistors, Temperature, Thermal resistance, Junctions, Heat, Operating temperature, Cooling, Circuits, Heat sinks, Low temperature

Proceedings Papers

Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

Sanjeev B. Sathe, Bahgat G. Sammakia

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 747-756, November 15–20, 1998

Paper No: IMECE1998-1089

DOI: https://doi.org/10.1115/IMECE1998-1089

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Topics: Accounting, Adhesives, Ball-Grid-Array packaging, Construction, Convection, Design, Flat heat pipes, Geometry, Heat conduction, Heat sinks

Proceedings Papers

Evaluation of Hydraulic and Thermal Characteristics of Interconnected Parallel Flow Mini Heat Sink

Md Wasi Uddin, Hassan Shahriar Ayon, Tahmid Mohammad Mehrab, Najmus Saquib Sifat

Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A056, November 1–5, 2021

Paper No: IMECE2021-71372

DOI: https://doi.org/10.1115/IMECE2021-71372

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Topics: Flow (Dynamics), Heat sinks

Proceedings Papers

Effect of Pore Size of Copper Foam on Thermal Performance of Bio-Based PCM/Copper Foam Composite

Yahya A. Sheikh, Mohamed Gadalla, Ahmed Azmeer

Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A082, November 1–5, 2021

Paper No: IMECE2021-72299

DOI: https://doi.org/10.1115/IMECE2021-72299

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Topics: Composite materials, Copper, Heat sinks

Proceedings Papers

Parametric Investigation on Thermal and Hydraulic Performance of Minichannel Heatsink

Ozan Atalay, Murat Gultekin, Sertac Cadirci

Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A055, November 1–5, 2021

Paper No: IMECE2021-70472

DOI: https://doi.org/10.1115/IMECE2021-70472

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Topics: Computational fluid dynamics, Heat sinks, Heat transfer, Design, Modeling, Convection, Cooling, Electric vehicles, Electronic components, Energy consumption

Proceedings Papers

Multi-Objective Thermal Optimization of a Nanofluid-Cooled Rectangular Microchannel Heat Sink Using Genetic Algorithm: A Comparative Study

Hamid Fazeli

Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A054, November 1–5, 2021

Paper No: IMECE2021-68217

DOI: https://doi.org/10.1115/IMECE2021-68217

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Topics: Genetic algorithms, Heat sinks, Microchannels, Nanofluids, Optimization, Water, Carbon nanotubes, Nanoparticles, Design, Thermal resistance

Proceedings Papers

Heat Sink Optimization for Collection of Potable Water Using Renewable Energy

Luz A. Amaya, David J. Broderick

Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A064, November 1–5, 2021

Paper No: IMECE2021-71477

DOI: https://doi.org/10.1115/IMECE2021-71477

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Topics: Heat sinks, Optimization, Renewable energy, Water, Thermoelectric cooling, Computational fluid dynamics, Condensation, Design, Natural disasters, Simulation

Proceedings Papers

Analytical Modeling of Forced Convection in Slotted Plate Fin Heat Sinks

P. Teertstra, J. R. Culham, M. M. Yovanovich

Proc. ASME. IMECE99, Heat Transfer: Volume 1, 3-11, November 14–19, 1999

Paper No: IMECE1999-0964

DOI: https://doi.org/10.1115/IMECE1999-0964

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Topics: Forced convection, Heat sinks, Modeling, Heat transfer, Convection, Reynolds number

Proceedings Papers

An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool

Tien-Yu Tom Lee

Proc. ASME. IMECE99, Heat Transfer: Volume 1, 21-28, November 14–19, 1999

Paper No: IMECE1999-0966

DOI: https://doi.org/10.1115/IMECE1999-0966

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Topics: Ball-Grid-Array packages, Computational fluid dynamics, Flip-chip, Flip-chip devices, Flat heat pipes, Heat sinks, Heat transfer, Aluminum, Copper, Flip-chip packages

Proceedings Papers

Analysis of Conjugate Heat Transfer in a Three-Dimensional Microchannel Heat Sink for Cooling of Electronic Components

Andrei G. Fedorov, Raymond Viskanta

Proc. ASME. IMECE99, Heat Transfer: Volume 3, 89-98, November 14–19, 1999

Paper No: IMECE1999-1066

DOI: https://doi.org/10.1115/IMECE1999-1066

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Topics: Cooling, Electronic components, Heat sinks, Heat transfer, Microchannels, Fluids, Design, Electronic packaging, Energy conservation, Flow (Dynamics)

Proceedings Papers

Instability of Flame Spread in Microgravity

Lisa M. Oravecz, Indrek S. Wichman, Sandra L. Olson

Proc. ASME. IMECE99, Heat Transfer: Volume 4, 183-187, November 14–19, 1999

Paper No: IMECE1999-1118

DOI: https://doi.org/10.1115/IMECE1999-1118

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Topics: Flames, NASA, Buoyancy, Heat sinks

Proceedings Papers

Precise Design and Analysis of Wet Layup Composite Repairs

Greg Kress

Proc. ASME. IMECE99, Advances in Aerospace Materials and Structures, 185, November 14–19, 1999

Paper No: IMECE1999-0151

DOI: https://doi.org/10.1115/IMECE1999-0151

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Topics: Composite materials, Design, Maintenance, Aircraft, Engineers, Heat sinks, Stress

2 3 4 5

NARROW

Contact Area and Thermal Contact Resistance in an Ideal Bolted Joint: Part 2 — Study of Thermal Contact Resistance

Characterisation of Open-Cell Aluminum Alloy Foams as Heat Sinks for High Power Electronic Devices

The Recommended Geometry for Laminar Microchannel Heat Sinks

Natural Convection Heat Sink With Heated Shroud

The Effect of Thermoelectric Cooler Mounting Orientation on Cooling Efficiency

Absorption Heat Pump Performance Improvement Through Ground Coupling

Experimental Investigation of Metallic Fibrous Heat Sinks for External Cooling of an Electronic Package

Heat Spreaders for High-Power Electronics Employing Boiling Mechanisms in a Narrow Space

Temperature Effect on Power MOSFET Devices

Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

Evaluation of Hydraulic and Thermal Characteristics of Interconnected Parallel Flow Mini Heat Sink

Effect of Pore Size of Copper Foam on Thermal Performance of Bio-Based PCM/Copper Foam Composite

Parametric Investigation on Thermal and Hydraulic Performance of Minichannel Heatsink

Multi-Objective Thermal Optimization of a Nanofluid-Cooled Rectangular Microchannel Heat Sink Using Genetic Algorithm: A Comparative Study

Heat Sink Optimization for Collection of Potable Water Using Renewable Energy

Analytical Modeling of Forced Convection in Slotted Plate Fin Heat Sinks

An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool

Analysis of Conjugate Heat Transfer in a Three-Dimensional Microchannel Heat Sink for Cooling of Electronic Components

Instability of Flame Spread in Microgravity

Precise Design and Analysis of Wet Layup Composite Repairs

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