There is a strong need to improve our current capabilities in thermal management and electronic cooling, since estimates indicate that IC power density level could reach 50 W/cm2 in near future. This paper presents an innovative approach for thermal modeling of active cooling schemes suitable for tight-spaced telecom servers. It is shown that the principles of energy conversion can be used to overcome the problems of thermal resistance narrowing. Cooling schemes such as mesoscale vapor compression refrigeration, liquid cooling, thermoelectric microcooler and microchannel heat sink are discussed and compared in terms of heat dissipation potential, reliability, and packaging application concerns.
- Electronic and Photonic Packaging Division
Analytical Modeling of Active Cooling Schemes Suitable for Thermal Management of Telecoms Servers
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Heydari, A, & Sabounchi, P. "Analytical Modeling of Active Cooling Schemes Suitable for Thermal Management of Telecoms Servers." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1. Maui, Hawaii, USA. July 6–11, 2003. pp. 575-583. ASME. https://doi.org/10.1115/IPACK2003-35334
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