Search Results | InterPACK | ASME Digital Collection

1-20 of 2034

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Proceedings Papers

Thermal Transport Across Al-(Al x Ga 1-x ) 2 O 3 and Al-Ga 2 O 3 Interfaces

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A005, October 26–28, 2021

Paper No: IPACK2021-74116

DOI: https://doi.org/10.1115/IPACK2021-74116

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Topics: Alloys, Aluminum, Cathode rays, Chemical reactions, Cooling, Electrical conductance, Electron beams, Electronics, Energy dissipation, Gallium

Proceedings Papers

Performance Analysis of Micro-Raman Spectroscopy Models for Thermal Conductivity Calculation

Taher Meydando, Nazli Donmezer

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 26–28, 2021

Paper No: IPACK2021-73648

DOI: https://doi.org/10.1115/IPACK2021-73648

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Topics: Phonons, Spectroscopy, Thermal conductivity, Thin films

Proceedings Papers

Hotspot Cooling Performance for Submerged Confined Two-Phase Jet Impingement Cooling

Tanvir Ahmed Chowdhury, Shawn A. Putnam

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 26–28, 2021

Paper No: IPACK2021-69317

DOI: https://doi.org/10.1115/IPACK2021-69317

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Topics: Cooling, Impingement cooling

Proceedings Papers

Design for Reliability of Automotive Chip Scale Packages by Calibrated Virtual Prototyping

Ralf Döring, R. Dudek, S. Rzepka, L. Scheiter, E. Noack, B. Seiler

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A015, October 26–28, 2021

Paper No: IPACK2021-73970

DOI: https://doi.org/10.1115/IPACK2021-73970

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Topics: Design, Finite element analysis, Reliability, Simulation, Thermomechanics

Proceedings Papers

Effect of Mechanical Cycling at Elevated Temperatures on The Constitutive Properties and Microstructure of Lead Free Solder Alloys

Mohd Aminul Hoque, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A014, October 26–28, 2021

Paper No: IPACK2021-73548

DOI: https://doi.org/10.1115/IPACK2021-73548

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Topics: Alloys, Creep, Lead-free solders, Stress-strain curves, Temperature

Proceedings Papers

Nonlocal Damage Modeling of Solder Joint Failure Under Thermomechanical Cyclic Loading

Youssef Maniar, Alexander Kabakchiev, Marta Kuczynska, Masoomeh Bazrafshan, Peter Binkele, Siegfried Schmauder

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A003, October 26–28, 2021

Paper No: IPACK2021-73100

DOI: https://doi.org/10.1115/IPACK2021-73100

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Topics: Damage, Failure, Modeling, Solder joints, Thermomechanics, Finite element analysis, Simulation, Stress, Deformation, Solders

Proceedings Papers

Thermal Conductivity Prediction Model for Composite Thermal Interface Materials Using Copper Metal Foam

Shinya Kawakita, Yuki Ishizaka, Kazuyoshi Fushinobu

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 26–28, 2021

Paper No: IPACK2021-70410

DOI: https://doi.org/10.1115/IPACK2021-70410

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Topics: Composite materials, Copper, Thermal conductivity

Proceedings Papers

Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment

Pradeep Lall, Jinesh Narangaparambil, Scott Miller

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 26–28, 2021

Paper No: IPACK2021-74086

DOI: https://doi.org/10.1115/IPACK2021-74086

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Topics: Adhesives, Flexible electronics, Inks, Low temperature, Printing, Solders, Surface mount components

Proceedings Papers

Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads

Pradeep Lall, Tony Thomas, Jinesh Narangaparambil

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 26–28, 2021

Paper No: IPACK2021-74074

DOI: https://doi.org/10.1115/IPACK2021-74074

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Topics: Performance characterization, Strain gages, Stress, Temperature, Inks, Printing, Sensors, Printed circuit boards, Silver, Vibration

Proceedings Papers

Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies

Chris May, Jordan Mizerak, David Earley, Bernard Malouin

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, October 26–28, 2021

Paper No: IPACK2021-74016

DOI: https://doi.org/10.1115/IPACK2021-74016

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Topics: Cooling, Data centers, Heat sinks, Power density, Heat, Semiconductors (Materials), Temperature, Density, Energy consumption, Flow (Dynamics)

Proceedings Papers

Compact Thermosyphon Cooling System For High Heat Flux Servers: Validation Of Thermosyphon Simulation Code Considering New Test Data

Rémy Haynau, Jackson B. Marcinichen, Raffaele L. Amalfi, Filippo Cataldo, John R. Thome

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 26–28, 2021

Paper No: IPACK2021-72620

DOI: https://doi.org/10.1115/IPACK2021-72620

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Topics: Cooling systems, Heat flux, Simulation

Proceedings Papers

Ultra-High-Density Interconnect Enabled by Hybrid Bonding for Heterogeneous Integration: Interfacial Characteristics

Mei-Chien Lu

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 26–28, 2021

Paper No: IPACK2021-73314

DOI: https://doi.org/10.1115/IPACK2021-73314

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Topics: Bonding, Copper, Density, Design, Overlays (Materials engineering)

Proceedings Papers

Prognostics and RUL Estimations of SAC305, SAC105 and SnAg Solders Under Temperature and Vibration Using Long Short-Term Memory (LSTM) Deep Learning

Pradeep Lall, Tony Thomas, Ken Blecker

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A019, October 26–28, 2021

Paper No: IPACK2021-74066

DOI: https://doi.org/10.1115/IPACK2021-74066

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Topics: Solders, Temperature, Vibration, Failure, Signals, Service life (Equipment), Time series, Complex systems, Dimensions, Maintenance

Proceedings Papers

Reliability of Electronic Drivers: An Industrial Approach

P. Watté, G. van Hees, R. Engelen, W. D. van Driel

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A005, October 26–28, 2021

Paper No: IPACK2021-72293

DOI: https://doi.org/10.1115/IPACK2021-72293

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Topics: Reliability

Proceedings Papers

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 26–28, 2021

Paper No: IPACK2021-69882

DOI: https://doi.org/10.1115/IPACK2021-69882

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Topics: Electrodiffusion, Intermetallic compounds, Solder joints, Stress

Proceedings Papers

Thermal Design of Variable Frequency Drives for Hybrid and Electric Transport Applications

Nikhil R. Lakhkar

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 26–28, 2021

Paper No: IPACK2021-68870

DOI: https://doi.org/10.1115/IPACK2021-68870

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Topics: Cooling, Design, Electric vehicles, Hybrid electric vehicles, Vehicles, Compressors, Batteries, Electrification, HVAC equipment, Internal combustion engines

Proceedings Papers

Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions

Pradeep Lall, Jinesh Narangaparambil, Tony Thomas, Kyle Schulze

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 26–28, 2021

Paper No: IPACK2021-74570

DOI: https://doi.org/10.1115/IPACK2021-74570

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Topics: Failure, Gages, Inks, Printing, Shear (Mechanics), Stability, Strain gages, Stress

Proceedings Papers

Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability of Flexible Encapsulation in FHE Applications

Pradeep Lall, Padmanava Choudhury, Scott Miller

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 26–28, 2021

Paper No: IPACK2021-74060

DOI: https://doi.org/10.1115/IPACK2021-74060

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Topics: Electronics, Reliability, Surface preparation, Stress, Adhesives, Biometry, Diluents, Dust, Finite element model, Flexible electronics

Proceedings Papers

Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers

Filippo Cataldo, Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 26–28, 2021

Paper No: IPACK2021-72621

DOI: https://doi.org/10.1115/IPACK2021-72621

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Topics: Computer cooling, Computers, Cooling systems, Cooling, Energy consumption, Climate change, Condensers (steam plant), Flow (Dynamics), Fluids, Heat

Proceedings Papers

Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids

Noriyuki Unno, Kazuhisa Yuki, Risako Kibushi, Rika Nogita, Atsuyuki Mitani

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 26–28, 2021

Paper No: IPACK2021-67330

DOI: https://doi.org/10.1115/IPACK2021-67330

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Topics: Boiling, Critical heat flux, Heat transfer, Nanofluids, Particulate matter, Pressure, Water

2 3 4 5

NARROW

Thermal Transport Across Al-(Al x Ga 1-x ) 2 O 3 and Al-Ga 2 O 3 Interfaces

Performance Analysis of Micro-Raman Spectroscopy Models for Thermal Conductivity Calculation

Hotspot Cooling Performance for Submerged Confined Two-Phase Jet Impingement Cooling

Design for Reliability of Automotive Chip Scale Packages by Calibrated Virtual Prototyping

Effect of Mechanical Cycling at Elevated Temperatures on The Constitutive Properties and Microstructure of Lead Free Solder Alloys

Nonlocal Damage Modeling of Solder Joint Failure Under Thermomechanical Cyclic Loading

Thermal Conductivity Prediction Model for Composite Thermal Interface Materials Using Copper Metal Foam

Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment

Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads

Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies

Compact Thermosyphon Cooling System For High Heat Flux Servers: Validation Of Thermosyphon Simulation Code Considering New Test Data

Ultra-High-Density Interconnect Enabled by Hybrid Bonding for Heterogeneous Integration: Interfacial Characteristics

Prognostics and RUL Estimations of SAC305, SAC105 and SnAg Solders Under Temperature and Vibration Using Long Short-Term Memory (LSTM) Deep Learning

Reliability of Electronic Drivers: An Industrial Approach

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Thermal Design of Variable Frequency Drives for Hybrid and Electric Transport Applications

Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions

Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability of Flexible Encapsulation in FHE Applications

Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers

Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids

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