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Proceedings Papers

A Cost-Effective Modeling Approach for Simulating Phase Change and Flow Boiling in Microchannels

Zhenhai Pan, Justin A. Weibel, Suresh V. Garimella

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A023, July 6–9, 2015

Paper No: IPACK2015-48178

DOI: https://doi.org/10.1115/IPACK2015-48178

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Topics: Boiling, Flow (Dynamics), Microchannels, Modeling, Vapors, Bubbles, Simulation, Currents, Errors, Evaporation

Proceedings Papers

The Influence of Nanoparticle Type on the Viscosity of Nanoenhanced Energy Storage Materials

Kieran Hess, Amy S. Fleischer

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A062, July 6–9, 2015

Paper No: IPACK2015-48082

DOI: https://doi.org/10.1115/IPACK2015-48082

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Topics: Energy storage, Nanoparticles, Viscosity, Multi-walled carbon nanotubes, Fluids, Graphite, Temperature, Currents, Heat transfer, Nanofibers

Proceedings Papers

Thermal Management of Ultra Intense Hot Spots With Two-Phase Multi-Microchannels and Embedded Thermoelectric Cooling

Jackson B. Marcinichen, Brian P. d’Entremont, John R. Thome, Gary Bulman, Jay Lewis, Rama Venkatasubramanian

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A023, July 16–18, 2013

Paper No: IPACK2013-73276

DOI: https://doi.org/10.1115/IPACK2013-73276

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Topics: Microchannels, Thermal management, Thermoelectric cooling, Cooling, Thermoelectric coolers, Heat, Computer simulation, Currents, Design, Electric current

Proceedings Papers

Integration of Point Field Detectors Within Power Electronic Packages to Achieve Multifunctional Sensing

J. D. Hoffman, B. A. Dow, R. D. Lorenz

Paper No: IPACK2013-73269

DOI: https://doi.org/10.1115/IPACK2013-73269

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Topics: Electronic packages, Sensors, Design, Displacement, Finite element analysis, Semiconductors (Materials), Temperature, Currents, Eddies (Fluid dynamics), Eddy currents (Electricity)

Proceedings Papers

Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control

Rui Zhang, David A. Brooks, Marc Hodes, Matthew van Lieshout, Vincent P. Manno

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 37-45, July 6–8, 2011

Paper No: IPACK2011-52019

DOI: https://doi.org/10.1115/IPACK2011-52019

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Topics: Heat, Temperature control, Heat sinks, Temperature, Energy consumption, Algorithms, Thermal resistance, Circuits, Currents, Electrical resistivity

Proceedings Papers

Thermoelectric Cooling Analysis Using Modified Graphical Method

Huy N. Phan, Dereje Agonafer

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 33-37, July 19–23, 2009

Paper No: InterPACK2009-89077

DOI: https://doi.org/10.1115/InterPACK2009-89077

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Topics: Thermoelectric cooling, Computation, Computational fluid dynamics, Cooling, Cooling systems, Currents, Design, Fluids, Temperature, Thermoelectric coolers

Proceedings Papers

Evaluation of the Accuracy of Out-of-Plane Normal Stress Detection Using Novel Piezoresistive CMOS Sensors

Benjamin Lemke, Rajashree Baskaran, Oliver Paul

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 463-469, July 19–23, 2009

Paper No: InterPACK2009-89171

DOI: https://doi.org/10.1115/InterPACK2009-89171

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Topics: Complementary metal oxide semiconductors, Sensors, Stress, Temperature, Uncertainty, Currents, Sensitivity analysis

NARROW

A Cost-Effective Modeling Approach for Simulating Phase Change and Flow Boiling in Microchannels

The Influence of Nanoparticle Type on the Viscosity of Nanoenhanced Energy Storage Materials

Thermal Management of Ultra Intense Hot Spots With Two-Phase Multi-Microchannels and Embedded Thermoelectric Cooling

Integration of Point Field Detectors Within Power Electronic Packages to Achieve Multifunctional Sensing

Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control

Thermoelectric Cooling Analysis Using Modified Graphical Method

Evaluation of the Accuracy of Out-of-Plane Normal Stress Detection Using Novel Piezoresistive CMOS Sensors

Journals

Conference Proceedings

eBooks

Resources

Opportunities

A Cost-Effective Modeling Approach for Simulating Phase Change and Flow Boiling in Microchannels

The Influence of Nanoparticle Type on the Viscosity of Nanoenhanced Energy Storage Materials

Thermal Management of Ultra Intense Hot Spots With Two-Phase Multi-Microchannels and Embedded Thermoelectric Cooling

Integration of Point Field Detectors Within Power Electronic Packages to Achieve Multifunctional Sensing

Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control

Thermoelectric Cooling Analysis Using Modified Graphical Method

Evaluation of the Accuracy of Out-of-Plane Normal Stress Detection Using Novel Piezoresistive CMOS Sensors

Journals

Conference Proceedings

eBooks

Resources

Opportunities

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