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Proceedings Papers

Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 25–27, 2022
Paper No: IPACK2022-97452
DOI: https://doi.org/10.1115/IPACK2022-97452
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Topics: Alloys, Shock (Mechanics), Solders, Vibration, Reliability, Aerospace industry, Climate, Defense industry, Elastic moduli, Electronics
Proceedings Papers

Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R After Exposure to Isothermal Aging of 50°C Up To 8 Months

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A022, October 26–28, 2021
Paper No: IPACK2021-74069
DOI: https://doi.org/10.1115/IPACK2021-74069
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Topics: Low temperature, Mechanical properties, Storage, Temperature, Alloys, Solders, Avionics, Climate, Design, Electronic packages
Proceedings Papers

High Strain Rate Low Temperature Properties for SAC-R After Exposure to Isothermal Aging

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 27–29, 2020
Paper No: IPACK2020-2659
DOI: https://doi.org/10.1115/IPACK2020-2659
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Topics: Alloys, Avionics, Climate, Design, Electronic packages, Electronic packaging, High temperature, Lead-free solders, Low temperature, Low temperature materials
Proceedings Papers

Application of Electronics Packaging Fundamentals to Photovoltaic Interconnects and Packaging

Laura Spinella, Nick Bosco
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 7–9, 2019
Paper No: IPACK2019-6520
DOI: https://doi.org/10.1115/IPACK2019-6520
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Topics: Electronic packaging, Fatigue, Packaging, Simulation, Solders, Thermomechanics, Reliability, Climate, Architecture, Electronics
Proceedings Papers

Thermomechanical Reliability Challenges and Goals and Design for Reliability Methodologies for Electric Vehicle Systems

David Huitink
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, August 29–September 1, 2017
Paper No: IPACK2017-74245
DOI: https://doi.org/10.1115/IPACK2017-74245
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Topics: Design, Electric vehicles, Reliability, Thermomechanics, Stress, Vehicles, Electronics, Failure, Physics, Batteries
Proceedings Papers

Solid State Lighting Life Prediction Using Extended Kalman Filter

Pradeep Lall, Junchao Wei, Lynn Davis
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A016, July 16–18, 2013
Paper No: IPACK2013-73288
DOI: https://doi.org/10.1115/IPACK2013-73288
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Topics: Kalman filters, Light-emitting diodes, Failure, Physics, Failure mechanisms, High temperature, Maintenance, Noise (Sound), Climate, Damage
Proceedings Papers

Prognostics of Damage Accrual in SSL Luminaires and Drivers Subjected to HTSL Accelerated Aging

Pradeep Lall, Peter Sakalaukus, Lynn Davis
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A018, July 16–18, 2013
Paper No: IPACK2013-73250
DOI: https://doi.org/10.1115/IPACK2013-73250
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Topics: Algorithms, Aluminum, Capacitance, Capacitors, Climate, Damage, Electrical components, Failure, High temperature, Service life (Equipment)
Proceedings Papers

CFD Modeling of Indirect/Direct Evaporative Cooling Unit for Modular Data Center Applications

Betsegaw Gebrehiwot, Nikhil Dhiman, Kasturi Rajagopalan, Dereje Agonafer, Naveen Kannan, James Hoverson, Mike Kaler
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A054, July 16–18, 2013
Paper No: IPACK2013-73302
DOI: https://doi.org/10.1115/IPACK2013-73302
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Topics: Computational fluid dynamics, Data centers, Evaporative cooling, Modeling, Climate, Containers, Cooling, Cooling systems, Air conditioning, Air filters
Proceedings Papers

Energy Efficient Data Centers Using Evaporative Cooling and Air Side Economizers

Madhusudan Iyengar, Roger Schmidt
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 623-627, July 6–8, 2011
Paper No: IPACK2011-52210
DOI: https://doi.org/10.1115/IPACK2011-52210
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Topics: Data centers, Evaporative cooling, Cooling, Temperature, Climate, Computers, Energy consumption, Air conditioning, Evaporation, Filtration