1-20 of 45
Displacement
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Evolution of the Interface Critical Stress Intensity Factors Between TIM Copper Substrates due to High-Temperature Isothermal Aging

Pradeep Lall, Padmanava Choudhury, Jaimal Williamson
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A011, October 25–27, 2022
Paper No: IPACK2022-97440
DOI: https://doi.org/10.1115/IPACK2022-97440
View Paper
PDF
Topics: Copper, Delamination, Displacement, Fracture (Materials), High temperature, Stress
Proceedings Papers

Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging

Pradeep Lall, Padmanava Choudhury, Jaimal Williamson
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 27–29, 2020
Paper No: IPACK2020-2676
DOI: https://doi.org/10.1115/IPACK2020-2676
View Paper
PDF
Topics: Ball-Grid-Array packaging, Composite building materials, Crack propagation, Damage, Delamination, Displacement, Electronics, Failure, Flip-chip, Fracture (Materials)
Proceedings Papers

Mechanical Characterization Study of Sintered Silver Pastes Bonded in a Double-Lap Configuration

Paul Paret, Joshua Major, Douglas DeVoto, Sreekant Narumanchi, Yansong Tan, Guo-Quan Lu
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, August 27–30, 2018
Paper No: IPACK2018-8276
DOI: https://doi.org/10.1115/IPACK2018-8276
View Paper
PDF
Topics: Silver, Particulate matter, Pressure, Collaboration, Displacement, Electronics, Energy gap, High pressure (Physics), High temperature, Manufacturing
Proceedings Papers

An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC Package During Solder Reflow

Jing Wang, Yuling Niu, Seungbae Park
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, August 29–September 1, 2017
Paper No: IPACK2017-74017
DOI: https://doi.org/10.1115/IPACK2017-74017
View Paper
PDF
Topics: Delamination, Reflow soldering, Fracture (Materials), Stress, Vapor pressure, Ball-Grid-Array packages, Displacement, Finite element analysis, Fracture mechanics, Lead-free solders
Proceedings Papers

Optimization of Graphite Composite Latent Heat Storage Systems

Anne Mallow, Kyle Gluesenkamp, Omar Abdelaziz, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, August 29–September 1, 2017
Paper No: IPACK2017-74244
DOI: https://doi.org/10.1115/IPACK2017-74244
View Paper
PDF
Topics: Composite materials, Graphite, Latent heat, Optimization, Storage, Density, Temperature, Heat, Power density, Thermal conductivity
Proceedings Papers

An Inverse Procedure for Estimating the Anand Viscoplastic Constitutive Model Parameters for Copper Free-Air Ball

Sai Sudharsanan Paranjothy, Ganesh Subbarayan, Dae Young Jung, Bahgat G. Sammakia
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A009, July 6–9, 2015
Paper No: IPACK2015-48653
DOI: https://doi.org/10.1115/IPACK2015-48653
View Paper
PDF
Topics: Constitutive equations, Copper, Displacement, Finite element analysis, Fracture (Materials), Fracture (Process), Bonding, Electrical properties, High temperature, Modeling
Proceedings Papers

LED Chip Deformation Measurement During the Operation Using the X-Ray CT Digital Volume Correlation

Pradeep Lall, Junchao Wei
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A011, July 6–9, 2015
Paper No: IPACK2015-48785
DOI: https://doi.org/10.1115/IPACK2015-48785
View Paper
PDF
Topics: Computerized tomography, Deformation, Displacement, Computation, Electron configuration, Electronics, Heat, Interferometry, Light-emitting diodes, Shapes
Proceedings Papers

A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface

David Samet, Abhishek Kwatra, Suresh K. Sitaraman
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A012, July 6–9, 2015
Paper No: IPACK2015-48447
DOI: https://doi.org/10.1115/IPACK2015-48447
View Paper
PDF
Topics: Copper, Epoxy adhesives, Epoxy resins, Fatigue cracks, Fracture (Materials), Crack propagation, Fatigue, Cycles, Design, Displacement
Proceedings Papers

CMUTs in Permanent Contact Operation for High Output Pressure

Min-Chieh Ho, Maik Hoffmann, Alexander Unger, Kwan Kyu Park, Mario Kupnik, Butrus T. Khuri-Yakub
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A012, July 6–9, 2015
Paper No: IPACK2015-48733
DOI: https://doi.org/10.1115/IPACK2015-48733
View Paper
PDF
Topics: Pressure, Transducers, Acoustics, Cavities, Ultrasonic transducers, Bonding, Cycles, Deflection, Displacement, High temperature
Proceedings Papers

Investigation on Singular Fields at the Vertex of Interface in Piezoelectric Material Joints and its Application

Hideo Koguchi, Tomiya Maekawa, Chonlada Luangarpa
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A005, July 6–9, 2015
Paper No: IPACK2015-48381
DOI: https://doi.org/10.1115/IPACK2015-48381
View Paper
PDF
Topics: Piezoelectric materials, Density, Displacement, Stress, Stress singularity, Compression, Corners (Structural elements)
Proceedings Papers

A Methodology for High Cycle Fatigue Characterization of Lead-Free Interconnects Under Simultaneous Harsh Environments of High Temperature and Vibration

Pradeep Lall, Geeta Limaye
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A017, July 16–18, 2013
Paper No: IPACK2013-73245
DOI: https://doi.org/10.1115/IPACK2013-73245
View Paper
PDF
Topics: High cycle fatigue, High temperature, Vibration, Temperature, Solders, Stress, Alloys, Electronics, Failure, Failure mechanisms
Proceedings Papers

Effect of Hydrogen on the Mechanical Properties of Silicon Crystal Surface

Hayato Izumi, Ryota Mukaiyama, Nobuyuki Shishido, Shoji Kamiya
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A008, July 16–18, 2013
Paper No: IPACK2013-73324
DOI: https://doi.org/10.1115/IPACK2013-73324
View Paper
PDF
Topics: Hydrogen, Mechanical properties, Silicon crystals, Silicon, Atoms, Boiling, Boron, Deformation, Plasticity, Stress
Proceedings Papers

Analysis of 3D-Strain Singular Field Near the Corner of Si Chip Using Digital Image Correlation Method

Hideo Koguchi, Yasuyuki Tsukada, Takahiko Kurahashi
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A006, July 16–18, 2013
Paper No: IPACK2013-73112
DOI: https://doi.org/10.1115/IPACK2013-73112
View Paper
PDF
Topics: Corners (Structural elements), Silicon chips, Displacement, Galerkin method, Stress, Bonding, Density, Electronics, Failure, Lasers
Proceedings Papers

Integration of Point Field Detectors Within Power Electronic Packages to Achieve Multifunctional Sensing

J. D. Hoffman, B. A. Dow, R. D. Lorenz
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A015, July 16–18, 2013
Paper No: IPACK2013-73269
DOI: https://doi.org/10.1115/IPACK2013-73269
View Paper
PDF
Topics: Electronic packages, Sensors, Design, Displacement, Finite element analysis, Semiconductors (Materials), Temperature, Currents, Eddies (Fluid dynamics), Eddy currents (Electricity)
Proceedings Papers

Multiphysics Simulation of RF-MEMS With Quantified Uncertainties

Lin Sun, Hojin Kim, Alejandro Strachan, Sanjay R. Mathur, Jayathi Y. Murthy
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A007, July 16–18, 2013
Paper No: IPACK2013-73175
DOI: https://doi.org/10.1115/IPACK2013-73175
View Paper
PDF
Topics: Microelectromechanical systems, Simulation, Uncertainty, Deformation, Chaos, Complex systems, Damping, Displacement, Electrostatics, Fluids
Proceedings Papers

Modeling Fracture in Dielectric Stacks due to Chip-Package Interaction: Impact of Dielectric Material Selection

Abhishek Tambat, Hung-Yun Lin, Ian Claydon, Ganesh Subbarayan, Dae-Young Jung, Bahgat Sammakia
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 317-323, July 6–8, 2011
Paper No: IPACK2011-52237
DOI: https://doi.org/10.1115/IPACK2011-52237
View Paper
PDF
Topics: Dielectric materials, Fracture (Materials), Modeling, Failure, Fracture (Process), Fracture toughness, Boundary-value problems, Computer-aided design, Crack propagation, Displacement
Proceedings Papers

Simulation of Thermal Positioning in Micro- and Nano-Scale Bridge Structures

Elham Maghsoudi, Michael James Martin
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 247-255, July 6–8, 2011
Paper No: IPACK2011-52144
DOI: https://doi.org/10.1115/IPACK2011-52144
View Paper
PDF
Topics: Bridges (Structures), Convection, Heat conduction, Nanoscale phenomena, Simulation, Displacement, Pressure, Silicon, Cooling, Diamonds
Proceedings Papers

A Note on the Reliability of Cu/Au Wire Interconnects

J. Lau, S. Wu, J. M. Lau
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 83-89, July 6–8, 2011
Paper No: IPACK2011-52286
DOI: https://doi.org/10.1115/IPACK2011-52286
View Paper
PDF
Topics: Reliability, Wire, Copper, Deformation, Displacement, Failure, Microelectronic devices, Structural mechanics
Proceedings Papers

Detection of Poor Wetting of Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound Technique

Jie Gong, I. Charles Ume
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 95-103, July 6–8, 2011
Paper No: IPACK2011-52294
DOI: https://doi.org/10.1115/IPACK2011-52294
View Paper
PDF
Topics: Ball-Grid-Array packages, Lasers, Lead-free solders, Ultrasound, Wetting, Solders, Inspection, Transients (Dynamics), Ball-Grid-Array packaging, Displacement
Proceedings Papers

Angular Offset Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment

Rohan Kulkarni, Krishnaswami Srihari
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 277-282, July 19–23, 2009
Paper No: InterPACK2009-89233
DOI: https://doi.org/10.1115/InterPACK2009-89233
View Paper
PDF
Topics: Electronics, Manufacturing, Optical fiber, Polarization (Light), Fibers, Displacement, Polarization (Electricity), Polarization (Waves), Electric discharge, Experimental design