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Proceedings Papers

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Sandeep Mallampati, Liang Yin, David Shaddock, Harry Schoeller, Junghyun Cho
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, August 29–September 1, 2017
Paper No: IPACK2017-74169
DOI: https://doi.org/10.1115/IPACK2017-74169
View Paper titled, Lead-Free Alternatives for Interconnects in High-Temperature Electronics
Click here to open pdf in another window PDF for Lead-Free Alternatives for Interconnects in High-Temperature Electronics
Topics: Electronics, High temperature, Alloys, Fracture (Materials), Deformation, Shear strength, Solders, Tension, Thermal conductivity, Brittleness
Proceedings Papers

The Impact of Interfacial Layers on the Thermal Boundary Resistance and Residual Stress in GaN on Si Epitaxial Layers

Luke Yates, Thomas L. Bougher, Thomas Beechem, Baratunde A. Cola, Samuel Graham
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A009, July 6–9, 2015
Paper No: IPACK2015-48259
DOI: https://doi.org/10.1115/IPACK2015-48259
View Paper titled, The Impact of Interfacial Layers on the Thermal Boundary Resistance and Residual Stress in GaN on Si Epitaxial Layers
Click here to open pdf in another window PDF for The Impact of Interfacial Layers on the Thermal Boundary Resistance and Residual Stress in GaN on Si Epitaxial Layers
Topics: Gallium nitride, Interfacial thermal resistance, Stress, Polishing equipment, Electronics, Crystal structure, Electron mobility, Flow (Dynamics), Heat, Reliability
Proceedings Papers

Characterization of the Effects of Silver Content on the Aging Resistance of SAC Solder Joints

Md Hasnine, Jeffrey C. Suhling, Barton C. Prorok, Michael J. Bozack, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A008, July 6–9, 2015
Paper No: IPACK2015-48623
DOI: https://doi.org/10.1115/IPACK2015-48623
View Paper titled, Characterization of the Effects of Silver Content on the Aging Resistance of SAC Solder Joints
Click here to open pdf in another window PDF for Characterization of the Effects of Silver Content on the Aging Resistance of SAC Solder Joints
Topics: Silver, Solder joints, Creep, Alloys, Solders, Nanoindentation, Testing, Crystal structure, Crystals, Stress
Proceedings Papers

Quantitative Evaluation of Crystal Rotation Behavior Around the Fatigue Crack in Copper Films

Kenichi Shimizu, Tasiyuki Torii
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1703-1708, July 17–22, 2005
Paper No: IPACK2005-73134
DOI: https://doi.org/10.1115/IPACK2005-73134
View Paper titled, Quantitative Evaluation of Crystal Rotation Behavior Around the Fatigue Crack in Copper Films
Click here to open pdf in another window PDF for Quantitative Evaluation of Crystal Rotation Behavior Around the Fatigue Crack in Copper Films
Topics: Copper, Crystals, Fatigue cracks, Rotation, Crystal structure, Fatigue testing, Fracture (Materials), Electron backscatter diffraction, Annealing, Evaluation methods