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Proceedings Papers

Experimental Damage Mechanics of Microelectronic Solder Joints Under Fatigue Loading

Cemal Basaran, Hong Tang, Shihua Nie
Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 229-236, November 17–22, 2002
Paper No: IMECE2002-32849
DOI: https://doi.org/10.1115/IMECE2002-32849
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Topics: Damage mechanics, Fatigue, Solder joints, Damage, Stress, Ball-Grid-Array packaging, Elastic moduli, Fatigue damage, Fatigue life, Materials degradation
Proceedings Papers

Optimization of Plasma Spray Processing Parameters for Deposition of Nanostructured Coatings

I. Ahmed, T. L. Bergman
Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 133-141, November 17–22, 2002
Paper No: IMECE2002-33944
DOI: https://doi.org/10.1115/IMECE2002-33944
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Topics: Coatings, Optimization, Plasmas (Ionized gases), Sprays, Melting, Plasma spraying, Computer simulation, Nanomaterials, Particle size, Particulate matter
Proceedings Papers

Constitutive Model for Sn-Pb Solder Under Fatigue Loading

Y. Wei, C. L. Chow, M. K. Nielsen, H. E. Fang
Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 199-205, November 17–22, 2002
Paper No: IMECE2002-39186
DOI: https://doi.org/10.1115/IMECE2002-39186
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Topics: Constitutive equations, Fatigue, Solders, Tin, Alloys, Damage, Fatigue failure, Fatigue life, Materials degradation, Mechanical behavior
Proceedings Papers

Manipulation of Bio-Particles in Microelectrode Structures by Means of Non-Uniform AC Electric Fields

Antonio Castellanos, Antonio Ramos, Antonio Gonza´lez, Hywel Morgan, Nicolas Green
Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 165-170, November 17–22, 2002
Paper No: IMECE2002-39617
DOI: https://doi.org/10.1115/IMECE2002-39617
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Topics: Electric fields, Particulate matter, Electrodes, Fluids, Brownian motion, Buoyancy, Density, Dielectrophoresis, Diffusion (Physics), Drag (Fluid dynamics)
Proceedings Papers

Experimental and Numerical Investigation of the Flow Behavior in a Tapered Rectangular Sprue

Abdessalem Derdouri, Florin Ilinca, Kalonji Kabanemi, Jean-Franc¸ois He´tu
Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 105-113, November 17–22, 2002
Paper No: IMECE2002-32660
DOI: https://doi.org/10.1115/IMECE2002-32660
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Topics: Flow (Dynamics), Viscosity, Shear (Mechanics), Shear stress, Cavities, Finite element analysis, Injection molding, Polymers, Pressure sensors, Rheology
Proceedings Papers

Computer Simulations of Non-Newtonian Fluid Flow in Rectangular Cavity

Ayten S. Bakhtiyarova
Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 49-53, November 17–22, 2002
Paper No: IMECE2002-33834
DOI: https://doi.org/10.1115/IMECE2002-33834
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Topics: Cavities, Computer simulation, Flow (Dynamics), Non-Newtonian fluids, Computational fluid dynamics, Computer software, Engineering simulation, Flow simulation, Pressure, Simulation
Proceedings Papers

New Developments in ‘Rapid Granular Flows’

Isaac Goldhirsch
Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 353-360, November 17–22, 2002
Paper No: IMECE2002-32502
DOI: https://doi.org/10.1115/IMECE2002-32502
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Topics: Boundary-value problems, Dynamics (Mechanics), Equations of motion, Flow (Dynamics), Granular materials, Separation (Technology), Shear flow, Shear rate, Shock waves, Stress
Proceedings Papers

Maximum Entropy Methods in the Mechanics of Quasi-Static Deformation of Granular Materials

N. P. Kruyt, L. Rothenburg
Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 329-336, November 17–22, 2002
Paper No: IMECE2002-32494
DOI: https://doi.org/10.1115/IMECE2002-32494
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Topics: Deformation, Density, Entropy, Granular materials, Probability
Proceedings Papers

Tensile Behavior of Monazite Coated Nextel™ 720 Fibers and Tows

D. Pai, S. Yarmolenko, B. Kailasshankar, J. Sankar, J. Lua, L. Zawada
Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 303-308, November 17–22, 2002
Paper No: IMECE2002-39372
DOI: https://doi.org/10.1115/IMECE2002-39372
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Topics: Fibers, Coating processes, Coatings, Fracture (Materials), Fracture (Process), Gages
Proceedings Papers

Mechanical Response of Unsaturated Particulate Materials: A Stiffness Assessment Study Under Controlled Matric Suction

C. H. C. Silva, F. O. Porras Ortiz, D. Fratta, E. J. Macari
Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 269-274, November 17–22, 2002
Paper No: IMECE2002-39366
DOI: https://doi.org/10.1115/IMECE2002-39366
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Topics: Bulk solids, Shear waves, Stiffness, Stress, Suction
Proceedings Papers

Manufacturability of Large SMT Connectors

Stacey N. Serafin, Terrance Dishongh
Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 237-240, November 17–22, 2002
Paper No: IMECE2002-33073
DOI: https://doi.org/10.1115/IMECE2002-33073
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Topics: Computers, Machinery, Manufacturing, Phase transitions, Reliability, Surface mount packaging
Proceedings Papers

Numerical Simulation and Thermometric Measurements on Mold Filling Dynamics

Sayavur I. Bakhtiyarov, Ruel A. Overfelt, Matthew Edmondson
Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 115-118, November 17–22, 2002
Paper No: IMECE2002-33931
DOI: https://doi.org/10.1115/IMECE2002-33931
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Topics: Computer simulation, Dynamics (Mechanics), Flow (Dynamics), Gravity (Force), Computational fluid dynamics, Computer software, Engineering simulation, Flow simulation, Liquid metals, Pressure
Proceedings Papers

A Finite Element Analysis of Void Evolution in 2-D Machining

Q. Cao, K. C. Ee, O. W. Dillon, Jr., I. S. Jawahir
Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 207-214, November 17–22, 2002
Paper No: IMECE2002-39187
DOI: https://doi.org/10.1115/IMECE2002-39187
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Topics: Finite element analysis, Machining
Proceedings Papers

Advancements in Micro-Molding for Small-Scale Product Fabrication

Alan M. Tom, John P. Coulter
Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 143-151, November 17–22, 2002
Paper No: IMECE2002-33945
DOI: https://doi.org/10.1115/IMECE2002-33945
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Topics: Manufacturing, Molding, Machinery, Governments, Injection molding, Integrated circuits, Manufacturing industry, Optimization, Tooling
Proceedings Papers

An Anisotropic Damage Model for Ductile Metals

Youssef Hammi, Mark F. Horstemeyer, Doug J. Bammann
Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 185-192, November 17–22, 2002
Paper No: IMECE2002-32887
DOI: https://doi.org/10.1115/IMECE2002-32887
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Topics: Anisotropy, Damage, Metals, Tensors, Nucleation (Physics), Aluminum alloys, Fracture (Materials), Plasticity, Fracture toughness, Hydrostatics
Proceedings Papers

Transport Properties in Sheared Granular Flows

Shu-San Hsiau
Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 361-374, November 17–22, 2002
Paper No: IMECE2002-32503
DOI: https://doi.org/10.1115/IMECE2002-32503
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Topics: Diffusion (Physics), Filters, Flow (Dynamics), High temperature, Particulate matter, Shear (Mechanics), Gages, Glass, Granular materials, Image processing
Proceedings Papers

Use of Resin Transfer Molding Simulation to Predict Flow, Saturation and Compaction in the VARTM Process

N. C. Correia, F. Robitaille, A. C. Long, C. D. Rudd, P. Sˇima´cˇek, S. G. Advani
Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 61-68, November 17–22, 2002
Paper No: IMECE2002-39696
DOI: https://doi.org/10.1115/IMECE2002-39696
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Topics: Compacting, Flow (Dynamics), Resins, Simulation, Transfer molding, Preforms, Vacuum, Algorithms, Cavities, Composite materials
Proceedings Papers

Natural Convection in Cylindrical Configuration: Effect of the Obstacle on the Unsteadiness

K. Choukairy, R. Bennacer, P. D. Matthey, R. Duval
Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 33-38, November 17–22, 2002
Paper No: IMECE2002-33828
DOI: https://doi.org/10.1115/IMECE2002-33828
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Topics: Natural convection, Flow (Dynamics), Heat transfer, Approximation, Density, Diffusion (Physics), Eddies (Fluid dynamics), Resolution (Optics), Transients (Dynamics)
Proceedings Papers

Photopolymerizable Liquid Crystal Monomer-Oxide Nanoparticle Composites

S. T. Wellinghoff, D. P. Nicolella, D. P. Hanson, H. R. Rawls, B. K. Norling
Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 275-280, November 17–22, 2002
Paper No: IMECE2002-39367
DOI: https://doi.org/10.1115/IMECE2002-39367
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Topics: Composite materials, Liquid crystals, Nanoparticles, Glass, Polymerization, Polymers, Shrinkage (Materials), Temperature, Biomaterials, Fracture (Materials)
Proceedings Papers

Effect of Voids on Thermal Fatigue Reliability of Lead-Free Solder Joints

Qiang Yu, Do-Seop Kim, Tadahiro Shibutani, Toshiaki Inoue, Nobuyuki Sadakata
Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 241-246, November 17–22, 2002
Paper No: IMECE2002-33076
DOI: https://doi.org/10.1115/IMECE2002-33076
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Topics: Fatigue, Lead-free solders, Reliability, Solder joints, Fatigue strength, Finite element methods, Shear (Mechanics), Fatigue testing, Fracture (Materials), Fracture (Process)