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Proceedings Papers

Pool Boiling Heat Transfer in Dielectric Fluids and Impact of Surfaces on the Repeatability

Tolga Emir, Yakup Gokalp Yazici, Mete Budakli, Mehmet Arik
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 25–27, 2022
Paper No: IPACK2022-97266
DOI: https://doi.org/10.1115/IPACK2022-97266
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Topics: Critical heat flux, Fluids, Heat transfer, Oxidation, Pool boiling
Proceedings Papers

Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids

Noriyuki Unno, Kazuhisa Yuki, Risako Kibushi, Rika Nogita, Atsuyuki Mitani
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 26–28, 2021
Paper No: IPACK2021-67330
DOI: https://doi.org/10.1115/IPACK2021-67330
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Topics: Boiling, Critical heat flux, Heat transfer, Nanofluids, Particulate matter, Pressure, Water
Proceedings Papers

An Assessment of Effects of Nanofluids on Heat Transfer Performance of Two-Phase Cooling Systems

Alexander V. Korobko, Sana Fateh
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 26–28, 2021
Paper No: IPACK2021-68121
DOI: https://doi.org/10.1115/IPACK2021-68121
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Topics: Cooling systems, Heat transfer, Nanofluids, Heat, Critical heat flux, Data centers, Fluids, Thermal management, Boiling, Computation
Proceedings Papers

Design and Fabrication of Graded Copper Inverse Opals (g-CIOs) for Capillary-Fed Boiling in High Heat Flux Cooling Applications

Qianying Wu, Chi Zhang, Mehdi Asheghi, Kenneth Goodson
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A011, October 27–29, 2020
Paper No: IPACK2020-2603
DOI: https://doi.org/10.1115/IPACK2020-2603
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Topics: Boiling, Cooling, Copper, Design, Heat flux, Manufacturing, Critical heat flux, Heat, Modeling, Permeability
Proceedings Papers

Thermal Model of the Package Integrated Cyclone COoler (PICCO): Achieving High Thermal Conductance Using Swirled Two-Phase Flow

Rinaldo L. Miorini, Darin J. Sharar, Peter deBock
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A012, October 27–29, 2020
Paper No: IPACK2020-2605
DOI: https://doi.org/10.1115/IPACK2020-2605
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Topics: Thermal conductivity, Two-phase flow, Flow (Dynamics), Additive manufacturing, Army, Boundary-value problems, Bubbles, Buoyancy, Capacitance, Collaboration
Proceedings Papers

Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 27–29, 2020
Paper No: IPACK2020-2542
DOI: https://doi.org/10.1115/IPACK2020-2542
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Topics: Heat exchangers, Microscale devices, Thermal management, Cooling, Heat, Pressure drop, Density, Flow (Dynamics), Heat transfer, Refrigerants
Proceedings Papers

Copper Inverse Opal Surfaces for Enhanced Boiling Heat Transfer

Hyoungsoon Lee, Tanmoy Maitra, James Palko, Chi Zhang, Michael Barako, Yoonjin Won, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, August 29–September 1, 2017
Paper No: IPACK2017-74090
DOI: https://doi.org/10.1115/IPACK2017-74090
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Topics: Boiling, Copper, Heat transfer, Bubbles, Critical heat flux, Cooling, Heat transfer coefficients, Microscale devices, Nucleation (Physics), Optical images
Proceedings Papers

Heat Transfer Characteristics of Self-Rewetting Fluid and its Application in Heat Pipe

S. F. Wang, Y. X. Hu, Y. Zhou, W. Zhang
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A001, July 6–9, 2015
Paper No: IPACK2015-48665
DOI: https://doi.org/10.1115/IPACK2015-48665
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Topics: Fluids, Heat pipes, Heat transfer, Water, Surface tension, Boiling, Bubbles, Cooling, Critical heat flux, Temperature
Proceedings Papers

Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program

Kaiser Matin, Avram Bar-Cohen, Joseph J. Maurer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A024, July 6–9, 2015
Paper No: IPACK2015-48334
DOI: https://doi.org/10.1115/IPACK2015-48334
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Topics: Cooling, Modeling, Simulation, Critical heat flux, Corrosion, Design, Electrodiffusion, Erosion, Fluids, Gallium nitride
Proceedings Papers

Boiling/Evaporation Characteristics of a Droplet on a Nano-Particles-Accumlated Bi-Porous Layer

Kazuhisa Yuki, Katsuki Fukushima, Koichi Suzuki
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A005, July 6–9, 2015
Paper No: IPACK2015-48628
DOI: https://doi.org/10.1115/IPACK2015-48628
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Topics: Boiling, Drops, Evaporation, Particulate matter, Nanoparticles, Adhesion, Temperature, Bubbles, Critical heat flux, Heat transfer
Proceedings Papers

A Composite Cu/HOPG Heat Spreader for Immersion Cooling of High Power Chips

Arthur Suszko, Mohamed S. El-Genk
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A088, July 6–9, 2015
Paper No: IPACK2015-48678
DOI: https://doi.org/10.1115/IPACK2015-48678
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Topics: Composite materials, Cooling, Flat heat pipes, Critical heat flux, Copper, Dielectric liquids, Graphite, Nucleate pool boiling, Numerical analysis, Surface roughness
Proceedings Papers

Passive Thermosyphon Cooling System for High Heat Flux Servers

Sylwia Szczukiewicz, Nicolas Lamaison, Jackson B. Marcinichen, John R. Thome, Peter J. Beucher
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A009, July 6–9, 2015
Paper No: IPACK2015-48288
DOI: https://doi.org/10.1115/IPACK2015-48288
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Topics: Cooling systems, Heat flux, Cooling, Critical heat flux, Design, Condensers (steam plant), Fluids, Heat, Heat exchangers, Pipeline risers
Proceedings Papers

High Heat Flux Subcooled Flow Boiling of Methanol in Microtubes

Farzad Houshmand, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A010, July 6–9, 2015
Paper No: IPACK2015-48734
DOI: https://doi.org/10.1115/IPACK2015-48734
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Topics: Boiling, Flow (Dynamics), Heat flux, Methanol, Subcooling, Critical heat flux, Flux (Metallurgy), Pressure drop, Heat, Cooling
Proceedings Papers

A Study on Flow Boiling in Microchannel With Piranha Pin Fin

X. Yu, C. Woodcock, Y. Wang, J. Plawsky, Y. Peles
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A005, July 6–9, 2015
Paper No: IPACK2015-48103
DOI: https://doi.org/10.1115/IPACK2015-48103
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Topics: Boiling, Flow (Dynamics), Microchannels, Critical heat flux, Fluid dynamics, Heat transfer, Pressure drop, Design, Energy dissipation, Fluids
Proceedings Papers

Dynamic Modeling of a Two-Phase On-Chip Cooling System Applied on Parallel High Performance Microprocessors

Nicolas Lamaison, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A021, July 16–18, 2013
Paper No: IPACK2013-73264
DOI: https://doi.org/10.1115/IPACK2013-73264
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Topics: Cooling systems, Dynamic modeling, Heat, Critical heat flux, Flow (Dynamics), Temperature, Transients (Dynamics), Condensers (steam plant), Pumps, Simulation
Proceedings Papers

Critical Heat Flux During Submerged Jet Impingement Boiling of Saturated Water at Sub-Atmospheric Conditions

Ruander Cardenas, Vinod Narayanan
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 95-106, July 6–8, 2011
Paper No: IPACK2011-52043
DOI: https://doi.org/10.1115/IPACK2011-52043
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Topics: Boiling, Critical heat flux, Water, Errors, Nozzles, Finishes, Fluids, Reynolds number, Temperature
Proceedings Papers

Microbubble Formation in Collapsing Process of a Single Vapor Bubble Injected in Subcooled Pool

Ichiro Ueno, Yasusuke Hattori
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 395-398, July 19–23, 2009
Paper No: InterPACK2009-89160
DOI: https://doi.org/10.1115/InterPACK2009-89160
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Topics: Bubbles, Subcooling, Vapors, Boiling, Emissions, Critical heat flux, Heat flux, Water, Wire
Proceedings Papers

Subcooled Flow Boiling in Mini and Micro Channel: Contribution Toward High Heat Flux Cooling Technology for Electronics

Tomoyuki Nomura, Michael V. Shustov, Koichi Suzuki, Chungpyo Hong, Yury A. Kuzma-Kichta
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 335-340, July 19–23, 2009
Paper No: InterPACK2009-89100
DOI: https://doi.org/10.1115/InterPACK2009-89100
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Topics: Boiling, Cooling, Electronics, Flow (Dynamics), Heat flux, Microchannels, Subcooling, Heating, Critical heat flux, Emissions
Proceedings Papers

Microgap Cooling Technique Based on Evaporation of Thin Liquid Films

D. V. Zaitsev, O. A. Kabov
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 545-551, July 19–23, 2009
Paper No: InterPACK2009-89318
DOI: https://doi.org/10.1115/InterPACK2009-89318
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Topics: Cooling, Evaporation, Lubrication theory, Flow (Dynamics), Liquid films, Gas flow, Shear (Mechanics), Water, Critical heat flux, Dynamics (Mechanics)
Proceedings Papers

Development of Advanced High Heat Flux Cooling System for Power Electronics

Yasuhisa Shinmoto, Shinichi Miura, Koichi Suzuki, Yoshiyuki Abe, Haruhiko Ohta
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 283-292, July 19–23, 2009
Paper No: InterPACK2009-89082
DOI: https://doi.org/10.1115/InterPACK2009-89082
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Topics: Cooling systems, Electronics, Heat flux, Cooling, Critical heat flux, Flow (Dynamics), Heating, Heat, Semiconductors (Materials), Boiling