This paper discusses the measurement opportunities arising from a novel piezoresistance sensor featuring vertical currents. Temperature-compensated measurements of a sum of the three normal stress components including the vertical normal stress, are presented. In specific applications with sensors located at free surfaces where the vertical normal stress component vanishes, a combination of this temperature-compensated measurement and a pseudo-Hall measurement yields the individual in-plane normal stresses. Furthermore, the temperature-uncompensated extraction of the vertical normal stress component is discussed with respect to the new measurement possibilities provided by the presented sensor. A sensitivity analysis illustrates the influence of individual uncertainty sources to the overall uncertainty of the measurement. Based on these results possible improvements in stress detection are suggested.
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ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4359-8
PROCEEDINGS PAPER
Evaluation of the Accuracy of Out-of-Plane Normal Stress Detection Using Novel Piezoresistive CMOS Sensors
Benjamin Lemke,
Benjamin Lemke
University of Freiburg, Freiburg, Germany
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Rajashree Baskaran,
Rajashree Baskaran
Intel Corporation, Chandler, AZ
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Oliver Paul
Oliver Paul
University of Freiburg, Freiburg, Germany
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Benjamin Lemke
University of Freiburg, Freiburg, Germany
Rajashree Baskaran
Intel Corporation, Chandler, AZ
Oliver Paul
University of Freiburg, Freiburg, Germany
Paper No:
InterPACK2009-89171, pp. 463-469; 7 pages
Published Online:
December 24, 2010
Citation
Lemke, B, Baskaran, R, & Paul, O. "Evaluation of the Accuracy of Out-of-Plane Normal Stress Detection Using Novel Piezoresistive CMOS Sensors." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 1. San Francisco, California, USA. July 19–23, 2009. pp. 463-469. ASME. https://doi.org/10.1115/InterPACK2009-89171
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