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Proceedings Papers

Thermomechanical Response of Laminated Flat Panels Featuring Interlaminar Bonding Imperfections

U. Icardi, L. Librescu, M. Di Sciuva

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 197-214, November 16–21, 1997

Paper No: IMECE1997-0723

DOI: https://doi.org/10.1115/IMECE1997-0723

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Topics: Bonding, Thermomechanics, Composite materials, Anisotropy, Stress, Temperature

Proceedings Papers

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Prema Palaniappan, Daniel F. Baldwin

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 7-14, November 16–21, 1997

Paper No: IMECE1997-1221

DOI: https://doi.org/10.1115/IMECE1997-1221

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Topics: Density, Electronics, Flip-chip, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture (Process), Glass transition, Manufacturing, Printed circuit boards

Proceedings Papers

Ultrasonic Time-Frequency Characterization of Silicon Wafers at Elevated Temperatures

C. Steve Suh, G. Andrew Rabroker, Christian P. Burger, Ravinder Chona

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 37-43, November 16–21, 1997

Paper No: IMECE1997-1225

DOI: https://doi.org/10.1115/IMECE1997-1225

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Topics: Semiconductor wafers, Temperature, Waves, Acoustics, Fibers, Interferometers, Mechanical properties, Nondestructive evaluation, Splines, Thermomechanics

Proceedings Papers

Testing and Constitutive Modeling of Thin Polymer Films and Underfills by a 6-Axis Submicron Tester

Zhengfang Qian, Minfu Lu, Jianjun Wang, Sheng Liu

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 105-112, November 16–21, 1997

Paper No: IMECE1997-1234

DOI: https://doi.org/10.1115/IMECE1997-1234

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Topics: Modeling, Polymer films, Testing, Thermomechanics, Nylon film

Proceedings Papers

Driving PWA Thermomechanical Analysis From Step AP210 Product Models

Diego R. Tamburini, Russell S. Peak, Robert E. Fulton

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 33-45, November 16–21, 1997

Paper No: IMECE1997-1212

DOI: https://doi.org/10.1115/IMECE1997-1212

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Topics: Thermomechanics, Design, Arches, Computer programming, Electrical wires, Geometry, Manufacturing, Mentoring, Product design, Thrust

Proceedings Papers

Thermo-Mechanical Analysis of Solder-Sealed Electronic Modules During Power Cycling

Raed A. Sherif, David L. Edwards, Michael J. Ellsworth, Jr.

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 7-12, November 16–21, 1997

Paper No: IMECE1997-1209

DOI: https://doi.org/10.1115/IMECE1997-1209

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Topics: Solders, Thermomechanics, Ceramics, Cracking (Materials), Cycles, Design, Energy dissipation, Fatigue life, Finite element methods, Finite element model

Proceedings Papers

Improving Electronic Packaging Manufacturing Through Product and Process-Driven Analysis: A PWB Case Study

Andrew J. Scholand, Russell S. Peak, Robert E. Fulton

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 23-31, November 16–21, 1997

Paper No: IMECE1997-1211

DOI: https://doi.org/10.1115/IMECE1997-1211

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Topics: Electronic packaging, Manufacturing, Printed circuit boards, Product quality, Warping, Ovens, Economics , Materials properties, Temperature, Thermomechanics

Proceedings Papers

An Explicit Finite Element Study of Shear Localization During Orthogonal Cutting Process

De-Shin Liu Scott, Jack Hong

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 245-252, November 16–21, 1997

Paper No: IMECE1997-0540

DOI: https://doi.org/10.1115/IMECE1997-0540

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Topics: Cutting, Finite element analysis, Shear (Mechanics), Computer simulation, Deformation, Metal cutting, Temperature, Thermomechanics, Three-dimensional models

Proceedings Papers

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

E. Madenci, S. Shkarayev, R. Mahajan

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 61-71, November 16–21, 1997

Paper No: IMECE1997-0501

DOI: https://doi.org/10.1115/IMECE1997-0501

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Topics: Failure, Flip-chip packages, Stress, Design, Electronic packages, Thermomechanics, Adhesive joints, Cracking (Materials), Fillers (Materials), Finite element analysis

Proceedings Papers

The Effect of Thermomechanical Strain Cycling on the Fatigue Life of Gas Turbine Material In-738LC: A Life Prediction Model

Sam Y. Zamrik, Mark L. Renauld

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 333-345, November 16–21, 1997

Paper No: IMECE1997-0549

DOI: https://doi.org/10.1115/IMECE1997-0549

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Topics: Fatigue life, Gas turbines, Thermomechanics, Cycles, Temperature, Creep, Fatigue, Nickel, Superalloys

Proceedings Papers

Large Deflection FEM Analysis of Thermally Loaded, Stiffened, Shear Deformable Plates

Erasmo Carrera, Liviu Librescu

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 141-154, November 16–21, 1997

Paper No: IMECE1997-0531

DOI: https://doi.org/10.1115/IMECE1997-0531

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Topics: Deflection, Finite element methods, Finite element model, Plates (structures), Shear (Mechanics), Accounting, Algebra, Approximation, Finite element analysis, Newton's method

Proceedings Papers

The Fiber/Matrix Interface in Ceramic-Matrix Composites

Y. Zhang, N. Yu

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 375-377, November 16–21, 1997

Paper No: IMECE1997-0687

DOI: https://doi.org/10.1115/IMECE1997-0687

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Topics: Ceramics, Composite materials, Fibers, Ceramic matrix composites, Absorption, Failure, Thermomechanics

Proceedings Papers

Green’s Function Approach to the Analysis of Functionally Graded Materials

Seiichi Nomura, Donna M. Sheahen

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 19-23, November 16–21, 1997

Paper No: IMECE1997-0647

DOI: https://doi.org/10.1115/IMECE1997-0647

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Topics: Functionally graded materials, Algebra, Boundary-value problems, Computers, Eigenfunctions, Temperature, Thermomechanics

Proceedings Papers

Statical and Vibrational Behavior of Orthogonally Reinforced Flat Panels Exposed to Thermomechanical Loading

M. A. Souza, L. Librescu

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 107-117, November 16–21, 1997

Paper No: IMECE1997-0714

DOI: https://doi.org/10.1115/IMECE1997-0714

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Topics: Thermomechanics

Proceedings Papers

Singular Solutions of Multi-Material Wedges Under Thermomechanical Loading

Wan-Lee Yin, Kuo-chang Jane, Chien-Chang Lin

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 159-166, November 16–21, 1997

Paper No: IMECE1997-0718

DOI: https://doi.org/10.1115/IMECE1997-0718

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Topics: Thermomechanics, Wedges, Stress, Elasticity, Adhesive joints, Composite materials, Failure, Fracture (Materials), Skin, Temperature

Proceedings Papers

A Thermomechanical Model of Machine Tool Spindles for Use in the Design of Reconfigurable Angular Contact Spindle Bearing Load Control Systems

Alex O. Gibson, Jeffrey L. Stein, Jay F. Tu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 23-30, November 16–21, 1997

Paper No: IMECE1997-1071

DOI: https://doi.org/10.1115/IMECE1997-1071

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Topics: Bearings, Control systems, Design, Machine tool spindles, Stress, Thermomechanics, Roller bearings, Thermal expansion, Centrifugal force, Deflection

Proceedings Papers

Analysis and Evaluation of Malfunctions in Thermomechanical Systems

Javier Royo, Alejandro Zaleta, Antonio Valero

Proc. ASME. IMECE97, Advanced Energy Systems, 103-108, November 16–21, 1997

Paper No: IMECE1997-0979

DOI: https://doi.org/10.1115/IMECE1997-0979

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Topics: Cycles, Economic analysis, Energy dissipation, Gates (Closures), High pressure (Physics), Maintenance, Power stations, Simulation, Steam turbines, Temperature

Proceedings Papers

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

Carole A. Le Gall, Jianmin Qu, David L. McDowell

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 85-95, November 16–21, 1997

Paper No: IMECE1997-0503

DOI: https://doi.org/10.1115/IMECE1997-0503

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Topics: Flip-chip, Flip-chip devices, Reliability, Thermomechanics, Stress, Creep, Dimensions, Elasticity, Flip-chip assemblies, Geometry

Proceedings Papers

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Jürgen Auersperg, Andreas Schubert, Dietmar Vogel, Bernd Michel, Herbert Reichl

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 133-138, November 16–21, 1997

Paper No: IMECE1997-0508

DOI: https://doi.org/10.1115/IMECE1997-0508

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Topics: Damage, Finite element analysis, Flip-chip assemblies, Fracture (Materials), Fracture (Process), Solders, Reliability, Simulation, Thermomechanics, Delamination

Proceedings Papers

First Discrete Time Full-System Inertial Microsensor Performance Simulation Tool

Michael D. Pottenger, William J. Kaiser

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 519-524, November 15–20, 1998

Paper No: IMECE1998-1294

DOI: https://doi.org/10.1115/IMECE1998-1294

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Topics: Microsensors, Simulation, Resonance, Noise (Sound), Sensors, Bridges (Structures), Circuits, Complementary metal oxide semiconductors, Dynamics (Mechanics), Feedback

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NARROW

Thermomechanical Response of Laminated Flat Panels Featuring Interlaminar Bonding Imperfections

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Ultrasonic Time-Frequency Characterization of Silicon Wafers at Elevated Temperatures

Testing and Constitutive Modeling of Thin Polymer Films and Underfills by a 6-Axis Submicron Tester

Driving PWA Thermomechanical Analysis From Step AP210 Product Models

Thermo-Mechanical Analysis of Solder-Sealed Electronic Modules During Power Cycling

Improving Electronic Packaging Manufacturing Through Product and Process-Driven Analysis: A PWB Case Study

An Explicit Finite Element Study of Shear Localization During Orthogonal Cutting Process

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

The Effect of Thermomechanical Strain Cycling on the Fatigue Life of Gas Turbine Material In-738LC: A Life Prediction Model

Large Deflection FEM Analysis of Thermally Loaded, Stiffened, Shear Deformable Plates

The Fiber/Matrix Interface in Ceramic-Matrix Composites

Green’s Function Approach to the Analysis of Functionally Graded Materials

Statical and Vibrational Behavior of Orthogonally Reinforced Flat Panels Exposed to Thermomechanical Loading

Singular Solutions of Multi-Material Wedges Under Thermomechanical Loading

A Thermomechanical Model of Machine Tool Spindles for Use in the Design of Reconfigurable Angular Contact Spindle Bearing Load Control Systems

Analysis and Evaluation of Malfunctions in Thermomechanical Systems

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

First Discrete Time Full-System Inertial Microsensor Performance Simulation Tool

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