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Proceedings Papers

Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 25–27, 2022

Paper No: IPACK2022-97452

DOI: https://doi.org/10.1115/IPACK2022-97452

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Topics: Alloys, Shock (Mechanics), Solders, Vibration, Reliability, Aerospace industry, Climate, Defense industry, Elastic moduli, Electronics

Proceedings Papers

High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A010, October 25–27, 2022

Paper No: IPACK2022-97438

DOI: https://doi.org/10.1115/IPACK2022-97438

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Topics: Shock (Mechanics), Solders, Temperature, Operating temperature, Alloys, High temperature, Stress, Stress-strain curves, Testing, Aerospace industry

Proceedings Papers

Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A013, October 25–27, 2022

Paper No: IPACK2022-97449

DOI: https://doi.org/10.1115/IPACK2022-97449

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Topics: Mechanical properties, Solders, Temperature, Alloys, Storage, Aerospace industry, Automotive industry, Constitutive equations, Finite element analysis, Low temperature materials

Proceedings Papers

Thermal Transport Across Al-(Al x Ga 1-x ) 2 O 3 and Al-Ga 2 O 3 Interfaces

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A005, October 26–28, 2021

Paper No: IPACK2021-74116

DOI: https://doi.org/10.1115/IPACK2021-74116

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Topics: Alloys, Aluminum, Cathode rays, Chemical reactions, Cooling, Electrical conductance, Electron beams, Electronics, Energy dissipation, Gallium

Proceedings Papers

Effect of Mechanical Cycling at Elevated Temperatures on The Constitutive Properties and Microstructure of Lead Free Solder Alloys

Mohd Aminul Hoque, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A014, October 26–28, 2021

Paper No: IPACK2021-73548

DOI: https://doi.org/10.1115/IPACK2021-73548

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Topics: Alloys, Creep, Lead-free solders, Stress-strain curves, Temperature

Proceedings Papers

Enhanced Processability and Thermal Fatigue Reliability With Low Melting Point SnBi Solder Alloy LMPA-Q

Bart Vandevelde, Chinmay Nawghane, Riet Labie, Ralph Lauwaert, Daniel Werkhoven

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A013, October 26–28, 2021

Paper No: IPACK2021-73456

DOI: https://doi.org/10.1115/IPACK2021-73456

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Topics: Alloys, Fatigue, Melting point, Reliability, Solders, Temperature, Ball-Grid-Array packaging, Contamination, Failure, Failure analysis

Proceedings Papers

Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R After Exposure to Isothermal Aging of 50°C Up To 8 Months

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A022, October 26–28, 2021

Paper No: IPACK2021-74069

DOI: https://doi.org/10.1115/IPACK2021-74069

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Topics: Low temperature, Mechanical properties, Storage, Temperature, Alloys, Solders, Avionics, Climate, Design, Electronic packages

Proceedings Papers

Low Temperature Material Characterization of Lead-Free SAC Solder Alloy at High Strain Rate After Prolonged High Temperature Storage

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A021, October 26–28, 2021

Paper No: IPACK2021-74068

DOI: https://doi.org/10.1115/IPACK2021-74068

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Topics: Alloys, High temperature, Low temperature materials, Solders, Storage

Proceedings Papers

Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints

Mohammad Ashraful Haq, Mohd Aminul Hoque, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A011, October 26–28, 2021

Paper No: IPACK2021-73348

DOI: https://doi.org/10.1115/IPACK2021-73348

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Topics: Intermetallic compounds, Lead-free solders, Solder joints, Alloys, Reliability, Copper, Elastic moduli, Electronic packaging, Nanoindentation, Polishing

Proceedings Papers

Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A020, October 26–28, 2021

Paper No: IPACK2021-74067

DOI: https://doi.org/10.1115/IPACK2021-74067

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Topics: Alloys, High temperature, Mechanical properties, Shock (Mechanics), Solders, Temperature, Testing, Vibration, Viscoplasticity

Proceedings Papers

Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging

Jing Wu, Mohammad S. Alam, KM Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, October 27–29, 2020

Paper No: IPACK2020-2695

DOI: https://doi.org/10.1115/IPACK2020-2695

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Topics: Intermetallic compounds, Lead-free solders, Solders, Particulate matter, Tin, Alloys, Mechanical behavior, Diffusion (Physics), High temperature, Mechanical properties

Proceedings Papers

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 27–29, 2020

Paper No: IPACK2020-2658

DOI: https://doi.org/10.1115/IPACK2020-2658

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Topics: Alloys, Temperature, Operating temperature, Solders, Avionics, Constitutive equations, Electronic equipment, Electronics, Energy dissipation, Engines

Proceedings Papers

High Strain Rate Low Temperature Properties for SAC-R After Exposure to Isothermal Aging

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 27–29, 2020

Paper No: IPACK2020-2659

DOI: https://doi.org/10.1115/IPACK2020-2659

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Topics: Alloys, Avionics, Climate, Design, Electronic packages, Electronic packaging, High temperature, Lead-free solders, Low temperature, Low temperature materials

Proceedings Papers

High Strain Rate Mechanical Properties of SAC-Q Between -65°C and +200°C After Exposure to Isothermal Aging

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 27–29, 2020

Paper No: IPACK2020-2660

DOI: https://doi.org/10.1115/IPACK2020-2660

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Topics: High temperature, Mechanical properties, Testing, Alloys, Operating temperature, Solders, Stress, Aerospace industry, Biomedicine, Electronic components

Proceedings Papers

Feature Vector Identification and Prognostics of SAC305 PCB’s for Varying Conditions of Temperature and Vibration Loads

Pradeep Lall, Tony Thomas, Ken Blecker

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A011, October 27–29, 2020

Paper No: IPACK2020-2679

DOI: https://doi.org/10.1115/IPACK2020-2679

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Topics: Alloys, Stress, Temperature, Vibration

Proceedings Papers

High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100°C

Pradeep Lall, Vishal Mehta, Jeff Suhling, David Locker

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 7–9, 2019

Paper No: IPACK2019-6576

DOI: https://doi.org/10.1115/IPACK2019-6576

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Topics: Mechanical properties, Storage, Temperature, Alloys, Operating temperature, Electronic components, Electronics, High temperature, Lead-free solders, Shock (Mechanics)

Proceedings Papers

Modeling and Analysis of a Shape Memory Alloy-Based Adaptive Regulator for Thermal Management

Gary Liang, Ashkan Sadeghifard, Anirudh Krishna, Jaeho Lee, Edwin A. Peraza Hernandez

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 7–9, 2019

Paper No: IPACK2019-6402

DOI: https://doi.org/10.1115/IPACK2019-6402

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Topics: Alloys, Modeling, Shapes, Thermal management, Springs, Temperature, Solar energy, Deformation, Irradiation (Radiation exposure), Actuators

Proceedings Papers

Metallic PCM’s Microstructural Stability Under Repetitive Melting/Solidification Cycles

Rafael Báez, Luis E. González, Pedro O. Quintero, Lauren M. Boteler

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A005, October 7–9, 2019

Paper No: IPACK2019-6385

DOI: https://doi.org/10.1115/IPACK2019-6385

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Topics: Cooling, Cycles, Melting, Solidification, Stability, Thermal stability, Alloys, Metals, Temperature, Thermal management

Proceedings Papers

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A027, October 7–9, 2019

Paper No: IPACK2019-6577

DOI: https://doi.org/10.1115/IPACK2019-6577

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Topics: Alloys, Temperature, Lead-free solders, Solders, Finite element analysis, Avionics, Constitutive equations, Density, Electronic components, Electronics

Proceedings Papers

Fatigue Life of Sn3.0Ag0.5Cu Solder Alloys Under Combined Shear and Compressive Loads

Travis Dale, Yuvraj Singh, Ian Bernander, Ganesh Subbarayan, Carol Handwerker, Peng Su, Bernard Glasauer

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 7–9, 2019

Paper No: IPACK2019-6507

DOI: https://doi.org/10.1115/IPACK2019-6507

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Topics: Alloys, Fatigue life, Shear (Mechanics), Solders, Stress, Solder joints, Fatigue, Bending (Stress), Compression, Cycles

NARROW

Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration

High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C

Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days

Thermal Transport Across Al-(Al x Ga 1-x ) 2 O 3 and Al-Ga 2 O 3 Interfaces

Effect of Mechanical Cycling at Elevated Temperatures on The Constitutive Properties and Microstructure of Lead Free Solder Alloys

Enhanced Processability and Thermal Fatigue Reliability With Low Melting Point SnBi Solder Alloy LMPA-Q

Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R After Exposure to Isothermal Aging of 50°C Up To 8 Months

Low Temperature Material Characterization of Lead-Free SAC Solder Alloy at High Strain Rate After Prolonged High Temperature Storage

Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints

Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging

Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

High Strain Rate Low Temperature Properties for SAC-R After Exposure to Isothermal Aging

High Strain Rate Mechanical Properties of SAC-Q Between -65°C and +200°C After Exposure to Isothermal Aging

Feature Vector Identification and Prognostics of SAC305 PCB’s for Varying Conditions of Temperature and Vibration Loads

High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100°C

Modeling and Analysis of a Shape Memory Alloy-Based Adaptive Regulator for Thermal Management

Metallic PCM’s Microstructural Stability Under Repetitive Melting/Solidification Cycles

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

Fatigue Life of Sn3.0Ag0.5Cu Solder Alloys Under Combined Shear and Compressive Loads

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