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Application of Fracture Mechanics in Electronic Packaging
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Proceedings Papers

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

Carole A. Le Gall, Jianmin Qu, David L. McDowell
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 85-95, November 16–21, 1997
Paper No: IMECE1997-0503
DOI: https://doi.org/10.1115/IMECE1997-0503
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Topics: Flip-chip, Flip-chip devices, Reliability, Thermomechanics, Stress, Creep, Dimensions, Elasticity, Flip-chip assemblies, Geometry
Proceedings Papers

Shearing Deformation in Partial Areal Arrays: Analytical Results

S. M. Heinrich, S. Shakya, P. S. Lee
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 51-59, November 16–21, 1997
Paper No: IMECE1997-0500
DOI: https://doi.org/10.1115/IMECE1997-0500
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Topics: Boundary-value problems, Corners (Structural elements), Die cutting, Dimensions, Displacement, Elasticity, Fatigue life, Finite element analysis, Finite element model, Geometry
Proceedings Papers

Effect of Thermal Residual Stress on the Measurement of the Adhesion Between Polyimide and Underfill Using an Asymmetric Double Cantilever Beam Specimen

Jinbao Jiao, Charan K. Gurumurthy, Edward J. Kramer, Yan Sha, Chung-Yuen Hui, Peter Børgesen
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 97-102, November 16–21, 1997
Paper No: IMECE1997-0504
DOI: https://doi.org/10.1115/IMECE1997-0504
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Topics: Adhesion, Cantilever beams, Stress, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture (Process), Ethers (Class of compounds), Thermal expansion
Proceedings Papers

Nondestructive Elastic Property Characterization of IC Encapsulants

Sridhar Canumalla, Michael G. Oravecz
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 25-32, November 16–21, 1997
Paper No: IMECE1997-0496
DOI: https://doi.org/10.1115/IMECE1997-0496
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Topics: Delamination, Elasticity, Fillers (Materials), Flip-chip packages, Integrated circuit packaging, Molding, Process control, Reliability, Resins, Young's modulus
Proceedings Papers

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

William T. Chen, David Questad, David Read, Bahgat Sammakia
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 183-192, November 16–21, 1997
Paper No: IMECE1997-0515
DOI: https://doi.org/10.1115/IMECE1997-0515
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Topics: Fracture mechanics, Microelectronic packaging, Packaging, Ball-Grid-Array packaging, Electronic packaging, Design, Electronic packages, Electronic products, Low temperature, Manufacturing
Proceedings Papers

Investigation of Interfacial Fracture Behavior of a Flip-Chip Package Under a Constant Concentrated Load

Jianjun Wang, Minfu Lu, Daqing Zou, Sheng Liu
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 103-113, November 16–21, 1997
Paper No: IMECE1997-0505
DOI: https://doi.org/10.1115/IMECE1997-0505
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Topics: Flip-chip packages, Fracture (Materials), Stress, Crack propagation, Fracture toughness, Silicon chips, Deflection, Displacement, Interferometry, Density
Proceedings Papers

The Effect of Temperature and Humidity Exposure on Adhesion

R. A. Pearson, R. M. Hydro, T. B. Lloyd, H. F. Nied
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 1-6, November 16–21, 1997
Paper No: IMECE1997-0493
DOI: https://doi.org/10.1115/IMECE1997-0493
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Topics: Adhesion, Temperature, Adhesives, Silver, Copper, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture (Process), Cantilever beams
Proceedings Papers

Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles

Shoji Kamiya, Hironori Takahashi, Masumi Saka, Hiroyuki Abé
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 169-174, November 16–21, 1997
Paper No: IMECE1997-0513
DOI: https://doi.org/10.1115/IMECE1997-0513
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Topics: Adhesives, Fracture (Materials), Fracture (Process), Particulate matter, Synthetic diamonds, Chemical vapor deposition, Diamond films, Nucleation (Physics), Stress, Electronics
Proceedings Papers

Investigation of Underfill Adhesion in Plastic Flip-Chip Packages

Xiang Dai, Mark V. Brillhart, Paul S. Ho
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 115-124, November 16–21, 1997
Paper No: IMECE1997-0506
DOI: https://doi.org/10.1115/IMECE1997-0506
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Topics: Adhesion, Flip-chip packages, Delamination, Failure, Flip-chip, Flip-chip assemblies, Fracture mechanics, Junctions, Manufacturing, Polymers
Proceedings Papers

Stress Analysis of High Density Bare Chip Packaging Technologies

Yutaka Tsukada, Shogo Mizumoto, Yasuyuki Kodama, Hideo Nishimura
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 49-50, November 16–21, 1997
Paper No: IMECE1997-0499
DOI: https://doi.org/10.1115/IMECE1997-0499
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Topics: Density, Packaging, Stress analysis (Engineering), Epoxy adhesives, Epoxy resins, Ceramics, Ball-Grid-Array packages, Ball-Grid-Array packaging, Electronic packaging, Flip-chip
Proceedings Papers

Die Strength Evaluation in the Presence of Edge Cracks

Betty Leung, Yifan Guo, Vijay Sarihan
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 125-131, November 16–21, 1997
Paper No: IMECE1997-0507
DOI: https://doi.org/10.1115/IMECE1997-0507
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Topics: Fracture (Materials), Reliability, Stress, Testing, Failure analysis, Finite element analysis, Manufacturing, Silicon
Proceedings Papers

Reliability of Underfill-Encapsulated Flip-Chip Packages

Hiroaki Doi, Kenya Kawano, Akio Yasukawa, Toshihiko Sato
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 7-14, November 16–21, 1997
Paper No: IMECE1997-0494
DOI: https://doi.org/10.1115/IMECE1997-0494
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Topics: Flip-chip packages, Reliability, Flat heat pipes, Solder joints, Delamination, Mechanical properties, Shapes, Stress, Stress analysis (Engineering), Finite element methods
Proceedings Papers

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Jürgen Auersperg, Andreas Schubert, Dietmar Vogel, Bernd Michel, Herbert Reichl
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 133-138, November 16–21, 1997
Paper No: IMECE1997-0508
DOI: https://doi.org/10.1115/IMECE1997-0508
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Topics: Damage, Finite element analysis, Flip-chip assemblies, Fracture (Materials), Fracture (Process), Solders, Reliability, Simulation, Thermomechanics, Delamination
Proceedings Papers

Interfacial Fracture Toughness in Plastic Packages

L. T. Nguyen, G. Lee, C. Jones, T. R. Hsu, R. Fang, A. Y. Kuo, W. T. Chen
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 15-24, November 16–21, 1997
Paper No: IMECE1997-0495
DOI: https://doi.org/10.1115/IMECE1997-0495
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Topics: Fracture toughness, Design, Testing, Adhesion, Coating processes, Coatings, Composite building materials, Copper alloys, Databases, Fracture (Materials)
Proceedings Papers

Comparison of Acoustic Microscope, X-Ray Radiography, Dye Penetrant and Destructive Physical Analysis Data for Die Attachment Analysis

Duane A. Gilmour, James F. Reilly, Donald W. Calabrese
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 175-181, November 16–21, 1997
Paper No: IMECE1997-0514
DOI: https://doi.org/10.1115/IMECE1997-0514
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Topics: Acoustics, Microscopes, X-rays, Microscopy, Silicon, Adhesion, Energy dissipation, Testing, Delamination, Density
Proceedings Papers

The Role of Electric-Current Induced Heating in Damage Evolution at the Crack Tip in Thin Film Conductors

Ashraf -F. Bastawros, Kyung -S. Kim
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 139-144, November 16–21, 1997
Paper No: IMECE1997-0509
DOI: https://doi.org/10.1115/IMECE1997-0509
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Topics: Damage, Electric current, Fracture (Materials), Heating, Thin films, Aluminum, Electrodes, Temperature, Melting, Coating processes
Proceedings Papers

A New Approach for Thermal Fatigue Testing of the Underfill/Passivation Interface

Charan K. Gurumurthy, Jinbao Jiao, Larry G. Norris, Chung-Yuen Hui, Edward J. Kramer
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 41-47, November 16–21, 1997
Paper No: IMECE1997-0498
DOI: https://doi.org/10.1115/IMECE1997-0498
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Topics: Cantilever beams, Cycles, Delamination, Displacement, Failure, Fatigue, Fatigue testing, Fibers, Flow (Dynamics), Fracture (Materials)
Proceedings Papers

A New Approach to Calculate Atomic Flux Divergence by Electromigration

Kazuhiko Sasagawa, Naoaki Nakamura, Masumi Saka, Hiroyuki Abé
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 145-152, November 16–21, 1997
Paper No: IMECE1997-0510
DOI: https://doi.org/10.1115/IMECE1997-0510
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Topics: Electrodiffusion, Current density, Temperature, Corners (Structural elements), Metals, Modeling
Proceedings Papers

Adhesion and Reliability of Polymer/Inorganic Interfaces in Microelectronic Applications

J. M. Snodgrass, S.-Y. Kook, A. Kirtikar, R. H. Dauskardt
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 33-39, November 16–21, 1997
Paper No: IMECE1997-0497
DOI: https://doi.org/10.1115/IMECE1997-0497
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Topics: Adhesion, Polymers, Reliability, Fracture (Materials), Fracture (Process), Fatigue, Fracture toughness, Cycles, Deformation, Fracture mechanics
Proceedings Papers

Free-Edge Stress Intensity Factors for Edge-Loaded Bimaterial Layers

Nathan W. Klingbeil, Jack L. Beuth
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 153-162, November 16–21, 1997
Paper No: IMECE1997-0511
DOI: https://doi.org/10.1115/IMECE1997-0511
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Topics: Stress, Design, Stress singularity, Finite element analysis, Fracture (Materials), Fracture (Process), Pressure, Strips