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Keywords: heat spreader
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Proceedings Papers
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 283-290, November 11–16, 2001
Paper No: IMECE2001/HTD-24405
... Proceedings of 2001 ASME International Mechanical Engineering Congress and Exposition November 11-16, 2001, New York, NY HTD-Vol. 369-7 IMECE2001 /HTD-24405 CAPILLARY PUMPED LOOP HEAT SPREADER FOR ELECTRONICS COOLING Jaewon Chung, Costas P. Grigoropoulos, Ralph Greif University of California...
Proceedings Papers
Proc. ASME. IMECE2009, Volume 9: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B and C, 1011-1018, November 13–19, 2009
Paper No: IMECE2009-10263
... 07 07 2010 THE THERMAL PERFORMANCE OF GRAPHITE HEAT SPREADERS IN RADIANT PANEL APPLICATIONS Martin D. Smalc GrafTech International Holdings Inc. 12900 Snow Road, Parma, OH 44130, USA Phone: 216-676-2182, Fax: 216-676-2137 E-mail: martin.smalc@graftech.com Julian Norley GrafTech...
Proceedings Papers
A Study on the Effects of Flow Channel Configurations on the Cooling Behavior of a Water-Cooled Chip
Chia-Yuan Nien, Chung-Yueh Wang, Chien-Chen Liu, Yen-Min Tsang, Chun-Yen Chen, Ya-Han Mia, Jyh-Tong Teng
Proc. ASME. IMECE2007, Volume 8: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A and B, 633-640, November 11–15, 2007
Paper No: IMECE2007-43881
... to numerically simulate the operation of the heat spreader for the flow channels under study. The experimental results indicated that a minimum value of 0.16 °C/W was achieved for the flow channel with the improved circular design (with a heat source of 150 W and a volumetric flow rate of 0.5 L/min). The value...
Proceedings Papers
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 553-557, November 15–21, 2003
Paper No: IMECE2003-42034
...% over the entire temperature and power ranges. IC cooling Heat spreader Mathematical thermal model 1-D non-uniform rod Proceedings of IMECE 03 2003 ASME International Mechanical Engineering Congress & Exposition NOM DU FL HS HE TD TH TA INTR O valida design this p its na uniqu Cooling...
Proceedings Papers
Proc. ASME. IMECE2004, Heat Transfer, Volume 2, 281-288, November 13–19, 2004
Paper No: IMECE2004-59668
... 31 03 2008 An effective and time-saving method for precisely evaluating the effective thermal conductivities of diamond-coated silicon heat spreader is presented. For the present two-layer (diamond/silicon) composite material, by using both a numerical thermal network method...
Proceedings Papers
Proc. ASME. IMECE2004, Innovations in Engineering Education: Mechanical Engineering Education, Mechanical Engineering/Mechanical Engineering Technology Department Heads, 363-372, November 13–19, 2004
Paper No: IMECE2004-62480
... electronics. Nokia is increasing the current BTS performance by adding another power amplifier. We will encounter the problem of designing the thermal solution to ensure optimal thermal performance, while meeting customer requirements of cost and manufacturing process. IC cooling Heat spreader...
Proceedings Papers
Proc. ASME. IMECE2005, Heat Transfer, Part A, 749-754, November 5–11, 2005
Paper No: IMECE2005-81255
... sufficient to manage hysterisis in the boiling curve. Boiling Enhancement Electronics Cooling Heat Spreader Experimental Webb R. L. , 2005 , “ Next Generation Deices for Electronic Cooling with Heat Rejection to Air ,” Trans. ASME , 127 , pp. 2 – 10 . Pais M. R. , Chow L...
