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Proceedings Papers

Evolution of the Interface Critical Stress Intensity Factors Between TIM Copper Substrates due to High-Temperature Isothermal Aging

Pradeep Lall, Padmanava Choudhury, Jaimal Williamson
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A011, October 25–27, 2022
Paper No: IPACK2022-97440
DOI: https://doi.org/10.1115/IPACK2022-97440
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Topics: Copper, Delamination, Displacement, Fracture (Materials), High temperature, Stress
Proceedings Papers

Predictive Cohesive Zone Modeling for Delamination at PCB-Potting Material Interfaces Under Four-Point Bend Loading With Sustained High-Temperature Exposure

Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A008, October 25–27, 2022
Paper No: IPACK2022-97427
DOI: https://doi.org/10.1115/IPACK2022-97427
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Topics: Delamination, Epoxy adhesives, Epoxy resins, High temperature, Modeling
Proceedings Papers

Evolution of Propensity for Chip-UF FCBGA Interface Delamination Under Fatigue-Loading and Sustained High Automotive Temperatures

Pradeep Lall, Aathi Raja Ram Pandurangan, Jaimal Williamson
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 25–27, 2022
Paper No: IPACK2022-97424
DOI: https://doi.org/10.1115/IPACK2022-97424
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Topics: Delamination, Fatigue, Fracture toughness, Temperature
Proceedings Papers

Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation

Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A018, October 26–28, 2021
Paper No: IPACK2021-74062
DOI: https://doi.org/10.1115/IPACK2021-74062
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Topics: Delamination, Epoxy adhesives, Epoxy resins, Fracture toughness, High temperature, Reliability, Shock (Mechanics), Stress, Fracture (Materials), Electronic components
Proceedings Papers

Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging

Pradeep Lall, Padmanava Choudhury, Jaimal Williamson
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 27–29, 2020
Paper No: IPACK2020-2676
DOI: https://doi.org/10.1115/IPACK2020-2676
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Topics: Ball-Grid-Array packaging, Composite building materials, Crack propagation, Damage, Delamination, Displacement, Electronics, Failure, Flip-chip, Fracture (Materials)
Proceedings Papers

Fatigue Delamination Crack Growth of Potting Compounds in PCB/Epoxy Interfaces Under Flexure Loading

Pradeep Lall, Kalyan Dornala, Jeff Suhling, John Deep, Ryan Lowe
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A012, October 7–9, 2019
Paper No: IPACK2019-6572
DOI: https://doi.org/10.1115/IPACK2019-6572
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Topics: Bending (Stress), Delamination, Electronics, Epoxy adhesives, Epoxy resins, Fatigue, Fracture (Materials), Fracture toughness
Proceedings Papers

Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP

Huayan Wang, Shuai Shao, Vanlai Pham, Panju Shang, Cheng Zhong, Seungbae Park
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, August 27–30, 2018
Paper No: IPACK2018-8257
DOI: https://doi.org/10.1115/IPACK2018-8257
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Topics: Packaging, Corners (Structural elements), Finite element analysis, Deformation, Delamination, Fracture (Materials), Fracture (Process), Reliability, Damage, Electronics
Proceedings Papers

Feasibility of PCB-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Per-Erik Tegehall, Dag Andersson, Jan Strandberg, Johnny Goncalves, Jonas Söderlund, Mikael Kwarnmark
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A009, August 27–30, 2018
Paper No: IPACK2018-8386
DOI: https://doi.org/10.1115/IPACK2018-8386
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Topics: Condition monitoring, Electronic systems, Sensors, Vibration, Failure, Delamination, Electronics, Manufacturing, Physics, Reflow soldering
Proceedings Papers

Piezoresistive Silicon Stress Sensor As a Tool to Monitor Health of an Electronic System

Alicja Palczynska, Alexandru Prisacaru, Przemyslaw Gromala, Bongtae Han, Dirk Mayer, Tobias Melz
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, August 29–September 1, 2017
Paper No: IPACK2017-74058
DOI: https://doi.org/10.1115/IPACK2017-74058
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Topics: Electronic systems, Sensors, Silicon, Stress, Algorithms, Delamination, Failure, Vehicles, Accelerated life testing, Acoustics
Proceedings Papers

An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC Package During Solder Reflow

Jing Wang, Yuling Niu, Seungbae Park
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, August 29–September 1, 2017
Paper No: IPACK2017-74017
DOI: https://doi.org/10.1115/IPACK2017-74017
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Topics: Delamination, Reflow soldering, Fracture (Materials), Stress, Vapor pressure, Ball-Grid-Array packages, Displacement, Finite element analysis, Fracture mechanics, Lead-free solders
Proceedings Papers

The Mechanism of the Low-K Stress Reduction in Chip Assembly by Shorter Solder Bump Height

Keiji Matsumoto, Keishi Okamoto, Hiroyuki Mori
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, August 29–September 1, 2017
Paper No: IPACK2017-74097
DOI: https://doi.org/10.1115/IPACK2017-74097
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Topics: Manufacturing, Solders, Stress, Delamination, Relaxation (Physics), Simulation
Proceedings Papers

In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Masato Hoshino, Kentaro Uesugi, Junya Ooi, Takao Mori
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A015, August 29–September 1, 2017
Paper No: IPACK2017-74177
DOI: https://doi.org/10.1115/IPACK2017-74177
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Topics: Fatigue cracks, Synchrotron radiation, X-rays, Solders, Fracture (Materials), Nondestructive evaluation, Ceramics, Crack propagation, Cycles, Delamination
Proceedings Papers

The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages

Quang Nguyen, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, August 29–September 1, 2017
Paper No: IPACK2017-74273
DOI: https://doi.org/10.1115/IPACK2017-74273
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Topics: Electronic packages, Polymers, Stress, Reliability, Simulation, Weight (Mass), Absorption, Ball-Grid-Array packaging, Corrosion, Cracking (Materials)
Proceedings Papers

Large Flip Chip Assembly Challenges and Risk Mitigation Process

Jeremy Plunkett, Suresh Subramaniam, Nokibul Islam, Kang KeonTaek, Gu SeonMo, Eric Ouyang
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, August 29–September 1, 2017
Paper No: IPACK2017-74026
DOI: https://doi.org/10.1115/IPACK2017-74026
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Topics: Ball-Grid-Array packaging, Copper, Cracking (Materials), Delamination, Failure, Flip-chip, Flip-chip assemblies, Flip-chip devices, Flip-chip packages, Fracture (Process)
Proceedings Papers

Interfacial Delamination and Fracture Properties of Potting Compounds and PCB/Epoxy Interfaces Under Flexure Loading After Exposure to Multiple Cure Temperatures

Pradeep Lall, Kalyan Dornala, Jeff Suhling, John Deep
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, August 29–September 1, 2017
Paper No: IPACK2017-74322
DOI: https://doi.org/10.1115/IPACK2017-74322
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Topics: Bending (Stress), Delamination, Epoxy adhesives, Epoxy resins, Fracture toughness, Temperature, Fracture (Materials), Elongation, Shock (Mechanics), Failure
Proceedings Papers

Methods for Theoretical Assessment of Delamination Risks in Electronic Packaging

Torsten Hauck, Ilko Schmadlak, Nishant Lakhera, Sandeep Shantaram, David Samet, V. N. N. Trilochan Rambhatla, Suresh Sitaraman
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A007, August 29–September 1, 2017
Paper No: IPACK2017-74073
DOI: https://doi.org/10.1115/IPACK2017-74073
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Topics: Delamination, Electronic packaging, Fracture (Materials), Simulation, Electronic packages, Copper, Finite element analysis, Fracture mechanics, Risk, Stress
Proceedings Papers

Analysis of Interfacial Shear Stress and Risk of Debonding in TSVs

Anirudh Udupa, Ganesh Subbarayan, Cheng-Kok Koh
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A008, July 6–9, 2015
Paper No: IPACK2015-48656
DOI: https://doi.org/10.1115/IPACK2015-48656
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Topics: Risk, Shear stress, Stress, Reliability, Copper, Delamination, Silicon, Stress singularity
Proceedings Papers

Evaluation of the Strength of Interface for Multi-Layered Materials in Photonic Devices

Hideo Koguchi, Naoki Kimura
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A017, July 6–9, 2015
Paper No: IPACK2015-48105
DOI: https://doi.org/10.1115/IPACK2015-48105
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Topics: Bonding, Boundary element methods, Cooling, Corners (Structural elements), Delamination, Joining, Numerical analysis, Packaging, Photonic equipment, Polymers
Proceedings Papers

A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface

David Samet, Abhishek Kwatra, Suresh K. Sitaraman
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A012, July 6–9, 2015
Paper No: IPACK2015-48447
DOI: https://doi.org/10.1115/IPACK2015-48447
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Topics: Copper, Epoxy adhesives, Epoxy resins, Fatigue cracks, Fracture (Materials), Crack propagation, Fatigue, Cycles, Design, Displacement
Proceedings Papers

An Investigation of Catastrophic Failure in Solid-State Lamps Exposed to Harsh Environment Operational Conditions

Pradeep Lall, Peter Sakalaukus, Lynn Davis
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A045, July 6–9, 2015
Paper No: IPACK2015-48257
DOI: https://doi.org/10.1115/IPACK2015-48257
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Topics: Computer software, Construction, Cracking (Materials), Delamination, Design, Energy efficiency, Failure, Failure mechanisms, Fracture (Process), Junctions