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Proceedings Papers

Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A013, October 25–27, 2022
Paper No: IPACK2022-97449
DOI: https://doi.org/10.1115/IPACK2022-97449
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Topics: Mechanical properties, Solders, Temperature, Alloys, Storage, Aerospace industry, Automotive industry, Constitutive equations, Finite element analysis, Low temperature materials
Proceedings Papers

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 27–29, 2020
Paper No: IPACK2020-2658
DOI: https://doi.org/10.1115/IPACK2020-2658
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Topics: Alloys, Temperature, Operating temperature, Solders, Avionics, Constitutive equations, Electronic equipment, Electronics, Energy dissipation, Engines
Proceedings Papers

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A027, October 7–9, 2019
Paper No: IPACK2019-6577
DOI: https://doi.org/10.1115/IPACK2019-6577
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Topics: Alloys, Temperature, Lead-free solders, Solders, Finite element analysis, Avionics, Constitutive equations, Density, Electronic components, Electronics
Proceedings Papers

The Effects of Temperature, Strain Rate, and Aging on the Poisson’s Ratio of SAC Lead Free Solders

K. M. Rafidh Hassan, Mohammad S. Alam, Munshi Basit, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, August 27–30, 2018
Paper No: IPACK2018-8410
DOI: https://doi.org/10.1115/IPACK2018-8410
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Topics: Lead-free solders, Poisson ratio, Temperature effects, Solders, Temperature, Cooling, Finite element analysis, Finite element methods, Finite element model, Reliability
Proceedings Papers

Viscoplastic Constitutive Model for High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder After High-Temperature Prolonged Storage

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, August 27–30, 2018
Paper No: IPACK2018-8357
DOI: https://doi.org/10.1115/IPACK2018-8357
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Topics: Constitutive equations, High temperature, Lead-free solders, Mechanical properties, Storage, Solders, Alloys, Drilling, Electronics, Geometry
Proceedings Papers

Effect of Static and Dynamic Aging on Fatigue Behavior of Sn3.0Ag0.5Cu Solder Alloy

Yiran Li, Yuvraj Singh, Ganesh Subbarayan
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, August 29–September 1, 2017
Paper No: IPACK2017-74201
DOI: https://doi.org/10.1115/IPACK2017-74201
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Topics: Alloys, Fatigue, Solders, Damage, Tin, Creep, Constitutive equations, Energy dissipation, Entropy, Fatigue damage
Proceedings Papers

Anand Parameters for SAC305 Alloys After Prolonged Storage up to 1-Year

Pradeep Lall, Di Zhang, Jeff Suhling, David Locker
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A009, August 29–September 1, 2017
Paper No: IPACK2017-74300
DOI: https://doi.org/10.1115/IPACK2017-74300
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Topics: Alloys, Storage, High temperature, Solders, Temperature, Deformation, Electronics, Operating temperature, Constitutive equations, Elastic moduli
Proceedings Papers

A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A001, July 6–9, 2015
Paper No: IPACK2015-48389
DOI: https://doi.org/10.1115/IPACK2015-48389
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Topics: Alloys, Mechanical properties, Operating temperature, Temperature, Electronic systems, Solders, Vibration, Deformation, Elastic moduli, Electronics
Proceedings Papers

An Inverse Procedure for Estimating the Anand Viscoplastic Constitutive Model Parameters for Copper Free-Air Ball

Sai Sudharsanan Paranjothy, Ganesh Subbarayan, Dae Young Jung, Bahgat G. Sammakia
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A009, July 6–9, 2015
Paper No: IPACK2015-48653
DOI: https://doi.org/10.1115/IPACK2015-48653
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Topics: Constitutive equations, Copper, Displacement, Finite element analysis, Fracture (Materials), Fracture (Process), Bonding, Electrical properties, High temperature, Modeling
Proceedings Papers

Viscoplastic Constitutive Model for Lead-Free Solder Including Effects of Silver Content, Solidification Profile, and Severe Aging

Munshi Basit, Mohammad Motalab, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A002, July 6–9, 2015
Paper No: IPACK2015-48619
DOI: https://doi.org/10.1115/IPACK2015-48619
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Topics: Constitutive equations, Lead-free solders, Silver, Solidification, Alloys, Mechanical properties, Water, Solders, Reliability, Stress-strain curves
Proceedings Papers

Characterization of Doped SAC Solder Materials and Determination of Anand Parameters

Sudan Ahmed, Munshi Basit, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A003, July 6–9, 2015
Paper No: IPACK2015-48624
DOI: https://doi.org/10.1115/IPACK2015-48624
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Topics: Solders, Alloys, Reliability, Silver, Stress-strain curves, Temperature, Tin, Constitutive equations, Copper, Economics
Proceedings Papers

Effects of Thermal Cycle Conditions on Thermal Fatigue Life of Substrate With Cu Through-Hole

Yu Yamayose, Tetsuya Kugimiya, Kenji Hirohata, Akihiko Happoya, Nobutada Ohno, Masao Sakane
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A022, July 6–9, 2015
Paper No: IPACK2015-48247
DOI: https://doi.org/10.1115/IPACK2015-48247
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Topics: Cycles, Fatigue life, Temperature, Finite element methods, Thin films, Glass, Textiles, Constitutive equations, Creep, Epoxy resins
Proceedings Papers

A Revised Anand Constitutive Model for Lead Free Solder That Includes Aging Effects

Mohammad Motalab, Munshi Basit, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A009, July 16–18, 2013
Paper No: IPACK2013-73232
DOI: https://doi.org/10.1115/IPACK2013-73232
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Topics: Constitutive equations, Lead-free solders
Proceedings Papers

Experimental Characterization and Viscoplastic Modeling of the Temperature Dependent Material Behavior of Underfill Encapsulants

Nusrat J. Chhanda, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 749-761, July 6–8, 2011
Paper No: IPACK2011-52209
DOI: https://doi.org/10.1115/IPACK2011-52209
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Topics: Creep, Experimental characterization, Modeling, Temperature, Stress, Testing, Tension, Constitutive equations, Engineering simulation, Finite element analysis
Proceedings Papers

Constitutive Behavior of SAC Leadfree Alloys at High Strain Rates

Pradeep Lall, Sandeep Shantaram, Mandar Kulkarni, Geeta Limaye, Jeff Suhling
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 519-536, July 6–8, 2011
Paper No: IPACK2011-52194
DOI: https://doi.org/10.1115/IPACK2011-52194
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Topics: Alloys, Shock (Mechanics), Failure, Solders, Constitutive equations, Copper, Fracture (Process), Lead-free solders, Damage, Electronic products
Proceedings Papers

SIF Evaluation Using XFEM and Line Spring Models Under High Strain Rate Environment for Leadfree Alloys

Pradeep Lall, Mandar Kulkarni, Sandeep Shantaram, Jeff Suhling
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 281-297, July 6–8, 2011
Paper No: IPACK2011-52196
DOI: https://doi.org/10.1115/IPACK2011-52196
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Topics: Alloys, Springs, Copper, Solders, Fracture (Materials), Shock (Mechanics), Failure, Fracture toughness, Stress, Ball-Grid-Array packages
Proceedings Papers

Large-Scale Stress Analyses for Fatigue Reliability at Die-Mount Solder of Plastic IC Packages

Tetsuya Kugimiya, Kenji Hirohata, Minoru Mukai, Eitaro Miyake, Hiroshi Akiba, Nobutada Ohno, Takashi Kawakami
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 185-190, July 19–23, 2009
Paper No: InterPACK2009-89384
DOI: https://doi.org/10.1115/InterPACK2009-89384
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Topics: Fatigue, Reliability, Solders, Stress analysis (Engineering), Finite element analysis, Deformation, Metals, Molding materials, Absorption, Constitutive equations
Proceedings Papers

Characterization of Cure-Dependent Viscoelastic Behavior for Molding Compound and Application to Package Warpage Simulation

Tz-Cheng Chiu, Je-Li Kung, Yi-Shao Lai
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 9-17, July 19–23, 2009
Paper No: InterPACK2009-89040
DOI: https://doi.org/10.1115/InterPACK2009-89040
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Topics: Molding, Simulation, Viscoelasticity, Warping, Ball-Grid-Array packaging, Finite element analysis, Temperature, Constitutive equations, Cooling, Epoxy adhesives
Proceedings Papers

Strain-Rate Effects on Constitutive Behavior of Sn3.8-Ag0.7-Cu Lead-Free Solder

Kok Ee Tan, John H. L. Pang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 841-847, July 19–23, 2009
Paper No: InterPACK2009-89278
DOI: https://doi.org/10.1115/InterPACK2009-89278
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Topics: Lead-free solders, Solders, Yield stress, Stress-strain curves, Bone, Constitutive equations, Deformation, Elastic moduli, Finite element analysis, Mechanical properties
Proceedings Papers

Die Stress Variation During Thermal Cycling Reliability Tests

M. Kaysar Rahim, Jordan Roberts, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 481-492, July 8–12, 2007
Paper No: IPACK2007-33548
DOI: https://doi.org/10.1115/IPACK2007-33548
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Topics: Reliability, Stress, Sensors, Temperature, Cycles, Packaging, Electronic packaging, Solders, Accelerated life testing, Constitutive equations