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Proceedings Papers

Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability

Pradeep Lall, Jinesh Narangaparambil, Curtis Hill

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 25–27, 2022

Paper No: IPACK2022-97457

DOI: https://doi.org/10.1115/IPACK2022-97457

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Topics: Artificial neural networks, Circuits, Copper, Flexible electronics, High temperature, Reliability, Electrical resistivity, Sintering, Adhesives, Electronics

Proceedings Papers

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Pradeep Lall, Jinesh Narangaparambil, Scott Miller

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022

Paper No: IPACK2022-97456

DOI: https://doi.org/10.1115/IPACK2022-97456

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Topics: Adhesives, Anisotropy, Circuits, Electrical properties, Failure, Reliability, Temperature, Electronics, Low temperature, Bonding

Proceedings Papers

Additive Manufacturing of Electronic Patterns for Harsh Environments

Nicolas Delavault, Tanguy Lacondemine, Rémy Kalmar, Manuel Fendler, Sofiane Achache, Frederic Sanchette

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 25–27, 2022

Paper No: IPACK2022-94052

DOI: https://doi.org/10.1115/IPACK2022-94052

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Topics: Additive manufacturing, Extruding, Modeling, Strain measurement, Internet of things, Adhesives, Blocks (Building materials), Inks, Optimization, Oscillations

Proceedings Papers

Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment

Pradeep Lall, Jinesh Narangaparambil, Scott Miller

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 26–28, 2021

Paper No: IPACK2021-74086

DOI: https://doi.org/10.1115/IPACK2021-74086

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Topics: Adhesives, Flexible electronics, Inks, Low temperature, Printing, Solders, Surface mount components

Proceedings Papers

Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability of Flexible Encapsulation in FHE Applications

Pradeep Lall, Padmanava Choudhury, Scott Miller

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 26–28, 2021

Paper No: IPACK2021-74060

DOI: https://doi.org/10.1115/IPACK2021-74060

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Topics: Electronics, Reliability, Surface preparation, Stress, Adhesives, Biometry, Diluents, Dust, Finite element model, Flexible electronics

Proceedings Papers

Printed Flexible LC Filter Using Additive Micro-Dispensing With Silver Conductive Paste and ECA for Component Attachment

Pradeep Lall, Jinesh Narangaparambil, Kyle Schulze, Scott Miller

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, October 26–28, 2021

Paper No: IPACK2021-74073

DOI: https://doi.org/10.1115/IPACK2021-74073

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Topics: Adhesives, Filters, Printing, Silver, Sintering

Proceedings Papers

Mechanical Behavior of Heat Activated Film Adhesives

Prabhat Janamanchi, Abhijit Dasgupta, Narendra Singh

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 26–28, 2021

Paper No: IPACK2021-69719

DOI: https://doi.org/10.1115/IPACK2021-69719

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Topics: Adhesives, Heat, Mechanical behavior, Mechanical properties, Phase transitions

Proceedings Papers

Thermo-Mechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis

Dustin Pense, Hayden Carlton, David Huitink

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A009, October 7–9, 2019

Paper No: IPACK2019-6416

DOI: https://doi.org/10.1115/IPACK2019-6416

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Topics: Event history analysis, Thermomechanics, Reliability, Stress, Testing, Thermal conductivity, Adhesion, Adhesives, Cycles, Electronic packages

Proceedings Papers

Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties

Promod R. Chowdhury, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A007, October 7–9, 2019

Paper No: IPACK2019-6561

DOI: https://doi.org/10.1115/IPACK2019-6561

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Topics: Fatigue life, Finite element analysis, Materials properties, Modeling, Stress, Viscoelasticity, Temperature, Polymers, Simulation, Relaxation (Physics)

Proceedings Papers

Stress Evaluation of Flexible Displays With Multiple-Laminations Architecture Enabled by Experimental Measurement and Simulation Based Factorial Design

Chang-Chun Lee, Pei-Chen Huang, Chi-Wei Wang, Oscar Chuang

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 7–9, 2019

Paper No: IPACK2019-6541

DOI: https://doi.org/10.1115/IPACK2019-6541

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Topics: Design, Finite element analysis, Lamination, Light-emitting diodes, Simulation, Stress, Adhesives, Coatings, Fatigue, Materials properties

Proceedings Papers

Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours

Pradeep Lall, Amrit Abrol, Nakul Kothari, Ben Leever, Scott Miller

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 7–9, 2019

Paper No: IPACK2019-6569

DOI: https://doi.org/10.1115/IPACK2019-6569

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Topics: Additive manufacturing, Aerosols, Temperature, Printing, Sintering, Shear (Mechanics), Stress, Failure, Manufacturing, Mechanical properties

Proceedings Papers

Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)

Hao Huang, Qian Jiang, Abhijit Dasgupta, Ehsan Mirbagheri, Krishna Darbha

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, August 27–30, 2018

Paper No: IPACK2018-8345

DOI: https://doi.org/10.1115/IPACK2018-8345

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Topics: Adhesives, Creep, Pressure, Stress, Bonding, Hydrostatics, Temperature, Cavitation, Cavities, Design

Proceedings Papers

Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging

Dinesh P. R. Thanu, Roozbeh Danaei, Alexander Bermudez, Sergio A. Chan, Suzana Prstic

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, August 27–30, 2018

Paper No: IPACK2018-8254

DOI: https://doi.org/10.1115/IPACK2018-8254

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Topics: Integrated circuit packaging, Metal bonding, Polymers, Bonding, Manufacturing, Metals, Adhesion, Warping, Adhesives, Chemistry

Proceedings Papers

Effect of Corner Staking on the Fatigue Life of BGA Under Thermal Cycling

Deng Yun Chen, Michael Osterman

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, August 29–September 1, 2017

Paper No: IPACK2017-74249

DOI: https://doi.org/10.1115/IPACK2017-74249

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Topics: Ball-Grid-Array packaging, Corners (Structural elements), Fatigue life, Solder joints, Solders, Adhesives, Failure, Materials properties, Stress, Temperature

Proceedings Papers

Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer

Naoya Saiki, Yuichiro Komasu, Kazuto Aizawa, Jun Maeda

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, August 29–September 1, 2017

Paper No: IPACK2017-74010

DOI: https://doi.org/10.1115/IPACK2017-74010

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Topics: Adhesives, Pressure, Semiconductor wafers, Ultraviolet radiation, String, Finite element analysis, Deformation, Elongation, Finite element model, Fracture (Materials)

Proceedings Papers

Mechanical Characterization of Assemblies Bonded With Pressure-Sensitive Adhesives (PSAs)

Hao Huang, Abhijit Dasgupta, Ehsan Mirbagheri, Srini Boddapati

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A027, July 6–9, 2015

Paper No: IPACK2015-48707

DOI: https://doi.org/10.1115/IPACK2015-48707

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Topics: Adhesives, Pressure, Bonding, Manufacturing, Mechanical behavior, Stress, Creep, Temperature, Failure mechanisms

Proceedings Papers

Physics Based Requirements for Qualification of BGA Components in Temperature Cycling

Ru Han, Milena Vujosevic, Min Pei

Paper No: IPACK2015-48578

DOI: https://doi.org/10.1115/IPACK2015-48578

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Topics: Ball-Grid-Array packaging, Physics, Temperature, Adhesives, Package on package, Deformation, Reliability, Solder joints, Computer simulation, Damage

Proceedings Papers

MEMS Die Warpage During Curing of Die Attach Material

Hohyung Lee, Ruiyang Liu, Seungbae Park, Xiaojie Xue

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A004, July 6–9, 2015

Paper No: IPACK2015-48010

DOI: https://doi.org/10.1115/IPACK2015-48010

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Topics: Hardening (Curing), Microelectromechanical systems, Warping, Materials properties, Finite element analysis, Manufacturing, Shrinkage (Materials), Stress, Adhesives, Glass transition

Proceedings Papers

Shrinkage of Post-Cure Die Attach Adhesives During Isothermal Storage

Ruiyang Liu, HoHyung Lee, Seungbae Park, Xiaojie Xue

Paper No: IPACK2015-48086

DOI: https://doi.org/10.1115/IPACK2015-48086

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Topics: Adhesives, Shrinkage (Materials), Storage, Finite element analysis, Sensors, Viscoelasticity, Epoxy adhesives, Epoxy resins, MEMS packaging, Microelectromechanical systems

Proceedings Papers

Development of Heat Transfer Tools for Sizing Flexible Graphite Spreaders in Mobile Applications

Rick Beyerle, Gary Shives

Paper No: IPACK2015-48523

DOI: https://doi.org/10.1115/IPACK2015-48523

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Topics: Graphite, Heat transfer, Computer software, Errors, Flat heat pipes, Heat, Thermal conductivity, Accounting, Adhesives, Computational fluid dynamics

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NARROW

Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Additive Manufacturing of Electronic Patterns for Harsh Environments

Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment

Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability of Flexible Encapsulation in FHE Applications

Printed Flexible LC Filter Using Additive Micro-Dispensing With Silver Conductive Paste and ECA for Component Attachment

Mechanical Behavior of Heat Activated Film Adhesives

Thermo-Mechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis

Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties

Stress Evaluation of Flexible Displays With Multiple-Laminations Architecture Enabled by Experimental Measurement and Simulation Based Factorial Design

Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours

Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)

Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging

Effect of Corner Staking on the Fatigue Life of BGA Under Thermal Cycling

Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer

Mechanical Characterization of Assemblies Bonded With Pressure-Sensitive Adhesives (PSAs)

Physics Based Requirements for Qualification of BGA Components in Temperature Cycling

MEMS Die Warpage During Curing of Die Attach Material

Shrinkage of Post-Cure Die Attach Adhesives During Isothermal Storage

Development of Heat Transfer Tools for Sizing Flexible Graphite Spreaders in Mobile Applications

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