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Proceedings Papers

Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level

Hisham Abusalma, Abhijit Dasgupta, Andres Bujanda, Jian Yu, Harvey Tsang

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 25–27, 2022

Paper No: IPACK2022-97382

DOI: https://doi.org/10.1115/IPACK2022-97382

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Topics: Durability, Failure, Domes (Structural elements), Cantilever beams, Disks, Silver, Additive manufacturing, Bending (Stress), Clamps (Tools), Damage

Proceedings Papers

Thermal Spreading Resistance in a Multilayered Orthotropic Circular Disk With Interfacial Resistance and Variable Heat Flux

Y. S. Muzychka

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A053, July 6–9, 2015

Paper No: IPACK2015-48243

DOI: https://doi.org/10.1115/IPACK2015-48243

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Topics: Disks, Heat flux, Interfacial thermal resistance, Electrical conductance, Boundary-value problems, Computer software, Contact resistance, FORTRAN, Modeling, Thermal resistance

Proceedings Papers

Thermodynamic Characterization of a Server Optimized for High Performance Computing Using Water Cooling

Mark E. Steinke, Vinod Kamath, Lynn Parnell

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A030, July 6–9, 2015

Paper No: IPACK2015-48466

DOI: https://doi.org/10.1115/IPACK2015-48466

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Topics: Cooling, Water, Design, Air flow, Heat, Energy consumption, Energy efficiency, Stress, Algorithms, Boundary-value problems

Proceedings Papers

Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit

Michael J. Ellsworth, Jr., Randy J. Zoodsma, Frank Cascio, Eileen Behrendt

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A021, July 16–18, 2013

Paper No: IPACK2013-73090

DOI: https://doi.org/10.1115/IPACK2013-73090

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Topics: Design, Water, Heat, Stress, Cooling, Disks, Electronics, Flow (Dynamics), Heat exchangers, Motor drives

Proceedings Papers

Fundamental Study on Thermal Characteristics of Heat Spreaders

Yasushi Koito, Yusaku Nonaka, Toshio Tomimura

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 179-184, July 6–8, 2011

Paper No: IPACK2011-52099

DOI: https://doi.org/10.1115/IPACK2011-52099

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Topics: Flat heat pipes, Design, Heat, Disks, Flow (Dynamics), Heat flux, Heat sinks, Heat transfer, Numerical analysis, Photonic systems

Proceedings Papers

An Overview of the Power 775 Supercomputer Water Cooling System

Michael J. Ellsworth, Jr., Gary F. Goth, Randy J. Zoodsma, Amilcar Arvelo, Levi A. Campbell, William J. Anderl

Paper No: IPACK2011-52130

DOI: https://doi.org/10.1115/IPACK2011-52130

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Topics: Cooling systems, Water, Heat, Stress, Cooling, Disks, Heat exchangers, Doors, Electronics, Energy efficiency

Proceedings Papers

Energy Conversion Efficiency of Synthetic Jets

Ri Li, Rajdeep Sharma, Mehmet Arik

Paper No: IPACK2011-52034

DOI: https://doi.org/10.1115/IPACK2011-52034

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Topics: Energy conversion, Jets, Electricity (Physics), Energy efficiency, Signals, Actuators, Air flow, Design, Piezoelectric actuators, Cooling

Proceedings Papers

Mathematical Approaches for Thermal Design of a Vapor Chamber

Yasushi Koito, Yuta Shiki, Masataka Mochizuki, Shuichi Torii, Toshio Tomimura

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 535-544, July 19–23, 2009

Paper No: InterPACK2009-89279

DOI: https://doi.org/10.1115/InterPACK2009-89279

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Topics: Design, Vapors, Temperature distribution, Disks, Heat conduction, Momentum, Pressure, Simulation

Proceedings Papers

Cooling Design for the Next Generation Optical Disc Drive

Takayuki Fujimoto, Nobuyuki Isoshima, Hiroyuki Toyoda, Yoshiaki Yamauchi, Hitoshi Matsushima, Ikuo Nishida

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 625-630, July 8–12, 2007

Paper No: IPACK2007-33263

DOI: https://doi.org/10.1115/IPACK2007-33263

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Topics: Cooling, Design, Disks, Rotation

Proceedings Papers

Development of Cooling Structures for Blu-Ray Disc Compatible Optical Disc Drives Using Computational Fluid Dynamics Based on Cartesian Grid Method

Nobuyuki Isoshima, Takayuki Fujimoto, Yukinobu Abe, Masatoshi Watanabe, Yoshiaki Yamauchi, Ikuo Nishida

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 895-907, July 8–12, 2007

Paper No: IPACK2007-33248

DOI: https://doi.org/10.1115/IPACK2007-33248

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Topics: Computational fluid dynamics, Cooling, Disks, Flow (Dynamics), Lasers, Flow simulation, Heat transfer, Pressure, Rotating disks, Temperature

Proceedings Papers

Heat Transfer Characteristics for a Confined Rotating MCM Disk With Round Jet Array Impingement

C. Y. Lee, C. J. Fang, C. H. Peng, T. W. Lin, Y. H. Hung

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 909-916, July 8–12, 2007

Paper No: IPACK2007-33277

DOI: https://doi.org/10.1115/IPACK2007-33277

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Topics: Disks, Heat transfer, Nozzles, Reynolds number, Separation (Technology)

Proceedings Papers

Fluid Flow Behavior for a Confined Rotating MCM Disk With Round Jet Array Impingement

C. J. Fang, C. Y. Lee, C. H. Peng, T. W. Lin, Y. H. Hung

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 917-924, July 8–12, 2007

Paper No: IPACK2007-33278

DOI: https://doi.org/10.1115/IPACK2007-33278

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Topics: Disks, Fluid dynamics, Nozzles, Reynolds number, Separation (Technology), Turbulence

Proceedings Papers

Vapor Extraction From Flow Boiling in a Fractal-Like Branching Heat Sink

Mario Apreotesi, Deborah Pence, James Liburdy

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 321-328, July 8–12, 2007

Paper No: IPACK2007-33423

DOI: https://doi.org/10.1115/IPACK2007-33423

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Topics: Boiling, Flow (Dynamics), Fractals, Heat sinks, Vapors, Pressure, Pressure drop, Microchannels, Membranes, Subcooling

Proceedings Papers

Squeeze Flow Study of a Colloidal Paste

Drew A. Davidson, Gary L. Lehmann

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 557-567, July 17–22, 2005

Paper No: IPACK2005-73394

DOI: https://doi.org/10.1115/IPACK2005-73394

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Topics: Disks, Flow (Dynamics), Fluids

NARROW

Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level

Thermal Spreading Resistance in a Multilayered Orthotropic Circular Disk With Interfacial Resistance and Variable Heat Flux

Thermodynamic Characterization of a Server Optimized for High Performance Computing Using Water Cooling

Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit

Fundamental Study on Thermal Characteristics of Heat Spreaders

An Overview of the Power 775 Supercomputer Water Cooling System

Energy Conversion Efficiency of Synthetic Jets

Mathematical Approaches for Thermal Design of a Vapor Chamber

Cooling Design for the Next Generation Optical Disc Drive

Development of Cooling Structures for Blu-Ray Disc Compatible Optical Disc Drives Using Computational Fluid Dynamics Based on Cartesian Grid Method

Heat Transfer Characteristics for a Confined Rotating MCM Disk With Round Jet Array Impingement

Fluid Flow Behavior for a Confined Rotating MCM Disk With Round Jet Array Impingement

Vapor Extraction From Flow Boiling in a Fractal-Like Branching Heat Sink

Squeeze Flow Study of a Colloidal Paste

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