Due to environmental concerns, Pb-free solders are widely used in electronic industry for assembling electronic components on the substrate. Under the various operation conditions, solder bumps are subjected to cyclic stress and failed by fatigue. To ensure the reliability of electronic products, it is becoming important to predict the fatigue failure of the Pb-free solder bumps. In this study, effects of chip size and thermal amplitude on fatigue life of the Pb-free solder bumps were investigated by experiments and elastic-plastic finite element analysis. A parameter, which is valuable to compare the fatigue damage of electronic packages with different chip size, is introduced.
- Electronic and Photonic Packaging Division
Effect of Chip Size and Thermal Amplitude on Fatigue Life of Pb-Free Solder Bump
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Ishikawa, S, Tohmyoh, H, Saka, M, Watanabe, S, Kuroha, M, & Nakano, Y. "Effect of Chip Size and Thermal Amplitude on Fatigue Life of Pb-Free Solder Bump." Proceedings of the ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1. Portland, Oregon, USA. July 6–8, 2011. pp. 207-211. ASME. https://doi.org/10.1115/IPACK2011-52112
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