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Proceedings Papers

High Brightness Illumination Based on Laser Light Diffusion With Mie Scattering

Mohammad Azarifar, Ceren Cengiz, Kerem Ocaksönmez, Asim Onal, Sedat Nizamoglu, Mehmet Arik
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 25–27, 2022
Paper No: IPACK2022-97220
DOI: https://doi.org/10.1115/IPACK2022-97220
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Topics: Brightness (Photometry), Diffusion (Physics), Electromagnetic scattering, Lasers, Radiation scattering, Scattering (Physics)
Proceedings Papers

Correlated Effects of Self-Heating, Light Output, and Efficiency of GaN Light-Emitting Diodes on Junction Temperature

Bikramjit Chatterjee, James Spencer Lundh, Daniel Shoemaker, Tae Kyoung Kim, Joon Seop Kwak, Jaehee Cho, Sukwon Choi
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, October 7–9, 2019
Paper No: IPACK2019-6426
DOI: https://doi.org/10.1115/IPACK2019-6426
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Topics: Gallium nitride, Heating, Junctions, Light-emitting diodes, Temperature, Brightness (Photometry), Indium gallium nitride, Nanoparticles, Quantum wells, Temperature measurement
Proceedings Papers

Robust Thermal Management for Embedded CPU and GPUs in Displays

Sung Ki Kim, Woo Young Kan, Sang Hak Kim, Vincent Tan, Gamal Refai-Ahmed, Ali Akbar Merrikh
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 7-11, July 6–8, 2011
Paper No: IPACK2011-52014
DOI: https://doi.org/10.1115/IPACK2011-52014
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Topics: Graphics processing units, Thermal management, Design, Reliability, Brightness (Photometry), Circuits, Corners (Structural elements), Energy dissipation, Heat, Manufacturing
Proceedings Papers

Heat Transfer Analysis and Design Optimization of ALOX High Brightness Light Emitting Diode Package

Shan Gao, Jupyo Hong, Sanghyun Choi, Seogmoon Choi, Sung Yi
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 423-428, July 8–12, 2007
Paper No: IPACK2007-33103
DOI: https://doi.org/10.1115/IPACK2007-33103
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Topics: Brightness (Photometry), Design, Heat transfer, Light-emitting diodes, Optimization, Finite element methods, Thermal resistance, Aluminum, Thermal properties, Algorithms
Proceedings Papers

Effects of Localized Heat Generations Due to the Color Conversion in Phosphor Particles and Layers of High Brightness Light Emitting Diodes

Mehmet Arik, Stanton Weaver, Charles Becker, Michael Hsing, Alok Srivastava
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 611-619, July 6–11, 2003
Paper No: IPACK2003-35015
DOI: https://doi.org/10.1115/IPACK2003-35015
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Topics: Brightness (Photometry), Heat, Light-emitting diodes, Particulate matter, Phosphors, Reliability, Computer simulation, Finite element analysis, Heating, Light sources