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Proceedings Papers

Passive Direct Liquid Cooling for High-Power Processors

Alexei Tyryshkin, John Kim, Raffaele Luca Amalfi, Ryan Enright
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141022
https://doi.org/10.1115/IPACK2024-141022
View Paper titled, Passive Direct Liquid Cooling for High-Power Processors
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Topics: Cooling, Refrigerants, Cooling systems, Design, Computer cooling, Condensation, Density, Electronic equipment, Electronics, Energy dissipation
Proceedings Papers

Review of Commercial One-Dimensional Thermo-Fluid Solvers for Liquid Cooled Server System

Bharath Ram Ravi, Jiwon Yu, Stephen Keefe, Herman Chu, Chase Wealther
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-139429
https://doi.org/10.1115/IPACK2024-139429
View Paper titled, Review of Commercial One-Dimensional Thermo-Fluid Solvers for Liquid Cooled Server System
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Topics: Cooling, Thermofluids, Heat, Internet of things, Artificial intelligence, Blockchain technology, Carbon footprint, Coolants, Cooling systems, Data centers
Proceedings Papers

Experimental Characterization of Confined, Package-Level Direct Two-Phase Jet Impingement Cooling With Micro-Pin Fin Surface Enhancement

Qianying Wu, Zheng Gong, Chih-Yao Chan, Heungdong Kwon, Kenneth Goodson, Tiwei Wei
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-109944
https://doi.org/10.1115/IPACK2023-109944
View Paper titled, Experimental Characterization of Confined, Package-Level Direct Two-Phase Jet Impingement Cooling With Micro-Pin Fin Surface Enhancement
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Topics: Boiling, Bubbles, Computer cooling, Coolants, Cooling, Cooling systems, Drying, Energy consumption, Experimental characterization, Flow (Dynamics)
Proceedings Papers

Thermal-Hydraulic Characterization of Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter. Part II: Solver Validation

Enzo M. Minazzo, Gautier Rouaze, Jackson B. Marcinichen, John R. Thome, Fred Buining
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111848
https://doi.org/10.1115/IPACK2023-111848
View Paper titled, Thermal-Hydraulic Characterization of Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter. Part II: Solver Validation
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Topics: Cooling systems
Proceedings Papers

Compact Modeling and Thermal Analysis of Immersion Based Hybrid Cooled Server

Vibin Shalom Simon, Bhavana Reddy Mandadi, Pardeep Shahi, Himanshu Modi, Pratik Vithoba Bansode, Dereje Agonafer
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112084
https://doi.org/10.1115/IPACK2023-112084
View Paper titled, Compact Modeling and Thermal Analysis of Immersion Based Hybrid Cooled Server
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Topics: Cloud computing, Computational fluid dynamics, Coolants, Cooling, Cooling systems, Data centers, Design, Electronic components, Electronics, Energy consumption
Proceedings Papers

Thermal-Hydraulic Characterization of Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter. Part I: Design and Experiments

Gautier Rouaze, Enzo M. Minazzo, Jackson B. Marcinichen, John R. Thome, Fred Buining
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111837
https://doi.org/10.1115/IPACK2023-111837
View Paper titled, Thermal-Hydraulic Characterization of Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter. Part I: Design and Experiments
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Topics: Cooling systems, Design, Refrigerants
Proceedings Papers

Compact and Highly Thermal-Hydraulic Efficient Air-Cooled Closed Loop Thermosyphon Cooling System for High Intense Heat Load Dissipation of Future Microprocessors

Enzo M. Minazzo, Gautier Rouaze, Jackson B. Marcinichen, John R. Thome, L. Winston Zhang
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97364
https://doi.org/10.1115/IPACK2022-97364
View Paper titled, Compact and Highly Thermal-Hydraulic Efficient Air-Cooled Closed Loop Thermosyphon Cooling System for High Intense Heat Load Dissipation of Future Microprocessors
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Topics: Cooling systems, Energy dissipation, Heat, Stress
Proceedings Papers

Dual-Evaporator Thermosyphon Cooling System for Electronics Cooling

Filippo Cataldo, Raffaele Luca Amalfi
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97729
https://doi.org/10.1115/IPACK2022-97729
View Paper titled, Dual-Evaporator Thermosyphon Cooling System for Electronics Cooling
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Topics: Computer cooling, Cooling, Cooling systems
Proceedings Papers

Determination of the Thermal Performance Limits for Single Phase Liquid Cooling Using an Improved Effectiveness-NTU Cold Plate Model

Alfonso Ortega, Carol Caceres, Umut Uras, Deogratius Kisitu, Uschas Chowdhury, Vahideh Radmard, Ali Heydari
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97421
https://doi.org/10.1115/IPACK2022-97421
View Paper titled, Determination of the Thermal Performance Limits for Single Phase Liquid Cooling Using an Improved Effectiveness-NTU Cold Plate Model
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Topics: Cooling, Plates (structures), Thermal resistance, Flow (Dynamics), Pressure drop, Computational fluid dynamics, Coolants, Cooling systems, Engineering simulation, Fluids
Proceedings Papers

Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Satyam Saini, Pratik Bansode, Harold Miyamura, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97416
https://doi.org/10.1115/IPACK2022-97416
View Paper titled, Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers
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Topics: Cooling, Data centers, Density, Heat, Plates (structures), Coolants, Cooling systems, Flow (Dynamics), Modeling, Server racks
Proceedings Papers

Power Usage Effectiveness Analysis of a High-Density Air-Liquid Hybrid Cooled Data Center

Ali Heydari, Bahareh Eslami, Vahideh Radmard, Fred Rebarber, Tyler Buell, Kevin Gray, Sam Sather, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97447
https://doi.org/10.1115/IPACK2022-97447
View Paper titled, Power Usage Effectiveness Analysis of a High-Density Air-Liquid Hybrid Cooled Data Center
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Topics: Cooling, Data centers, Density, Energy consumption, Temperature, Computational fluid dynamics, Design, Flow (Dynamics), Carbon, Cooling systems
Proceedings Papers

Compact Thermosyphon Cooling System For High Heat Flux Servers: Validation Of Thermosyphon Simulation Code Considering New Test Data

Rémy Haynau, Jackson B. Marcinichen, Raffaele L. Amalfi, Filippo Cataldo, John R. Thome
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72620
https://doi.org/10.1115/IPACK2021-72620
View Paper titled, Compact Thermosyphon Cooling System For High Heat Flux Servers: Validation Of Thermosyphon Simulation Code Considering New Test Data
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Topics: Cooling systems, Heat flux, Simulation
Proceedings Papers

Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers

Filippo Cataldo, Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72621
https://doi.org/10.1115/IPACK2021-72621
View Paper titled, Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers
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Topics: Computer cooling, Computers, Cooling systems, Cooling, Energy consumption, Climate change, Condensers (steam plant), Flow (Dynamics), Fluids, Heat
Proceedings Papers

A Novel Concept for Air Removal in Two-Phase Immersion Cooling Systems

Eric Peterson, Seth Morris, Husam Alissa, Nicholas Keehn, Bharath Ramakrishnan, Vaidehi Oruganti, Ioannis Manousakis, Noah Mckay
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72682
https://doi.org/10.1115/IPACK2021-72682
View Paper titled, A Novel Concept for Air Removal in Two-Phase Immersion Cooling Systems
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Topics: Boilers, Carbon, Condensers (steam plant), Cooling, Cooling systems, Emissions, Energy consumption, Film thickness, Fluids, Gases
Proceedings Papers

An Assessment of Effects of Nanofluids on Heat Transfer Performance of Two-Phase Cooling Systems

Alexander V. Korobko, Sana Fateh
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-68121
https://doi.org/10.1115/IPACK2021-68121
View Paper titled, An Assessment of Effects of Nanofluids on Heat Transfer Performance of Two-Phase Cooling Systems
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Topics: Cooling systems, Heat transfer, Nanofluids, Heat, Critical heat flux, Data centers, Fluids, Thermal management, Boiling, Computation
Proceedings Papers

Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers

Raffaele L. Amalfi, Cong H. Hoang, Ryan Enright, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72612
https://doi.org/10.1115/IPACK2021-72612
View Paper titled, Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers
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Topics: Cooling systems, Cooling, Heat, Heat flux, Computer cooling, Containment systems, Coolants, Copper, Density, Design
Proceedings Papers

Comparison of Thermal Management Approaches for Integrated Traction Drives in Electric Vehicles

Bidzina Kekelia, J. Emily Cousineau, Kevin Bennion, Sreekant Narumanchi, Shajjad Chowdhury
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2524
https://doi.org/10.1115/IPACK2020-2524
View Paper titled, Comparison of Thermal Management Approaches for Integrated Traction Drives in Electric Vehicles
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Topics: Electric vehicles, Thermal management, Traction, Electronics, Machinery, Cooling, Cooling systems, Engines, Finite element analysis, Fluids
Proceedings Papers

Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters

Jackson B. Marcinichen, John R. Thome, Raffaele L. Amalfi, Filippo Cataldo
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2541
https://doi.org/10.1115/IPACK2020-2541
View Paper titled, Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters
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Topics: Cooling systems, Design, Engineering simulation, Simulation, Cooling, Flow (Dynamics), Heat, Architecture, Boiling, Computer cooling
Proceedings Papers

Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2542
https://doi.org/10.1115/IPACK2020-2542
View Paper titled, Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters
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Topics: Heat exchangers, Microscale devices, Thermal management, Cooling, Heat, Pressure drop, Density, Flow (Dynamics), Heat transfer, Refrigerants
Proceedings Papers

Personal Heating/Cooling System Using Peltier

Amanie Abdelmessih, Andre Alvarez, Joshua Gonzalez, Timothy Gooch, Adrian Gutierrez, Kristoffer Magana, Jonathan Nakamura, Joseph van Haaster
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2625
https://doi.org/10.1115/IPACK2020-2625
View Paper titled, Personal Heating/Cooling System Using Peltier
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Topics: Cooling, Cooling systems, Heating