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Proceedings Papers

Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 25–27, 2022

Paper No: IPACK2022-97452

DOI: https://doi.org/10.1115/IPACK2022-97452

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Topics: Alloys, Shock (Mechanics), Solders, Vibration, Reliability, Aerospace industry, Climate, Defense industry, Elastic moduli, Electronics

Proceedings Papers

High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A010, October 25–27, 2022

Paper No: IPACK2022-97438

DOI: https://doi.org/10.1115/IPACK2022-97438

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Topics: Shock (Mechanics), Solders, Temperature, Operating temperature, Alloys, High temperature, Stress, Stress-strain curves, Testing, Aerospace industry

Proceedings Papers

Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A013, October 25–27, 2022

Paper No: IPACK2022-97449

DOI: https://doi.org/10.1115/IPACK2022-97449

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Topics: Mechanical properties, Solders, Temperature, Alloys, Storage, Aerospace industry, Automotive industry, Constitutive equations, Finite element analysis, Low temperature materials

Proceedings Papers

Non-Perpendicular Orientation High-G Impact Reliability of Electronics Potted Assemblies

Pradeep Lall, Aathi Raja Ram Pandurangan, Jeff Suhling, John Deep

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 27–29, 2020

Paper No: IPACK2020-2648

DOI: https://doi.org/10.1115/IPACK2020-2648

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Topics: Electronics, Reliability, Shock (Mechanics), Vehicles, Manufacturing, Solder joints, Aerospace industry, Ball-Grid-Array packaging, Capacitors, Ceramics

Proceedings Papers

High Strain Rate Mechanical Properties of SAC-Q Between -65°C and +200°C After Exposure to Isothermal Aging

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 27–29, 2020

Paper No: IPACK2020-2660

DOI: https://doi.org/10.1115/IPACK2020-2660

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Topics: High temperature, Mechanical properties, Testing, Alloys, Operating temperature, Solders, Stress, Aerospace industry, Biomedicine, Electronic components

Proceedings Papers

Evaluation of a Lead Glass for Encapsulating High-Temperature Power Modules for Aerospace Application

Lanbing Liu, David Nam, Ben Guo, Rolando Burgos, Guo-quan Lu

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A006, October 7–9, 2019

Paper No: IPACK2019-6393

DOI: https://doi.org/10.1115/IPACK2019-6393

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Topics: Aerospace industry, Glass, High temperature, Packaging, Stress

Proceedings Papers

Challenges in 3D Printing of High Conductivity Copper

Tahany El-Wardany, Ying She, Vijay Jagdale, Jacquelynn K. Garofano, Joe Liou, Wayde Schmidt

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, August 29–September 1, 2017

Paper No: IPACK2017-74306

DOI: https://doi.org/10.1115/IPACK2017-74306

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Topics: Additive manufacturing, Copper, Electrical conductivity, Thermal conductivity, Engines, Motors, Electromagnetic induction, Machinery, Aerospace industry, Electric vehicles

Proceedings Papers

Numerical Performance Characterization of an Innovative Micro-Scale Electrohydrodynamic Conduction Pumping Device

Michal Talmor, Jamal Yagoobi

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A024, August 29–September 1, 2017

Paper No: IPACK2017-74107

DOI: https://doi.org/10.1115/IPACK2017-74107

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Topics: Electrohydrodynamics, Heat conduction, Microscale devices, Performance characterization, Pumps, Electrodes, Fluids, Electronics, Flow (Dynamics), Aerospace industry

Proceedings Papers

Advancements in Silver Wire Bonding

Subramani Manoharan, Chandradip Patel, Patrick McCluskey

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, August 29–September 1, 2017

Paper No: IPACK2017-74286

DOI: https://doi.org/10.1115/IPACK2017-74286

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Topics: Silver, Wire bonding, Copper, Wire, Reliability, Bonding, Corrosion, Light-emitting diodes, Palladium, Aerospace industry

Proceedings Papers

Hot Spot Elimination by Thin and Smart Heat Spreader

Mohammad Shahed Ahamed, Yuji Saito, Masataka Mochizuki, Koichi Mashiko

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A049, July 6–9, 2015

Paper No: IPACK2015-48019

DOI: https://doi.org/10.1115/IPACK2015-48019

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Topics: Flat heat pipes, Heat pipes, Heat, Clocks, Computer cooling, Metals, Aerospace industry, Cooling, Data centers, Experimental analysis

Proceedings Papers

An Innovative Way to Solve Problems Associated With Circular Connector Electrical Bonding Resistance

Frank Fan Wang

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A001, July 16–18, 2013

Paper No: IPACK2013-73029

DOI: https://doi.org/10.1115/IPACK2013-73029

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Topics: Bonding, Aluminum, Aerospace industry, Electronic equipment, Military systems

Proceedings Papers

Liquid Cooled High Power Aerospace Electronics Fluid Channel Layout Design Strategy Based on Analytical Calculation

Frank Fan Wang

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A047, July 16–18, 2013

Paper No: IPACK2013-73262

DOI: https://doi.org/10.1115/IPACK2013-73262

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Topics: Aerospace industry, Design, Electronics, Fluids, Cooling, Computational fluid dynamics, Computer software, Pressure drop, Computers, Dimensions

Proceedings Papers

Effect of Aging on Tensile Properties and Microstructures of Eutectic Sn-Pb Solder With Small Amounts of Au and Pd for Aerospace Application

Ryou Kikuchi, Ikuo Shohji, Yuta Saitoh, Norio Nemoto, Tsuyoshi Nakagawa, Nobuaki Ebihara, Fusao Iwase

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 667-672, July 6–8, 2011

Paper No: IPACK2011-52025

DOI: https://doi.org/10.1115/IPACK2011-52025

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Topics: Aerospace industry, Solders, Tensile strength, Tin, Elongation, Brittleness, Electrodes, Mechanical properties

Proceedings Papers

Aging Effects on the Mechanical Behavior and Reliability of SAC Alloys

Yifei Zhang, Zijie Cai, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 959-976, July 19–23, 2009

Paper No: InterPACK2009-89373

DOI: https://doi.org/10.1115/InterPACK2009-89373

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Topics: Alloys, Mechanical behavior, Reliability, Temperature, Creep, Solders, Lead-free solders, Failure, Silver, Accelerated life testing

Proceedings Papers

Modelling the Reliability of Components on Flexible Substrates

J. Rizvi, C. Yin, C. Bailey, H. Lu

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 375-380, July 8–12, 2007

Paper No: IPACK2007-33820

DOI: https://doi.org/10.1115/IPACK2007-33820

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Topics: Modeling, Reliability, Aerospace industry, Computers, Copper, Design, Dielectric materials, Flexible electronics, Manufacturing, Packaging

Proceedings Papers

Force Air Cooled Electronic Equipment Under Loss of Cooling Condition With Blocked Air Duct

Frank Fan Wang

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 211-216, July 8–12, 2007

Paper No: IPACK2007-33070

DOI: https://doi.org/10.1115/IPACK2007-33070

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Topics: Cooling, Ducts, Electronic equipment, Design, Aerospace industry, Air flow, Buoyancy, Computational fluid dynamics, Electronics, Failure

Proceedings Papers

Evolution of Lead Free Solder Material Behavior Under Elevated Temperature Aging

Hongtao Ma, Jeffrey C. Suhling, Yifei Zhang, Pradeep Lall, Michael J. Bozack

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 563-579, July 8–12, 2007

Paper No: IPACK2007-33545

DOI: https://doi.org/10.1115/IPACK2007-33545

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Topics: Lead-free solders, Temperature, Solders, Creep, Reliability, Solder joints, Alloys, Failure, Mechanical behavior, Mechanical properties

Proceedings Papers

Simplified Network Based Modeling of Cold Plate in a CFD Environment

Debabrata Pal, Mark Severson

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1421-1426, July 17–22, 2005

Paper No: IPACK2005-73202

DOI: https://doi.org/10.1115/IPACK2005-73202

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Topics: Computational fluid dynamics, Modeling, Flow (Dynamics), Electronics, Manufacturing, Plates (structures), Aerospace industry, Boundary-value problems, Design, Heat

Proceedings Papers

Enhancing Thermoelectric Energy Recovery Via Modulations of Source Temperature for Cyclical Heat Loadings

R. McCarty, K. P. Hallinan, B. Sanders, T. Somphone

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2109-2122, July 17–22, 2005

Paper No: IPACK2005-73010

DOI: https://doi.org/10.1115/IPACK2005-73010

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Topics: Energy recovery, Heat, Temperature, Thermoelectric devices, Aerospace industry, Computer simulation, Exergy, Heat recovery, Switches, Waste heat

Proceedings Papers

A Broadband Wave Division Multiplexed (WDM) Local Area Network for Military Aircraft Using Commercial Off-the-Shelf (COTS) Components

Andrew S. Glista, Jr., John Nahvi

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 621-628, July 6–11, 2003

Paper No: IPACK2003-35062

DOI: https://doi.org/10.1115/IPACK2003-35062

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Topics: Military aircraft, Waves, Fibers, Aircraft, Cables, Design, Flight, Testing, Signals, Aerospace industry

NARROW

Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration

High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C

Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days

Non-Perpendicular Orientation High-G Impact Reliability of Electronics Potted Assemblies

High Strain Rate Mechanical Properties of SAC-Q Between -65°C and +200°C After Exposure to Isothermal Aging

Evaluation of a Lead Glass for Encapsulating High-Temperature Power Modules for Aerospace Application

Challenges in 3D Printing of High Conductivity Copper

Numerical Performance Characterization of an Innovative Micro-Scale Electrohydrodynamic Conduction Pumping Device

Advancements in Silver Wire Bonding

Hot Spot Elimination by Thin and Smart Heat Spreader

An Innovative Way to Solve Problems Associated With Circular Connector Electrical Bonding Resistance

Liquid Cooled High Power Aerospace Electronics Fluid Channel Layout Design Strategy Based on Analytical Calculation

Effect of Aging on Tensile Properties and Microstructures of Eutectic Sn-Pb Solder With Small Amounts of Au and Pd for Aerospace Application

Aging Effects on the Mechanical Behavior and Reliability of SAC Alloys

Modelling the Reliability of Components on Flexible Substrates

Force Air Cooled Electronic Equipment Under Loss of Cooling Condition With Blocked Air Duct

Evolution of Lead Free Solder Material Behavior Under Elevated Temperature Aging

Simplified Network Based Modeling of Cold Plate in a CFD Environment

Enhancing Thermoelectric Energy Recovery Via Modulations of Source Temperature for Cyclical Heat Loadings

A Broadband Wave Division Multiplexed (WDM) Local Area Network for Military Aircraft Using Commercial Off-the-Shelf (COTS) Components

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