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Proceedings Papers

Performance Validation of Voltage Blocking Technologies for Direct Cooling of High-Density Power Electronics

Ange-Christian Iradukunda, David Huitink, Tarek Gebrael, Nenad Miljkovic
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A005, October 25–27, 2022
Paper No: IPACK2022-97412
DOI: https://doi.org/10.1115/IPACK2022-97412
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Topics: Chemical vapor deposition, Coatings, Cooling, Density, Electrodes, Electronics, Fluids, Ionization, Thermal resistance
Proceedings Papers

Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond for Use in Electronics Thermal Management

Luke Yates, Ramez Cheaito, Aditya Sood, Zhe Cheng, Thomas Bougher, Mehdi Asheghi, Kenneth Goodson, Mark Goorsky, Firooz Faili, Dan Twitchen, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A014, August 29–September 1, 2017
Paper No: IPACK2017-74163
DOI: https://doi.org/10.1115/IPACK2017-74163
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Topics: Electronics, Synthetic diamonds, Thermal conductivity, Thermal management, Diamonds, Chemical vapor deposition, Electron backscatter diffraction, Lasers, Boron, Heat flux
Proceedings Papers

Two-Dimensional Monolayer MX 2 (M=Mo, W; X=S, Se) Synthesis, Characterization and Device Applications

Bin Xiang, Lei Yang, Jian Huang, Qi Fu
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A001, July 6–9, 2015
Paper No: IPACK2015-48286
DOI: https://doi.org/10.1115/IPACK2015-48286
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Topics: Atomic force microscopy, Chemical vapor deposition, Electronics, Emergencies, Mechanical admittance, Optoelectronic devices, Photoluminescence, Pressure, Raman spectroscopy, Resolution (Optics)
Proceedings Papers

Effect of Three Dimensional Strain on the Electronic Properties of Graphene Nanoribbons

Meng Yang, Masato Ohnishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A002, July 6–9, 2015
Paper No: IPACK2015-48239
DOI: https://doi.org/10.1115/IPACK2015-48239
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Topics: Graphene, Strain sensors, Chemical vapor deposition, Copper foil, Deformation, Energy gap, Reactive-ion etching, Tensile deformation, Density functional theory, Electron configuration
Proceedings Papers

Thermal Boundary Conductance at Metal-Graphene-Metal Interfaces Using Time-Domain Thermoreflectance Method

David B. Brown, Thomas L. Bougher, Baratunde A. Cola, Satish Kumar
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A004, July 6–9, 2015
Paper No: IPACK2015-48444
DOI: https://doi.org/10.1115/IPACK2015-48444
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Topics: Electrical conductance, Graphene, Metals, Thermoreflectance, Chemical vapor deposition, Copper foil
Proceedings Papers

Fabrication of Anodic Aluminum Oxide Template and Cu Nanowire Surface Fastener

Hiromasa Teshima, Kohei Kojima, Yang Ju
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A002, July 16–18, 2013
Paper No: IPACK2013-73125
DOI: https://doi.org/10.1115/IPACK2013-73125
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Topics: Aluminum, Fasteners, Manufacturing, Nanowires, Bonding, Membranes, Surface mount technology, Adhesion, Atomic force microscopy, Chemical vapor deposition
Proceedings Papers

Transparent Electrodes From Graphene/Single Wall Carbon Nanotube Composites

Hossein Sojoudi, Fernando Reiter, Samuel Graham
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A008, July 16–18, 2013
Paper No: IPACK2013-73158
DOI: https://doi.org/10.1115/IPACK2013-73158
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Topics: Composite materials, Electrodes, Graphene, Single-walled carbon nanotubes, Transparency, Single-walled nanotubes, Chemical vapor deposition, Electrical properties, Annealing, Heat conduction
Proceedings Papers

Highly Sensitive 2D Strain Sensor Using Carbon Nanotube

Hiroshi Kawakami, Masato Ohnishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A001, July 16–18, 2013
Paper No: IPACK2013-73156
DOI: https://doi.org/10.1115/IPACK2013-73156
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Topics: Carbon nanotubes, Strain sensors, Multi-walled carbon nanotubes, Electrical conductivity, Shapes, Chemical vapor deposition, Electrical resistance, Single-walled carbon nanotubes, Catalysts, Design