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Proceedings Papers

2D Simulation of the Placement of a Pin-Through-Hole Component and Solder Paste Melting

Nelson Rodrigues, Inês Teixeira, Violeta Carvalho, Duarte Santos, Joao Velosa, Ana Ferreira, Delfim Soares, José Teixeira, Senhorinha Teixeira

Proc. ASME. IMECE2022, Volume 2B: Advanced Manufacturing, V02BT02A008, October 30–November 3, 2022

Paper No: IMECE2022-95960

DOI: https://doi.org/10.1115/IMECE2022-95960

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Topics: Melting, Printing, Simulation, Solders

Proceedings Papers

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties

Anthony J. Rafanelli

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 207-217, November 16–21, 1997

Paper No: IMECE1997-0820

DOI: https://doi.org/10.1115/IMECE1997-0820

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Topics: Epoxy adhesives, Epoxy resins, Fracture toughness, Reliability, Solders, Adhesives, Bonding, Creep, Fatigue, Fracture (Materials)

Proceedings Papers

Improving the Snap-Off Process in Solder Paste Stencil Printing via the Enhancement of Wall Slip

Toshinori Mimura, Sheng Liu, Haruhiko Asada

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 219-225, November 16–21, 1997

Paper No: IMECE1997-0821

DOI: https://doi.org/10.1115/IMECE1997-0821

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Topics: Printing, Solders, Flow (Dynamics), Printed circuit boards, Temperature, Visualization

Proceedings Papers

A Study on Reliability of Pb40/Sn60 Solder Joints Under Dynamic Loading

Cemal Basaran, Rumpa Chandaroy

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 227-242, November 16–21, 1997

Paper No: IMECE1997-0822

DOI: https://doi.org/10.1115/IMECE1997-0822

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Topics: Dynamic testing (Materials), Reliability, Solder joints, Dynamic analysis, Failure mechanisms, Solders, Constitutive equations, Cycles, Defense industry, Failure

Proceedings Papers

Comparison of Different Solder Systems Based on Propensity for Damage

Vijay Sarihan

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 243-248, November 16–21, 1997

Paper No: IMECE1997-0823

DOI: https://doi.org/10.1115/IMECE1997-0823

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Topics: Damage, Solders, Stress, Temperature, Cycles, Fatigue, Fatigue life, Finite element methods, Alloys, Eutectic alloys

Proceedings Papers

Experimental Observation of Fatigue-Creep Fracture Development in Solder Joints of Different Standoffs

D. R. Liu

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 249-259, November 16–21, 1997

Paper No: IMECE1997-0824

DOI: https://doi.org/10.1115/IMECE1997-0824

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Topics: Creep, Fatigue, Fracture (Materials), Fracture (Process), Solder joints, Temperature, Printed circuit boards, Damage, Melting, Separation (Technology)

Proceedings Papers

Sequential Processing Mechanics Modeling for a Model IC Package

Jianjun Wang, Sheng Liu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 401-410, November 16–21, 1997

Paper No: IMECE1997-1117

DOI: https://doi.org/10.1115/IMECE1997-1117

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Topics: Modeling, Stress, Manufacturing, Solders, Temperature, Finite element analysis, Finite element methods, Finite element model, Silicon chips, Bonding

Proceedings Papers

Prediction of the Solder Joint Configuration Under Various Geometric Parameters

Wei-Long Chen, Bor-Lin Shyu, Kuo-Ning Chiang

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 397-400, November 16–21, 1997

Paper No: IMECE1997-1116

DOI: https://doi.org/10.1115/IMECE1997-1116

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Topics: Solder joints, Shapes, Electronic packaging, Energy conservation, Gravity (Force), Numerical analysis, Shape design, Solders, Surface tension, Weight (Mass)

Proceedings Papers

CBGA Solder Fillet Shape Prediction and Design Optimization

Y. Li, R. L. Mahajan

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 431-438, November 16–21, 1997

Paper No: IMECE1997-1120

DOI: https://doi.org/10.1115/IMECE1997-1120

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Topics: Design, Optimization, Shapes, Solders, Mathematical analysis, Reliability, Ball-Grid-Array packaging, Ceramics, Composite materials, Experimental design

Proceedings Papers

Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow

Xiaohua Wu, Xinyu Dou, Chao-pin Yeh, Karl Waytt

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 391-395, November 16–21, 1997

Paper No: IMECE1997-1115

DOI: https://doi.org/10.1115/IMECE1997-1115

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Topics: Simulation, Solder joints, Geometry, Solders, Engineering simulation, Failure, Reliability, Wetting, Alloys, Computer simulation

Proceedings Papers

Measurement of Solder-Copper Interfacial Fracture Parameters Using u 2 -Displacement Fields

H. V. Tippur, H. Krishnamoorthy

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 77-84, November 16–21, 1997

Paper No: IMECE1997-1230

DOI: https://doi.org/10.1115/IMECE1997-1230

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Topics: Copper, Displacement, Fracture (Materials), Solders, Deformation, Fracture toughness, Interferometry, Strain gages

Proceedings Papers

Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry

Daqing Zou, Xiaoyuan He, Sheng Liu, Yifan Guo, Fulong Dai

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 69-76, November 16–21, 1997

Paper No: IMECE1997-1229

DOI: https://doi.org/10.1115/IMECE1997-1229

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Topics: Corners (Structural elements), Deformation, Interferometry, Computer software, Electronic packaging, Failure, Flip-chip, Flip-chip packages, Image processing, Nanoscale phenomena

Proceedings Papers

The MicroDAC Method: A Powerful Means for Microdeformation Analysis in Electronic Packaging

Bernd Michel, Dietmar Vogel, Andreas Schubert, Jürgen Auersperg, Herbert Reichl

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 117-123, November 16–21, 1997

Paper No: IMECE1997-1236

DOI: https://doi.org/10.1115/IMECE1997-1236

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Topics: Algorithms, Computers, Displacement, Displacement measurement, Electron microscopy, Electronic packaging, Engineering simulation, Failure, Finite element analysis, Flip-chip assemblies

Proceedings Papers

Thermal Mechanical Properties of Two Solder Alloys

Wei Ren, Zhengfang Qian, Minfu Lu, Sheng Liu, Dongkai Shangguan

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 125-130, November 16–21, 1997

Paper No: IMECE1997-1237

DOI: https://doi.org/10.1115/IMECE1997-1237

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Topics: Alloys, Mechanical properties, Solders, Fatigue, Lead-free solders, Computers, Creep, Electronic packaging, Strips, Testing

Proceedings Papers

Thermo-Mechanical Analysis of Solder-Sealed Electronic Modules During Power Cycling

Raed A. Sherif, David L. Edwards, Michael J. Ellsworth, Jr.

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 7-12, November 16–21, 1997

Paper No: IMECE1997-1209

DOI: https://doi.org/10.1115/IMECE1997-1209

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Topics: Solders, Thermomechanics, Ceramics, Cracking (Materials), Cycles, Design, Energy dissipation, Fatigue life, Finite element methods, Finite element model

Proceedings Papers

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

Carole A. Le Gall, Jianmin Qu, David L. McDowell

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 85-95, November 16–21, 1997

Paper No: IMECE1997-0503

DOI: https://doi.org/10.1115/IMECE1997-0503

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Topics: Flip-chip, Flip-chip devices, Reliability, Thermomechanics, Stress, Creep, Dimensions, Elasticity, Flip-chip assemblies, Geometry

Proceedings Papers

Shearing Deformation in Partial Areal Arrays: Analytical Results

S. M. Heinrich, S. Shakya, P. S. Lee

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 51-59, November 16–21, 1997

Paper No: IMECE1997-0500

DOI: https://doi.org/10.1115/IMECE1997-0500

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Topics: Boundary-value problems, Corners (Structural elements), Die cutting, Dimensions, Displacement, Elasticity, Fatigue life, Finite element analysis, Finite element model, Geometry

Proceedings Papers

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

William T. Chen, David Questad, David Read, Bahgat Sammakia

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 183-192, November 16–21, 1997

Paper No: IMECE1997-0515

DOI: https://doi.org/10.1115/IMECE1997-0515

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Topics: Fracture mechanics, Microelectronic packaging, Packaging, Ball-Grid-Array packaging, Electronic packaging, Design, Electronic packages, Electronic products, Low temperature, Manufacturing

Proceedings Papers

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Jürgen Auersperg, Andreas Schubert, Dietmar Vogel, Bernd Michel, Herbert Reichl

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 133-138, November 16–21, 1997

Paper No: IMECE1997-0508

DOI: https://doi.org/10.1115/IMECE1997-0508

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Topics: Damage, Finite element analysis, Flip-chip assemblies, Fracture (Materials), Fracture (Process), Solders, Reliability, Simulation, Thermomechanics, Delamination

Proceedings Papers

The Effect of Underfill Delamination on the Reliability of Flip Chip Modules

Sven Rzepka, Matt A. Korhonen, Ekkehard Meusel, Che-Yu Li

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 73-83, November 16–21, 1997

Paper No: IMECE1997-0502

DOI: https://doi.org/10.1115/IMECE1997-0502

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Topics: Delamination, Flip-chip, Flip-chip devices, Reliability, Solders, Tension, Failure, Solder joints, Adhesion, Compressive stress

2 3 4 5

NARROW

2D Simulation of the Placement of a Pin-Through-Hole Component and Solder Paste Melting

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties

Improving the Snap-Off Process in Solder Paste Stencil Printing via the Enhancement of Wall Slip

A Study on Reliability of Pb40/Sn60 Solder Joints Under Dynamic Loading

Comparison of Different Solder Systems Based on Propensity for Damage

Experimental Observation of Fatigue-Creep Fracture Development in Solder Joints of Different Standoffs

Sequential Processing Mechanics Modeling for a Model IC Package

Prediction of the Solder Joint Configuration Under Various Geometric Parameters

CBGA Solder Fillet Shape Prediction and Design Optimization

Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow

Measurement of Solder-Copper Interfacial Fracture Parameters Using u 2 -Displacement Fields

Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry

The MicroDAC Method: A Powerful Means for Microdeformation Analysis in Electronic Packaging

Thermal Mechanical Properties of Two Solder Alloys

Thermo-Mechanical Analysis of Solder-Sealed Electronic Modules During Power Cycling

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

Shearing Deformation in Partial Areal Arrays: Analytical Results

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

The Effect of Underfill Delamination on the Reliability of Flip Chip Modules

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