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Proceedings Papers

Thermal Mechanical Properties of Two Solder Alloys

Wei Ren, Zhengfang Qian, Minfu Lu, Sheng Liu, Dongkai Shangguan
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 125-130, November 16–21, 1997
Paper No: IMECE1997-1237
DOI: https://doi.org/10.1115/IMECE1997-1237
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Topics: Alloys, Mechanical properties, Solders, Fatigue, Lead-free solders, Computers, Creep, Electronic packaging, Strips, Testing
Proceedings Papers

Prediction of Phase Segregation During Mold Filling of Semi-Solid Slurries

Mahmut D. Mat, Olusegun J. Ilegbusi
Proc. ASME. IMECE99, The Science, Automation, and Control of Material Processes Involving Coupled Transport and Rheology Changes, 79-88, November 14–19, 1999
Paper No: IMECE1999-1257
DOI: https://doi.org/10.1115/IMECE1999-1257
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Topics: Slurries, Geometry, Heat transfer, Particulate matter, Non-Newtonian fluids, Numerical analysis, Tin
Proceedings Papers

Creep Behavior of PB-Free Solders

F. Hua, C. M. Garner, H. G. Song, J. W. Morris
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 219-229, November 11–16, 2001
Paper No: IMECE2001/EPP-24728
DOI: https://doi.org/10.1115/IMECE2001/EPP-24728
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Topics: Creep, Lead-free solders, Tin, Cooling, Solder joints, Stress, Diffusion (Physics), Solders, Furnaces, Intermetallic compounds
Proceedings Papers

Novel Resistive Point Heater for MEMS Remote Solder Self-Assembly

Paul E. Kladitis, Victor M. Bright
Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 161-167, November 5–10, 2000
Paper No: IMECE2000-1087
DOI: https://doi.org/10.1115/IMECE2000-1087
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Topics: Microelectromechanical systems, Self-assembly, Solders, Drops, Nitrogen, Vapors, Manufacturing, Ceramics, Crystals, Design
Proceedings Papers

Constitutive Modeling of Multiaxial Deformation and Induced Anisotropy in Superplastic Materials

Marwan K. Khraisheh
Proc. ASME. IMECE2000, Recent Trends in Constitutive Modeling of Advanced Materials, 79-94, November 5–10, 2000
Paper No: IMECE2000-1196
DOI: https://doi.org/10.1115/IMECE2000-1196
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Topics: Anisotropy, Deformation, Modeling, Superplasticity, Particle spin, Rotation, Spin (Aerodynamics), Alloys, Stress, Tin
Proceedings Papers

Durability Properties Characterization of Sn62Pb36Ag2 Solder Alloy

Peter Haswell, Abhijit Dasgupta
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 181-187, November 5–10, 2000
Paper No: IMECE2000-2261
DOI: https://doi.org/10.1115/IMECE2000-2261
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Topics: Alloys, Durability, Solders, Damage, Failure, Cycles, Displacement, Shear (Mechanics), Temperature, Tin
Proceedings Papers

Micro-Mechanics of Creep-Fatigue Damage in Pb-Sn Solder Due to Thermal Cycling

Pradeep Sharma, Abhijit Dasgupta
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 173-179, November 5–10, 2000
Paper No: IMECE2000-2260
DOI: https://doi.org/10.1115/IMECE2000-2260
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Topics: Creep, Damage, Fatigue, Micromechanics (Engineering), Solders, Tin, Stress, Aeroelasticity, Damage mechanics, Fatigue damage
Proceedings Papers

Atomistic Investigation on Mechanical Properties of Sn-Ag-Cu Based Nanocrystalline Solder Material

Mohammad Motalab, Rafsan A. S. I. Subad, Ayesha Ahmed, Pritom Bose, Ratul Paul, Jeffrey C. Suhling
Proc. ASME. IMECE2019, Volume 12: Advanced Materials: Design, Processing, Characterization, and Applications, V012T10A035, November 11–14, 2019
Paper No: IMECE2019-12109
DOI: https://doi.org/10.1115/IMECE2019-12109
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Topics: Mechanical properties, Solders, Tin, Tensile strength, Simulation, Temperature, Atoms, Crystals, Ductility, Electrical components
Proceedings Papers

Flexible Strain Sensor Using Additive Manufacturing and Conductive Liquid Metal: Design, Fabrication, and Characterization

Austin Smith, Hamzeh Bardaweel
Proc. ASME. IMECE2018, Volume 2: Advanced Manufacturing, V002T02A066, November 9–15, 2018
Paper No: IMECE2018-88753
DOI: https://doi.org/10.1115/IMECE2018-88753
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Topics: Additive manufacturing, Design, Liquid metals, Manufacturing, Strain sensors, Sensors, Deformation, Dimensions, Electrical resistance, Elongation
Proceedings Papers

Creep Behavior of a Solder Paste With Bi Addition

Pedro E. Ribeiro, Delfim F. Soares, Maria F. Cerqueira, Senhorinha F. Teixeira, Daniel A. Barros, José C. Teixeira
Proc. ASME. IMECE2017, Volume 14: Emerging Technologies; Materials: Genetics to Structures; Safety Engineering and Risk Analysis, V014T11A020, November 3–9, 2017
Paper No: IMECE2017-71532
DOI: https://doi.org/10.1115/IMECE2017-71532
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Topics: Creep, Solders, Solder joints, Temperature, Cycles, Fatigue life, Stress, Copper, Damage, Failure mechanisms
Proceedings Papers

Study on Bonding and Shear Flow Phenomena of Shear Probe Test for BGA Solder Joint in Nano-Scale Analysis

Bao-Hsin Liu, Yu-Liang Chen, Quang-Cherng Hsu
Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A022, November 11–17, 2016
Paper No: IMECE2016-66773
DOI: https://doi.org/10.1115/IMECE2016-66773
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Topics: Ball-Grid-Array packaging, Bonding, Nanoscale phenomena, Probes, Shear (Mechanics), Shear flow, Solder joints, Tin, Atoms, Crystal structure
Proceedings Papers

Applicability of Heat Mirrors in Reducing Thermal Losses in Concentrating Solar Collectors

Prashant Mahendra, Vikrant Khullar, Madhup Mittal
Proc. ASME. IMECE2016, Volume 6B: Energy, V06BT08A052, November 11–17, 2016
Paper No: IMECE2016-66565
DOI: https://doi.org/10.1115/IMECE2016-66565
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Topics: Heat, Mirrors, Solar collectors, Parabolic troughs, Solar energy, Solar radiation, Glass, Heat transfer, Thermal efficiency, Tin
Proceedings Papers

Solar Selective Volumetric Receivers for Harnessing Solar Thermal Energy

Vikrant Khullar, Himanshu Tyagi, Todd P. Otanicar, Yasitha L. Hewakuruppu, Robert A. Taylor
Proc. ASME. IMECE2016, Volume 6B: Energy, V06BT08A053, November 11–17, 2016
Paper No: IMECE2016-66599
DOI: https://doi.org/10.1115/IMECE2016-66599
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Topics: Solar energy, Solar thermal power, Absorption, Cermets, Thermal efficiency, Borosilicate glasses, Emissions, Heat, Mirrors, Nanoparticles
Proceedings Papers

Anisotropic Behavior of Single Grain Cu 6 Sn 5 Intermetallic

Soud Farhan Choudhury, Leila Ladani
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A056, November 14–20, 2014
Paper No: IMECE2014-40196
DOI: https://doi.org/10.1115/IMECE2014-40196
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Topics: Anisotropy, Intermetallic compounds, Tin, Solder joints, Bonding, Crystals, Electron backscatter diffraction, Grain size, Nanoindentation, Reliability
Proceedings Papers

Inhibiting the Re-Deposition of AuSn 4 on Au/Ni Metallization Pads by Varying the Accessibility of Cu in Isothermally Aged SAC305 Solder Joints

Subhasis Mukherjee, Abhijit Dasgupta, Julie Silk, Lay-ling Ong
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A057, November 15–21, 2013
Paper No: IMECE2013-66803
DOI: https://doi.org/10.1115/IMECE2013-66803
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Topics: Solder joints, Copper, Tin, Annealing, Intermetallic compounds, Nickel, Brittleness, Finishes, Plating, Printed circuit boards
Proceedings Papers

Inverse Derivation of Constants for the Constitutive Equation and Fatigue Model of Pb-Free Solder Joints Based on Experiment Results, Finite Element Simulation and Virtual Optimization Methodology

Weidong Xie, Mudasir Ahmad
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 1011-1021, November 9–15, 2012
Paper No: IMECE2012-87734
DOI: https://doi.org/10.1115/IMECE2012-87734
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Topics: Fatigue, Finite element analysis, Lead-free solders, Optimization, Simulation, Solders, Ball-Grid-Array packaging, Creep, Fatigue life, Reliability
Proceedings Papers

Numerical Analysis to Lead Free Solder/Intermetallic Interconnect With Application of Wiedemann-Franz-Lorenz Relation

Yao Yao, Jared Fry, Morris Fine, Leon Keer
Proc. ASME. IMECE2012, Volume 3: Design, Materials and Manufacturing, Parts A, B, and C, 1275-1284, November 9–15, 2012
Paper No: IMECE2012-88634
DOI: https://doi.org/10.1115/IMECE2012-88634
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Topics: Intermetallic compounds, Lead-free solders, Numerical analysis, Solders, Fracture (Materials), Thermal conductivity, Tin, Electric current, Electrical conductivity, Materials properties
Proceedings Papers

Design and Process Development Concerns for the Assembly of Very Small Solder Joints

A. Alazzam, M. Obaidat, E. Perfecto, M. Lu, S. Kentner, N. O’Brien, B. Arfaei, P. Borgesen
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 459-466, November 9–15, 2012
Paper No: IMECE2012-89562
DOI: https://doi.org/10.1115/IMECE2012-89562
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Topics: Alloys, Design, Flip-chip devices, Intermetallic compounds, Manufacturing, Microscopy, Polarizers (Light), Reliability, Scanning electron microscopes, Solder joints
Proceedings Papers

Controlling the Superior Reliability of Lead Free Assemblies With Short Standoff Height Through Design and Materials Selection

B. Arfaei, L. Wentlent, S. Joshi, M. Anselm, P. Borgesen
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 467-473, November 9–15, 2012
Paper No: IMECE2012-89584
DOI: https://doi.org/10.1115/IMECE2012-89584
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Topics: Design, Reliability, Tin, Solder joints, Solders, Twinning, Alloys, Ball-Grid-Array packaging, Dimensions, Electron backscatter diffraction
Proceedings Papers

Cohesive Fracture Mechanics Based Finite Element Analysis to the Performance of Lead Free Solders in BGA Packaging Under Drop Impact

Yao Yao
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 757-765, November 9–15, 2012
Paper No: IMECE2012-88629
DOI: https://doi.org/10.1115/IMECE2012-88629
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Topics: Ball-Grid-Array packaging, Finite element analysis, Fracture mechanics, Lead-free solders, Solders, Alloys, Packaging, Electronic packaging, Failure, Fracture (Materials)