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Proceedings Papers

Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A013, October 25–27, 2022

Paper No: IPACK2022-97449

DOI: https://doi.org/10.1115/IPACK2022-97449

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Topics: Mechanical properties, Solders, Temperature, Alloys, Storage, Aerospace industry, Automotive industry, Constitutive equations, Finite element analysis, Low temperature materials

Proceedings Papers

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles

Bakhtiyar Mohammad Nafis, Ange-Christian Iradukunda, Imam Al Razi, David R. Huitink, Yarui Peng

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 7–9, 2019

Paper No: IPACK2019-6429

DOI: https://doi.org/10.1115/IPACK2019-6429

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Topics: Electronics, Hybrid electric vehicles, Reliability, Thermal management, Phase change materials, Cooling, Temperature, Electronic packaging, Heat, Automobiles

Proceedings Papers

Failure Mechanism Assessment of TO-247 Packaged SiC Power Devices

Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Dag Andersson, Zsolt Toth-Pal, Mattias Forslund, Samer Shisha

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A016, August 27–30, 2018

Paper No: IPACK2018-8385

DOI: https://doi.org/10.1115/IPACK2018-8385

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Topics: Failure mechanisms, Electronics, Reliability, Acoustics, Automotive industry, Cooling, Elastic moduli, Failure analysis, Heating, High temperature

Proceedings Papers

Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices for Automotive Applications

Alexander Otto, Sven Rzepka, Bernhard Wunderle

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, August 27–30, 2018

Paper No: IPACK2018-8348

DOI: https://doi.org/10.1115/IPACK2018-8348

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Topics: Automotive industry, Cycles, Electronics, Stress, Reliability, Heating, Testing, Failure, Failure mechanisms, Junctions

Proceedings Papers

Effect of Alloy Composition and Aging on the Survivability of Leadfree Solders in High Temperature Vibration in Automotive Environments

Pradeep Lall, Vikas Yadav, Di Zhang, Jeff Suhling

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, August 29–September 1, 2017

Paper No: IPACK2017-74233

DOI: https://doi.org/10.1115/IPACK2017-74233

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Topics: Alloys, High temperature, Lead-free solders, Vibration, Temperature, Electronics, Vehicles, Solder joints, Solders, Automotive industry

Proceedings Papers

Knowledge Based Qualification Process to Evaluate Vibration Induced Failures in Electronic Components

Karumbu Meyyappan, Milena Vujosevic, Qifeng Wu, Pramod Malatkar, Charles Hill, Ryan Parrott

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, August 29–September 1, 2017

Paper No: IPACK2017-74190

DOI: https://doi.org/10.1115/IPACK2017-74190

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Topics: Electronic components, Failure, Vibration, Engineering standards, Reliability, Damage, Electronics, Failure mechanisms, Risk, Roads

Proceedings Papers

Application Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Sven Rzepka, Alexander Otto, Dietmar Vogel, Rainer Dudek

Paper No: IPACK2017-74208

DOI: https://doi.org/10.1115/IPACK2017-74208

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Topics: Electronics, Reliability, Safety, Automotive industry, Failure, Vehicles, Actuators, Computation, Design, Electric vehicles

Proceedings Papers

Convective Heat Transfer Coefficients of Automatic Transmission Fluid Jets With Implications for Electric Machine Thermal Management

Kevin Bennion, Gilberto Moreno

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A010, July 6–9, 2015

Paper No: IPACK2015-48382

DOI: https://doi.org/10.1115/IPACK2015-48382

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Topics: Convection, Jets, Machinery, Thermal management, Transmission fluids, Heat transfer coefficients, Temperature, Automotive industry, Cooling, Cooling systems

Proceedings Papers

Survivability of MEMS Accelerometer Under Sequential Thermal and High-G Mechanical Shock Environments

Pradeep Lall, Amrit Abrol, Lee Simpson, Jessica Glover

Paper No: IPACK2015-48790

DOI: https://doi.org/10.1115/IPACK2015-48790

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Topics: Accelerometers, Microelectromechanical systems, Shock (Mechanics), Reliability, Automotive industry, Complementary metal oxide semiconductors, Design, Failure mechanisms, Low temperature, Lumber

Proceedings Papers

A Methodology for High Cycle Fatigue Characterization of Lead-Free Interconnects Under Simultaneous Harsh Environments of High Temperature and Vibration

Pradeep Lall, Geeta Limaye

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A017, July 16–18, 2013

Paper No: IPACK2013-73245

DOI: https://doi.org/10.1115/IPACK2013-73245

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Topics: High cycle fatigue, High temperature, Vibration, Temperature, Solders, Stress, Alloys, Electronics, Failure, Failure mechanisms

Proceedings Papers

Steady-State and Transient Thermal Performance Optimization of Power Automotive Modules

Victor Chiriac

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 371-378, July 19–23, 2009

Paper No: InterPACK2009-89136

DOI: https://doi.org/10.1115/InterPACK2009-89136

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Topics: Optimization, Steady state, Transients (Dynamics), Temperature, Automotive industry, Boundary-value problems, Computer simulation, Corners (Structural elements), Heat, Heat budget (Physics)

Proceedings Papers

Investigation of Drill Hole Quality of Multi-Layer PWBs for High Current Capacity

Eiichi Aoyama, Toshiki Hirogaki, Keiji Ogawa, Kenichi Mori, Yuusuke Itagaki

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 909-915, July 8–12, 2007

Paper No: IPACK2007-33255

DOI: https://doi.org/10.1115/IPACK2007-33255

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Topics: Drills (Tools), Hole quality, Copper foil, Cutting, Stress, Automobiles, Automotive industry, Drilling, Electronic equipment, Electronic systems

Proceedings Papers

System Level Thermal Optimization of an Automotive Lightning Module Incorporating Several Power Devices

Victor Chiriac, Tien-Yu Tom Lee

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 241-247, July 8–12, 2007

Paper No: IPACK2007-33707

DOI: https://doi.org/10.1115/IPACK2007-33707

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Topics: Lightning, Optimization, Energy dissipation, Temperature, Design, Pins (Engineering), Heat, Heat budget (Physics), Junctions, Automotive industry

Proceedings Papers

System Level Considerations in the Incorporation of a Component Thermal Model for an Automotive Application

Victor Chiriac, Tom Lee, Arvind Krishna, Venkata Krishnan, Rodney Lawrence

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 119-127, July 17–22, 2005

Paper No: IPACK2005-73101

DOI: https://doi.org/10.1115/IPACK2005-73101

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Topics: Automotive industry, Boundary-value problems, Computer cooling, Design, Electrical conductivity, Modeling, Simulation, Steady state, Temperature, Thermal analysis

Proceedings Papers

System Level Thermal Evaluation and Optimization of an Automotive Module Incorporating Several Power Packages

Victor Chiriac, Tom Lee, Kim Gauen

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 113-118, July 17–22, 2005

Paper No: IPACK2005-73100

DOI: https://doi.org/10.1115/IPACK2005-73100

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Topics: Automotive industry, Computational fluid dynamics, Computer simulation, Design, Energy dissipation, Heat, Heat budget (Physics), Heat conduction, Heat transfer coefficients, Heating

NARROW

Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles

Failure Mechanism Assessment of TO-247 Packaged SiC Power Devices

Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices for Automotive Applications

Effect of Alloy Composition and Aging on the Survivability of Leadfree Solders in High Temperature Vibration in Automotive Environments

Knowledge Based Qualification Process to Evaluate Vibration Induced Failures in Electronic Components

Application Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Convective Heat Transfer Coefficients of Automatic Transmission Fluid Jets With Implications for Electric Machine Thermal Management

Survivability of MEMS Accelerometer Under Sequential Thermal and High-G Mechanical Shock Environments

A Methodology for High Cycle Fatigue Characterization of Lead-Free Interconnects Under Simultaneous Harsh Environments of High Temperature and Vibration

Steady-State and Transient Thermal Performance Optimization of Power Automotive Modules

Investigation of Drill Hole Quality of Multi-Layer PWBs for High Current Capacity

System Level Thermal Optimization of an Automotive Lightning Module Incorporating Several Power Devices

System Level Considerations in the Incorporation of a Component Thermal Model for an Automotive Application

System Level Thermal Evaluation and Optimization of an Automotive Module Incorporating Several Power Packages

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