This paper discusses the measurement opportunities arising from a novel piezoresistance sensor featuring vertical currents. Temperature-compensated measurements of a sum of the three normal stress components including the vertical normal stress, are presented. In specific applications with sensors located at free surfaces where the vertical normal stress component vanishes, a combination of this temperature-compensated measurement and a pseudo-Hall measurement yields the individual in-plane normal stresses. Furthermore, the temperature-uncompensated extraction of the vertical normal stress component is discussed with respect to the new measurement possibilities provided by the presented sensor. A sensitivity analysis illustrates the influence of individual uncertainty sources to the overall uncertainty of the measurement. Based on these results possible improvements in stress detection are suggested.
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Evaluation of the Accuracy of Out-of-Plane Normal Stress Detection Using Novel Piezoresistive CMOS Sensors
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Lemke, B, Baskaran, R, & Paul, O. "Evaluation of the Accuracy of Out-of-Plane Normal Stress Detection Using Novel Piezoresistive CMOS Sensors." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 1. San Francisco, California, USA. July 19–23, 2009. pp. 463-469. ASME. https://doi.org/10.1115/InterPACK2009-89171
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