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Proceedings Papers

AI/ML Applications for Thermally Aware SoC Designs

Adam Norman, Mark Gallina, Olena Zhu, Joyce Weiner, Fabian Garita Gonzalez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 25–27, 2022
Paper No: IPACK2022-97186
DOI: https://doi.org/10.1115/IPACK2022-97186
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Topics: Computation, Degrees of freedom, Design, Engineering disciplines, Excitation, Feedback, Machine learning, Modeling, Optimization, Robustness
Proceedings Papers

Durability of Large Electronic Components Undergoing Multi-Axial Vibratory Excitation

Abhijit Dasgupta, Ed Habtour, Raman Sridharan, Elaine Lin
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A043, July 6–9, 2015
Paper No: IPACK2015-48709
DOI: https://doi.org/10.1115/IPACK2015-48709
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Topics: Durability, Electronic components, Excitation, Testing, Circuits, Printed circuit boards, Degrees of freedom, Dynamics (Mechanics), Vibration, Damage
Proceedings Papers

Predicting Thermal Stresses Induced by Conjugate Heat Transfer

Mohamed-Nabil Sabry
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 187-191, July 19–23, 2009
Paper No: InterPACK2009-89415
DOI: https://doi.org/10.1115/InterPACK2009-89415
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Topics: Heat transfer, Thermal stresses, Fluids, Design, Heat, Temperature, Temperature profiles, Wall temperature, Boundary-value problems, Degrees of freedom
Proceedings Papers

Damage Accumulation and Life-Prediction Models for SnAgCu Leadfree Electronics Under Shock-Impact

Pradeep Lall, Sandeep Shantaram, Arjun Angral, Mandar Kulkarni, Jeff Suhling
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 887-901, July 19–23, 2009
Paper No: InterPACK2009-89307
DOI: https://doi.org/10.1115/InterPACK2009-89307
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Topics: Damage, Electronics, Shock (Mechanics), Alloys, Failure mechanisms, Solders, Transients (Dynamics), Failure, Finite element analysis, Reliability
Proceedings Papers

Optimization of Si/SiGe Microrefrigerators for Hybrid Solid-State/Liquid Cooling

Y. Ezzahri, R. Singh, J. Christofferson, Z. Bian, A. Shakouri
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 265-275, July 8–12, 2007
Paper No: IPACK2007-33878
DOI: https://doi.org/10.1115/IPACK2007-33878
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Topics: Cooling, Optimization, Heat, Temperature, Heat conduction, Degrees of freedom, Engineering simulation, Integrated circuits, Junctions, Leakage
Proceedings Papers

Multidirectional Force and Torque Sensor for Insect Flight Research

Mansoor Nasir, Michael Dickinson, Dorian Liepmann
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1625-1630, July 17–22, 2005
Paper No: IPACK2005-73221
DOI: https://doi.org/10.1115/IPACK2005-73221
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Topics: Flight, Sensors, Torque, Aerodynamics, Degrees of freedom, Design, Microelectromechanical systems, Microsensors, Semiconductor wafers, Thrust