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Proceedings Papers

Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers

Shidong Li, Bakul Parikh, Chelsea Savoy, Daniel Kuchta, Guillaume Jutras, Harry Bagheri, Hilton Toy, Joe Ross, Ken-Ichi Akasofu, Mark Kapfhammer, Mark Schultz, Steven Ostrander, Thomas Wassick

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 25–27, 2022

Paper No: IPACK2022-97455

DOI: https://doi.org/10.1115/IPACK2022-97455

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Topics: Cables, Construction, Copper, Cycles, Density, Elastomers, Fibers, Flat heat pipes, Flip-chip, Flip-chip devices

Proceedings Papers

Experimental Investigation of Parameters Affecting Performance of Pulsating Heat Pipe

Pawan Singh Kathait, Rajnish N. Sharma

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A023, August 29–September 1, 2017

Paper No: IPACK2017-74119

DOI: https://doi.org/10.1115/IPACK2017-74119

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Topics: Heat pipes, Computer cooling, Heat, Oscillations, Vapors, Bubbles, Construction, Design, Flux (Metallurgy), Heat transfer

Proceedings Papers

An Investigation of Catastrophic Failure in Solid-State Lamps Exposed to Harsh Environment Operational Conditions

Pradeep Lall, Peter Sakalaukus, Lynn Davis

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A045, July 6–9, 2015

Paper No: IPACK2015-48257

DOI: https://doi.org/10.1115/IPACK2015-48257

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Topics: Computer software, Construction, Cracking (Materials), Delamination, Design, Energy efficiency, Failure, Failure mechanisms, Fracture (Process), Junctions

Proceedings Papers

Development of a Raised-Floor Plenum Design Tool

James W. VanGilder, Xuanhang (Simon) Zhang

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A027, July 6–9, 2015

Paper No: IPACK2015-48432

DOI: https://doi.org/10.1115/IPACK2015-48432

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Topics: Design, Air flow, Tiles, Computational fluid dynamics, Cables, Construction, Cooling, Engineering simulation, Flow (Dynamics), Leakage

Proceedings Papers

Load Capacity and Thermal Efficiency Optimization of a Research Data Center Using Computational Modeling

Joseph R. H. Schaadt, Kamran Fouladi, Aaron P. Wemhoff, Joseph G. Pigeon

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A020, July 6–9, 2015

Paper No: IPACK2015-48364

DOI: https://doi.org/10.1115/IPACK2015-48364

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Topics: Computer simulation, Data centers, Optimization, Stress, Thermal efficiency, Design, Containment, Computational fluid dynamics, Air conditioning, Flow (Dynamics)

Proceedings Papers

Understanding the True Total Cost of Ownership of Water Cooling for Data Centers

Dustin W. Demetriou, Vinod Kamath, Howard Mahaney

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A013, July 6–9, 2015

Paper No: IPACK2015-48152

DOI: https://doi.org/10.1115/IPACK2015-48152

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Topics: Cooling, Data centers, Water, Construction, Density, Doors, Energy dissipation, Heat, Heat exchangers, Innovation

Proceedings Papers

Consideration for Running Data Center at High Temperatures and Using Free Air Cooling

Yongzhan He, Guofeng Chen, Jiajun Zhang, Tianyu Zhou, Tao Liu, Pinyan Zhu, Chao Liu, Nishi Ahuja

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A014, July 6–9, 2015

Paper No: IPACK2015-48169

DOI: https://doi.org/10.1115/IPACK2015-48169

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Topics: Cooling, Data centers, High temperature, Corrosion, Internet, Temperature, Design, Operating temperature, Refrigeration, Carbon dioxide

Proceedings Papers

Thermal Design of a Hierarchical Radially Expanding Cavity for Two-Phase Cooling of Integrated Circuits

Arvind Sridhar, Chin Lee Ong, Stefan Paredes, Bruno Michel, Thomas Brunschwiler, Pritish Parida, Evan Colgan, Timothy Chainer, Catherine Gorle, Kenneth E. Goodson

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A039, July 6–9, 2015

Paper No: IPACK2015-48690

DOI: https://doi.org/10.1115/IPACK2015-48690

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Topics: Cavities, Cooling, Design, Integrated circuits, Fluids, Pressure, Blocks (Building materials), Computer simulation, Construction, Drainage

Proceedings Papers

Refrigeration Heat Exchanger Systems for Server Rack Cooling in Data Centers

Takeshi Tsukamoto, Jyunji Takayoshi, Roger R. Schmidt, Madhusudan K. Iyengar

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 915-921, July 19–23, 2009

Paper No: InterPACK2009-89258

DOI: https://doi.org/10.1115/InterPACK2009-89258

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Topics: Cooling, Data centers, Heat exchangers, Refrigeration, Server racks, Refrigerants, Water, Compression, Construction, Coolants

Proceedings Papers

Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages

Arun Prakash Raghupathy, Attila Aranyosi, Urmila Ghia, Karman Ghia, William Maltz

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 741-751, July 19–23, 2009

Paper No: InterPACK2009-89092

DOI: https://doi.org/10.1115/InterPACK2009-89092

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Topics: Boundary-value problems, Heat, Construction, Design, Errors, Flow (Dynamics), Junctions, Matlab, Natural convection, Optimization

Proceedings Papers

Impact of Double Walled Telecommunication Cabinet on Solar Load: Natural and Forced Convection

Bharathkrishnan Muralidharan, Feroz Ahamed Iqbal Mariam, Veerendra Mulay, Dereje Agonafer, Mark Hendrix

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 985-991, July 19–23, 2009

Paper No: InterPACK2009-89340

DOI: https://doi.org/10.1115/InterPACK2009-89340

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Topics: Mixed convection, Solar energy, Stress, Telecommunications, Construction, Cooling systems, Electronics, Optical instruments, Acoustics, Air conditioning

Proceedings Papers

Assembly and Reliability Studies on Reworked and Non-Reworked QFN Packages

Salil Pradhan, Francois Billaut, Sunil Gopakumar

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 321-328, July 19–23, 2009

Paper No: InterPACK2009-89405

DOI: https://doi.org/10.1115/InterPACK2009-89405

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Topics: Manufacturing, Reliability, Lumber, Pins (Engineering), Ball-Grid-Array packaging, Construction, Cross section (Physics), Design, Experimental design, Failure analysis

Proceedings Papers

Benchmark Testing of LGA Sockets for Server Applications

Brian Beaman

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 459-467, July 8–12, 2007

Paper No: IPACK2007-33067

DOI: https://doi.org/10.1115/IPACK2007-33067

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Topics: Testing, Engineering standards, Circuits, Construction, Hardware, Compression, Heat sinks, Reliability, Solders

Proceedings Papers

Thermal Characterization of Pulse-Activated Microelectronic Devices by Thermoreflectance-Based Surface Temperature Scanning

Pavel L. Komarov, Mihai G. Burzo, Peter E. Raad

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1413-1420, July 17–22, 2005

Paper No: IPACK2005-73196

DOI: https://doi.org/10.1115/IPACK2005-73196

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Topics: Microelectronic devices, Temperature, Thermal characterization, Thermoreflectance, Reflectance, Silicon, Transients (Dynamics), MOSFET transistors, Resolution (Optics), Calibration

Proceedings Papers

Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly With Sn3.9Ag0.6Cu SAC Alloy

Qiang Xiao, William D. Armstrong, James M. Pitarresi, Satish C. Chaparala, Brian D. Rogeman, Bahgat G. Sammakia, Luu Nguyen

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1459-1470, July 17–22, 2005

Paper No: IPACK2005-73239

DOI: https://doi.org/10.1115/IPACK2005-73239

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Topics: Alloys, Creep, Heat, Manufacturing, Modeling, Surface mount devices, Bulk solids, Solders, Solder joints, Thermomechanics

Proceedings Papers

Airflow Uniformity Through Perforated Tiles in a Raised-Floor Data Center

James W. VanGilder, Roger R. Schmidt

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 493-501, July 17–22, 2005

Paper No: IPACK2005-73375

DOI: https://doi.org/10.1115/IPACK2005-73375

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Topics: Air flow, Data centers, Tiles, Computational fluid dynamics, Leakage, Design, Building renovation, Construction, Cooling, Cooling systems

Proceedings Papers

High-Density Through-Wafer Electrical Interconnects in Pyrex Substrate Integrated With Micromirror Array

C. C. Wang, T. D. Kudrle, M. Bancu, J. Hsiao, C. H. Mastrangelo

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 245-249, July 6–11, 2003

Paper No: IPACK2003-35203

DOI: https://doi.org/10.1115/IPACK2003-35203

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Topics: Borosilicate glasses, Density, Semiconductor wafers, Bonding, Construction, Flip-chip, Machining, Metals, Particle spin, Rotation

Proceedings Papers

Qualification and Reliability Testing of a Microchip Laser System for Space Applications

M. W. Wright, D. Franzen, H. Hemmati, M. Sandor

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 879-883, July 6–11, 2003

Paper No: IPACK2003-35298

DOI: https://doi.org/10.1115/IPACK2003-35298

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Topics: Accelerated life testing, Integrated circuits, Lasers, Testing, Temperature, Construction, Crystals, Fibers, Flow (Dynamics), Instrumentation

Proceedings Papers

Capacity Control in Refrigerated Systems

Johnston W. Peeples

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 153-157, July 6–11, 2003

Paper No: IPACK2003-35070

DOI: https://doi.org/10.1115/IPACK2003-35070

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Topics: Architecture, Compression, Computer cooling, Condensers (steam plant), Construction, Cooling, Design, Electronics, Energy dissipation, Flow (Dynamics)

Proceedings Papers

Dynamic Characterization of Thermal Interface Material for Electronic Cooling

Rocky Shih, Cullen E. Bash

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 159-166, July 6–11, 2003

Paper No: IPACK2003-35073

DOI: https://doi.org/10.1115/IPACK2003-35073

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Topics: ASTM International, Computer cooling, Construction, Design, Heating, Instrumentation, Product development, Testing, Thermal resistance, Vehicles

NARROW

Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers

Experimental Investigation of Parameters Affecting Performance of Pulsating Heat Pipe

An Investigation of Catastrophic Failure in Solid-State Lamps Exposed to Harsh Environment Operational Conditions

Development of a Raised-Floor Plenum Design Tool

Load Capacity and Thermal Efficiency Optimization of a Research Data Center Using Computational Modeling

Understanding the True Total Cost of Ownership of Water Cooling for Data Centers

Consideration for Running Data Center at High Temperatures and Using Free Air Cooling

Thermal Design of a Hierarchical Radially Expanding Cavity for Two-Phase Cooling of Integrated Circuits

Refrigeration Heat Exchanger Systems for Server Rack Cooling in Data Centers

Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages

Impact of Double Walled Telecommunication Cabinet on Solar Load: Natural and Forced Convection

Assembly and Reliability Studies on Reworked and Non-Reworked QFN Packages

Benchmark Testing of LGA Sockets for Server Applications

Thermal Characterization of Pulse-Activated Microelectronic Devices by Thermoreflectance-Based Surface Temperature Scanning

Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly With Sn3.9Ag0.6Cu SAC Alloy

Airflow Uniformity Through Perforated Tiles in a Raised-Floor Data Center

High-Density Through-Wafer Electrical Interconnects in Pyrex Substrate Integrated With Micromirror Array

Qualification and Reliability Testing of a Microchip Laser System for Space Applications

Capacity Control in Refrigerated Systems

Dynamic Characterization of Thermal Interface Material for Electronic Cooling

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