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Proceedings Papers

Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods

Yangyang Lai, Chongyang Cai, Ke Pan, Junbo Yang, Jonghwan Ha, Pengcheng Yin, Karthik Deo, Seungbae Park
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A006, October 25–27, 2022
Paper No: IPACK2022-97349
DOI: https://doi.org/10.1115/IPACK2022-97349
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Topics: Ball-Grid-Array packages, Ball-Grid-Array packaging, Reliability, Thermomechanics, Cycles, Solders, Corners (Structural elements), Bonding, Deformation, Stiffness
Proceedings Papers

Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Edward Davis
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A009, October 25–27, 2022
Paper No: IPACK2022-97433
DOI: https://doi.org/10.1115/IPACK2022-97433
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Topics: High temperature, Modeling, Reliability, Flip-chip, Solder joints, Ball-Grid-Array packaging, Electronics, Fatigue failure, Fatigue life, Materials degradation
Proceedings Papers

A Study on Parameters That Impact the Thermal Fatigue Life of BGA Solder Joints

Karthik Arun Deo, Raymond-Noel Kono, Chongyang Cai, Junbo Yang, Yangyang Lai, Seungbae Park
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A005, October 25–27, 2022
Paper No: IPACK2022-97253
DOI: https://doi.org/10.1115/IPACK2022-97253
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Topics: Ball-Grid-Array packaging, Fatigue life, Solder joints, Surface mount devices
Proceedings Papers

Enhanced Processability and Thermal Fatigue Reliability With Low Melting Point SnBi Solder Alloy LMPA-Q

Bart Vandevelde, Chinmay Nawghane, Riet Labie, Ralph Lauwaert, Daniel Werkhoven
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A013, October 26–28, 2021
Paper No: IPACK2021-73456
DOI: https://doi.org/10.1115/IPACK2021-73456
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Topics: Alloys, Fatigue, Melting point, Reliability, Solders, Temperature, Ball-Grid-Array packaging, Contamination, Failure, Failure analysis
Proceedings Papers

Electrical Performances of Package Layout for High Speed Networking and Cloud Computing Application

Ming-Han Zhuang, Teny Shih, David Lai, Yu-Po Wang
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 26–28, 2021
Paper No: IPACK2021-66660
DOI: https://doi.org/10.1115/IPACK2021-66660
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Topics: Ball-Grid-Array packaging, Cloud computing, Internet, Signals
Proceedings Papers

Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures

S. M. Kamrul Hasan, Abdullah Fahim, Mohammad Al Ahsan, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A016, October 26–28, 2021
Paper No: IPACK2021-74044
DOI: https://doi.org/10.1115/IPACK2021-74044
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Topics: Lead-free solders, Mechanical properties, Solder joints, Solders, Tensile strength, Thermal shock, Yield strength, Stress, Cycles, High temperature
Proceedings Papers

Non-Perpendicular Orientation High-G Impact Reliability of Electronics Potted Assemblies

Pradeep Lall, Aathi Raja Ram Pandurangan, Jeff Suhling, John Deep
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 27–29, 2020
Paper No: IPACK2020-2648
DOI: https://doi.org/10.1115/IPACK2020-2648
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Topics: Electronics, Reliability, Shock (Mechanics), Vehicles, Manufacturing, Solder joints, Aerospace industry, Ball-Grid-Array packaging, Capacitors, Ceramics
Proceedings Papers

Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging

Pradeep Lall, Padmanava Choudhury, Jaimal Williamson
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 27–29, 2020
Paper No: IPACK2020-2676
DOI: https://doi.org/10.1115/IPACK2020-2676
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Topics: Ball-Grid-Array packaging, Composite building materials, Crack propagation, Damage, Delamination, Displacement, Electronics, Failure, Flip-chip, Fracture (Materials)
Proceedings Papers

High Performance Computing Package With Chip Module on Substrate Solutions

Ching Chia Chen, David Lai, Vito Lin, Yu Po Wang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 27–29, 2020
Paper No: IPACK2020-2547
DOI: https://doi.org/10.1115/IPACK2020-2547
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Topics: Ball-Grid-Array packaging, Bridges (Structures), Cloud computing, Corners (Structural elements), Data centers, Deformation, Elongation, Flip-chip, Flip-chip devices, Fracture (Materials)
Proceedings Papers

Time-Lapse Imagery and Quantitative Analysis of Microstructural Evolution of SAC305 BGA Joints During Extreme High Temperature Aging

KM Rafidh Hassan, Mohammad S. Alam, Jing Wu, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A016, October 27–29, 2020
Paper No: IPACK2020-2691
DOI: https://doi.org/10.1115/IPACK2020-2691
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Topics: Ball-Grid-Array packaging, High temperature, Lead-free solders, Particulate matter
Proceedings Papers

The Effects of Temperature, Strain Rate, and Aging on the Poisson’s Ratio of SAC Lead Free Solders

K. M. Rafidh Hassan, Mohammad S. Alam, Munshi Basit, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, August 27–30, 2018
Paper No: IPACK2018-8410
DOI: https://doi.org/10.1115/IPACK2018-8410
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Topics: Lead-free solders, Poisson ratio, Temperature effects, Solders, Temperature, Cooling, Finite element analysis, Finite element methods, Finite element model, Reliability
Proceedings Papers

Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions

Maxim Serebreni, Patrick McCluskey, David Hillman, Nathan Blattau, Craig Hillman
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, August 27–30, 2018
Paper No: IPACK2018-8338
DOI: https://doi.org/10.1115/IPACK2018-8338
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Topics: Cycles, Fatigue, Solders, Temperature, Solder joints, Ball-Grid-Array packages, Ball-Grid-Array packaging, Coatings, Dimensions, Electronic products
Proceedings Papers

Improved Approaches for FEA Analyses of PBGA Packages Subjected to Thermal Cycling

Chienchih Chen, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, August 27–30, 2018
Paper No: IPACK2018-8398
DOI: https://doi.org/10.1115/IPACK2018-8398
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Topics: Finite element analysis, Solder joints, Simulation, Electronic packaging, Stress, Algorithms, Alloys, Ball-Grid-Array packaging, Computers, Density
Proceedings Papers

Controlling the Solder Joint Reliability of eWLB Packages in Automotive Radar Applications Using a Design for Reliability Approach

M. Niessner, G. Haubner, W. Hartner, S. Pahlke
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A008, August 27–30, 2018
Paper No: IPACK2018-8379
DOI: https://doi.org/10.1115/IPACK2018-8379
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Topics: Design, Radar, Reliability, Solder joints, Simulation, Laminates, Accelerated life testing, Ball-Grid-Array packaging, Materials properties, Mechanical properties
Proceedings Papers

Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?

Qian Jiang, Abhishek Deshpande, Abhijit Dasgupta
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, August 29–September 1, 2017
Paper No: IPACK2017-74133
DOI: https://doi.org/10.1115/IPACK2017-74133
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Topics: Solders, Anisotropy, Tin, Solder joints, Ball-Grid-Array packaging, Crystals, Temperature, Alloys, Composite materials, Cooling
Proceedings Papers

Effect of Corner Staking on the Fatigue Life of BGA Under Thermal Cycling

Deng Yun Chen, Michael Osterman
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, August 29–September 1, 2017
Paper No: IPACK2017-74249
DOI: https://doi.org/10.1115/IPACK2017-74249
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Topics: Ball-Grid-Array packaging, Corners (Structural elements), Fatigue life, Solder joints, Solders, Adhesives, Failure, Materials properties, Stress, Temperature
Proceedings Papers

Knowledge Based Qualification Methodology to Evaluate Shock Induced Risks in BGA Components

Min Pei, Guru Arakere, Milena Vujosevic
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, August 29–September 1, 2017
Paper No: IPACK2017-74082
DOI: https://doi.org/10.1115/IPACK2017-74082
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Topics: Ball-Grid-Array packaging, Shock (Mechanics), Failure, Physics, Computer simulation, Deformation, Design, Stress
Proceedings Papers

Knowledge Based Requirement Calculation for Server BGAs Temperature Cycling (TC) Qualification

Min Pei, Milena Vujosevic, Sibasish Mukherjee
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, August 29–September 1, 2017
Paper No: IPACK2017-74081
DOI: https://doi.org/10.1115/IPACK2017-74081
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Topics: Temperature, Ball-Grid-Array packaging, Fluctuations (Physics), Accounting, Damage, Engineering standards, Failure, Physics, Reliability, Risk assessment
Proceedings Papers

The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages

Quang Nguyen, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, August 29–September 1, 2017
Paper No: IPACK2017-74273
DOI: https://doi.org/10.1115/IPACK2017-74273
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Topics: Electronic packages, Polymers, Stress, Reliability, Simulation, Weight (Mass), Absorption, Ball-Grid-Array packaging, Corrosion, Cracking (Materials)
Proceedings Papers

Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed Circuit Board Using X-Ray Micro-CT

Pradeep Lall, Kartik Goyal
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, August 29–September 1, 2017
Paper No: IPACK2017-74264
DOI: https://doi.org/10.1115/IPACK2017-74264
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Topics: Printed circuit boards, Reliability, Solders, X-rays, Deformation, Electronics, Manufacturing, Solder joints, Computerized tomography, Heating