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Proceedings Papers

Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers

Shidong Li, Bakul Parikh, Chelsea Savoy, Daniel Kuchta, Guillaume Jutras, Harry Bagheri, Hilton Toy, Joe Ross, Ken-Ichi Akasofu, Mark Kapfhammer, Mark Schultz, Steven Ostrander, Thomas Wassick
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 25–27, 2022
Paper No: IPACK2022-97455
DOI: https://doi.org/10.1115/IPACK2022-97455
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Topics: Cables, Construction, Copper, Cycles, Density, Elastomers, Fibers, Flat heat pipes, Flip-chip, Flip-chip devices
Proceedings Papers

Development of a Raised-Floor Plenum Design Tool

James W. VanGilder, Xuanhang (Simon) Zhang
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A027, July 6–9, 2015
Paper No: IPACK2015-48432
DOI: https://doi.org/10.1115/IPACK2015-48432
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Topics: Design, Air flow, Tiles, Computational fluid dynamics, Cables, Construction, Cooling, Engineering simulation, Flow (Dynamics), Leakage
Proceedings Papers

Robust Data Acquisition for Building Lighting Systems

Zak Pearson, Tanya L. Crenshaw, Heather Dillon, Erik Paulson, Nick Warlen
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A016, July 6–9, 2015
Paper No: IPACK2015-48445
DOI: https://doi.org/10.1115/IPACK2015-48445
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Topics: Data acquisition, Heat sinks, Cables, Data acquisition systems, Energy efficiency, Temperature, Thermal management
Proceedings Papers

An Innovative Way to Measure Temperature by Using the Faraday Effect

Pranav Limaye, Anisur Rehman
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 293-296, July 6–8, 2011
Paper No: IPACK2011-52202
DOI: https://doi.org/10.1115/IPACK2011-52202
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Topics: Faraday effect, Temperature, Magnetic fields, Cables, Electromagnetic interference, Fibers, Insulation, Magnets, Optical fiber, Permanent magnets
Proceedings Papers

Advanced Integrated Cooling Systems for Thermal Management in Data Centers

Yoshiyuki Abe, Masato Fukagaya, Takashi Kitagawa, Haruhiko Ohta, Yasuhisa Shinmoto, Masahide Sato, Ken-ichi Iimura
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 619-624, July 19–23, 2009
Paper No: InterPACK2009-89009
DOI: https://doi.org/10.1115/InterPACK2009-89009
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Topics: Cooling systems, Data centers, Thermal management, Server racks, Heat pipes, Cables, Fluids, Heat exchangers, Heat sinks, Nanofluids
Proceedings Papers

System Level Thermal Design Challenges in Validation Platforms

Rahima K. Mohammed, Ridvan A. Sahan, Ying-Feng Pang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1077-1086, July 19–23, 2009
Paper No: InterPACK2009-89412
DOI: https://doi.org/10.1115/InterPACK2009-89412
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Topics: Design, Cooling, Engineering simulation, Simulation, Computational fluid dynamics, Semiconductor industry, Silicon, Acoustics, Cables, Heating
Proceedings Papers

Experimental Investigation of the Impact of Under Floor Blockages on Flow Distribution in a Data Center Cell

Siddharth Bhopte, Bahgat Sammakia, Madhusudan K. Iyengar, Roger Schmidt
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 827-836, July 8–12, 2007
Paper No: IPACK2007-33540
DOI: https://doi.org/10.1115/IPACK2007-33540
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Topics: Data centers, Flow (Dynamics), Tiles, Air conditioning, Computational fluid dynamics, Pipes, Air flow, Cables, Computer simulation, Computers
Proceedings Papers

Electrical Simulation Design Technology of Silicon Through Substrate

Takamasa Takano, Masataka Yamaguchi, Koichi Nakayama, Tomoko Maruyama, Shigeki Chujyo, Satoru Kuramochi, Yoshitaka Fukuoka
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 999-1004, July 17–22, 2005
Paper No: IPACK2005-73339
DOI: https://doi.org/10.1115/IPACK2005-73339
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Topics: Design, Silicon, Simulation, Packaging, System-in-package, Transmission lines, Cables, Circuits, Clocks, Delays
Proceedings Papers

A Broadband Wave Division Multiplexed (WDM) Local Area Network for Military Aircraft Using Commercial Off-the-Shelf (COTS) Components

Andrew S. Glista, Jr., John Nahvi
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 621-628, July 6–11, 2003
Paper No: IPACK2003-35062
DOI: https://doi.org/10.1115/IPACK2003-35062
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Topics: Military aircraft, Waves, Fibers, Aircraft, Cables, Design, Flight, Testing, Signals, Aerospace industry
Proceedings Papers

Thermal Simulation for Outdoor Optical Network Unit

Z. Zack Yu, Ridvan Amir Sahan, X. Howard Sun
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 695-698, July 6–11, 2003
Paper No: IPACK2003-35348
DOI: https://doi.org/10.1115/IPACK2003-35348
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Topics: Simulation, Telecommunications, Computational fluid dynamics, Cooling, Cables, Curbs (Roads), Design, Electronics, Fibers, Optics