This paper provides an overview of a thermoelectric heat pump clothes dryer which was developed with the aim of reducing the significant primary energy consumption attributed to residential electric clothes drying in the United States (623 TBtu/yr). The use of thermoelectric modules in place of the conventional electric resistance heater resulted in a 40% reduction in the energy consumption of the system, compared to the minimum energy efficiency standard. This was achieved for the first time for a standard test load of 8.45 lb, using a clothes dryer prototype with a thermoelectric heat pump module as the sole heating mechanism. The current experimental prototype was developed after extensive modeling, system design and control optimization, and experimental system-level evaluation of control parameters. The demonstration of improved energy consumption has laid the foundation for future development of this technology.
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ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems
August 29–September 1, 2017
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5809-7
PROCEEDINGS PAPER
Development of Packaging and Modular Control of Thermoelectric Clothes Dryer, With Performance Evaluation
Viral K. Patel,
Viral K. Patel
Oak Ridge National Laboratory, Oak Ridge, TN
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Kyle R. Gluesenkamp
Kyle R. Gluesenkamp
Oak Ridge National Laboratory, Oak Ridge, TN
Search for other works by this author on:
Viral K. Patel
Oak Ridge National Laboratory, Oak Ridge, TN
Kyle R. Gluesenkamp
Oak Ridge National Laboratory, Oak Ridge, TN
Paper No:
IPACK2017-74243, V001T04A009; 6 pages
Published Online:
October 27, 2017
Citation
Patel, VK, & Gluesenkamp, KR. "Development of Packaging and Modular Control of Thermoelectric Clothes Dryer, With Performance Evaluation." Proceedings of the ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems. ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. San Francisco, California, USA. August 29–September 1, 2017. V001T04A009. ASME. https://doi.org/10.1115/IPACK2017-74243
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