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Proceedings Papers

Enhanced Passive Cooling in Thermal Interface Materials via Encapsulated Phase Change Material Additives

Joshua Kasitz, Muhammad Ghufran, David Huitink
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141296
https://doi.org/10.1115/IPACK2024-141296
View Paper titled, Enhanced Passive Cooling in Thermal Interface Materials via Encapsulated Phase Change Material Additives
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Topics: Cooling, Phase change materials
Proceedings Papers

Comprehensive Analysis of Two-Phase Flow Boiling for IT Equipment Cooling: A System and Component-Level Approach

Mohammad Reza Najjari, Cam Turner, Kamal Mostafavi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140918
https://doi.org/10.1115/IPACK2024-140918
View Paper titled, Comprehensive Analysis of Two-Phase Flow Boiling for IT Equipment Cooling: A System and Component-Level Approach
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Topics: Boiling, Cooling, Two-phase flow, Refrigerants, Design, Health and safety, Innovation, Liabilities, Pressure drop
Proceedings Papers

Minimizing Die Cracking Risk by Copper Pillar Design Optimization for Advanced 5nm Silicon Node

Shrinath Shrinivas Ramdas, Tushar Chauhan, Mark Patterson, Dwayne R. Shirley, Lijuan Zhang, Roberto Coccioli
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A018, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141335
https://doi.org/10.1115/IPACK2024-141335
View Paper titled, Minimizing Die Cracking Risk by Copper Pillar Design Optimization for Advanced 5nm Silicon Node
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Topics: Columns (Structural), Copper, Delamination, Design, Finite element analysis, Fracture (Process), Optimization, Risk, Silicon
Proceedings Papers

Mitigation of Boiling-Induced Thermal Degradation Using Microporous Nickel Inverse Opal (NiIOs) Structures

Kaiying Jiang, Daeyoung Kong, Sreekant Narumanchi, James Palko, Ercan M. Dede, Chulmin Ahn, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A017, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141329
https://doi.org/10.1115/IPACK2024-141329
View Paper titled, Mitigation of Boiling-Induced Thermal Degradation Using Microporous Nickel Inverse Opal (NiIOs) Structures
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Topics: Boiling, Copper, Corrosion, Erosion, Nickel
Proceedings Papers

Topology Optimization of Electronic Line Using Computer Aided Engineering Software

Kotaro Miura, Hiromu Kudo, Kazuhiko Sasagawa, Kazuhiro Fujisaki
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-139338
https://doi.org/10.1115/IPACK2024-139338
View Paper titled, Topology Optimization of Electronic Line Using Computer Aided Engineering Software
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Topics: Computer software, Computer-aided engineering, Steady state, Topology optimization
Proceedings Papers

Numerical Analysis of Immersed Confined Coaxial Liquid Jet Impingement Heat Transfer for Electronics Thermal Management

Faramarz Kahbandeh, Daniel Harris, Mehmet Arik
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141130
https://doi.org/10.1115/IPACK2024-141130
View Paper titled, Numerical Analysis of Immersed Confined Coaxial Liquid Jet Impingement Heat Transfer for Electronics Thermal Management
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Topics: Electronics, Heat transfer, Numerical analysis, Thermal management
Proceedings Papers

Passive Direct Liquid Cooling for High-Power Processors

Alexei Tyryshkin, John Kim, Raffaele Luca Amalfi, Ryan Enright
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141022
https://doi.org/10.1115/IPACK2024-141022
View Paper titled, Passive Direct Liquid Cooling for High-Power Processors
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Topics: Cooling, Refrigerants, Cooling systems, Design, Computer cooling, Condensation, Density, Electronic equipment, Electronics, Energy dissipation
Proceedings Papers

Comparative Performance Analysis of Screen-Printed Structures on PET and BPET Substrates Utilizing Low-Temperature ECA and MACA for SMD Component Attachment

Pradeep Lall, Shriram Kulkarni, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A010, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141881
https://doi.org/10.1115/IPACK2024-141881
View Paper titled, Comparative Performance Analysis of Screen-Printed Structures on PET and BPET Substrates Utilizing Low-Temperature ECA and MACA for SMD Component Attachment
Open the PDF for Comparative Performance Analysis of Screen-Printed Structures on PET and BPET Substrates Utilizing Low-Temperature ECA and MACA for SMD Component Attachment in another window
Topics: Biodegradation, Cellulose, Circuits, Electronics, Errors, Low temperature, Manufacturing, Printing, Sanitary landfills, Stability
Proceedings Papers

Additively Printed Circuits Using Biodegradable Substrates on Aerosol-Jet With Aqueous-Based Silver Conductive Paste Using ECA and Low-Temperature Interconnects

Pradeep Lall, Daniel Karakitie, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A009, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141879
https://doi.org/10.1115/IPACK2024-141879
View Paper titled, Additively Printed Circuits Using Biodegradable Substrates on Aerosol-Jet With Aqueous-Based Silver Conductive Paste Using ECA and Low-Temperature Interconnects
Open the PDF for Additively Printed Circuits Using Biodegradable Substrates on Aerosol-Jet With Aqueous-Based Silver Conductive Paste Using ECA and Low-Temperature Interconnects in another window
Topics: Aerosols, Biodegradation, Circuits, Inks, Low temperature, Silver, Water
Proceedings Papers

Sequential High Humidity and Isothermal Evolution of UF-Substrate Interface

Pradeep Lall, Padmanava Choudhury, Aathi Pandurangan
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A032, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-143310
https://doi.org/10.1115/IPACK2024-143310
View Paper titled, Sequential High Humidity and Isothermal Evolution of UF-Substrate Interface
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Topics: Damage, Delamination, Displacement, Failure, Fracture (Materials), High temperature, Reliability, Stress
Proceedings Papers

Hygrothermal Aging Evolution of Non-PFAS FCBGA Interfaces

Pradeep Lall, Padmanava Choudhury, Aathi Pandurangan, Madhu Kasturi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A031, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-143308
https://doi.org/10.1115/IPACK2024-143308
View Paper titled, Hygrothermal Aging Evolution of Non-PFAS FCBGA Interfaces
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Topics: Copper, Delamination, Diseases, Displacement, Electronics, Fracture (Materials), High temperature, Liver, Reliability, Stress
Proceedings Papers

Comparing Wire Bonding Strategies for High Power Applications

Whit Vinson, Frida Torres, David Huitink
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140965
https://doi.org/10.1115/IPACK2024-140965
View Paper titled, Comparing Wire Bonding Strategies for High Power Applications
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Topics: Alloys, Aluminum, Current density, Electrical resistivity, Electrodiffusion, Failure, Heating, Intermetallic compounds, Joules, Nickel
Proceedings Papers

Effects of Package Position and Constraint Conditions on Fatigue Life of QFP Interconnect Structure Under Random Vibration

Nozomi Shimamura, Qiang Yu
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140880
https://doi.org/10.1115/IPACK2024-140880
View Paper titled, Effects of Package Position and Constraint Conditions on Fatigue Life of QFP Interconnect Structure Under Random Vibration
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Topics: Fatigue life, Finite element methods, Random vibration
Proceedings Papers

Fundamental Study on Practical Measurement Method of Anisotropic Thermal Conduction Performance Using Zig-Zag Jigs

Natsumi Kimura, Takashi Fukue, Haruki Yoshihiro, Koichi Hirasawa
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-139742
https://doi.org/10.1115/IPACK2024-139742
View Paper titled, Fundamental Study on Practical Measurement Method of Anisotropic Thermal Conduction Performance Using Zig-Zag Jigs
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Topics: Anisotropy, Heat conduction, Jigs and fixtures, Steady state, Thermal conductivity
Proceedings Papers

Maturation of Pumped Two-Phase Liquid Cooling to Commercial Scale-Up Deployment

Russell Tipton, Ashley Wise, Srdan Mutabdzija, Craig Shores, Devdatta Kulkarni
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141206
https://doi.org/10.1115/IPACK2024-141206
View Paper titled, Maturation of Pumped Two-Phase Liquid Cooling to Commercial Scale-Up Deployment
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Topics: Cooling, Refrigerants
Proceedings Papers

Exploring the Impact of CRAH Unit Partial Failure in Hybrid-Cooled Data Centers

Ali Heydari, Ahmad R. Gharaibeh, Mohammad Tradat, Qusai Soud, Yaman Manaserh, Vahideh Radmard, Bahareh Eslami, Jeremy Rodriguez, Bahgat Sammakia
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-139031
https://doi.org/10.1115/IPACK2024-139031
View Paper titled, Exploring the Impact of CRAH Unit Partial Failure in Hybrid-Cooled Data Centers
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Topics: Cooling, Data centers, Density, Failure, Heat
Proceedings Papers

Microvia Geometry Assessment at High-Stress Substrate Locations in Printed Circuit Boards Under Thermomechanical Stresses

Mujahid Abbas Syed, Qiang Yu
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-139572
https://doi.org/10.1115/IPACK2024-139572
View Paper titled, Microvia Geometry Assessment at High-Stress Substrate Locations in Printed Circuit Boards Under Thermomechanical Stresses
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Topics: Geometry, Printed circuit boards, Reliability, Stress, Thermomechanics
Proceedings Papers

Advancing in Data Centers Thermal Management: Experimental Assessment of Two-Phase Liquid Cooling Technology

Ali Heydari, Omar Al-Zu'bi, Yaman Manaserh, Ahmad R. Gharaibeh, Russ Tipton, Mehdi Mehrabikermani, Jeremy Rodriguez, Bahgat Sammakia
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141342
https://doi.org/10.1115/IPACK2024-141342
View Paper titled, Advancing in Data Centers Thermal Management: Experimental Assessment of Two-Phase Liquid Cooling Technology
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Topics: Cooling, Data centers, Density, Heat, Refrigerants, Thermal management
Proceedings Papers

Effect of Aspect Ratio and Flow Rate on the Flow Regimes and Thermal Performance of Two-Phase Micro-Channel Cold Plates for Direct to Chip Cooling

Yousaf Shah, Alfonso Ortega, Mehdi Mehrabi-kermani, Victor A. Martinez, Yaman Manaserh, Ali Heydari, Jeremy Rodriguez
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140277
https://doi.org/10.1115/IPACK2024-140277
View Paper titled, Effect of Aspect Ratio and Flow Rate on the Flow Regimes and Thermal Performance of Two-Phase Micro-Channel Cold Plates for Direct to Chip Cooling
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Topics: Cooling, Data centers, Flow (Dynamics), Microchannels, Plates (structures)
Proceedings Papers

Sequential High-Temperature Aging and High Humidity Exposure of Chip/Underfill Interfaces to Investigate the Evolution of Interfacial Stress Intensity Factor in FCBGA Stress Intensity

Pradeep Lall, Aathi Pandurangan, Padmanava Choudhury
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A028, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-142108
https://doi.org/10.1115/IPACK2024-142108
View Paper titled, Sequential High-Temperature Aging and High Humidity Exposure of Chip/Underfill Interfaces to Investigate the Evolution of Interfacial Stress Intensity Factor in FCBGA Stress Intensity
Open the PDF for Sequential High-Temperature Aging and High Humidity Exposure of Chip/Underfill Interfaces to Investigate the Evolution of Interfacial Stress Intensity Factor in FCBGA Stress Intensity in another window
Topics: Delamination, Fracture (Materials), Fracture toughness, High temperature, Stress