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Proceedings Papers

Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level

Hisham Abusalma, Abhijit Dasgupta, Andres Bujanda, Jian Yu, Harvey Tsang

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 25–27, 2022

Paper No: IPACK2022-97382

DOI: https://doi.org/10.1115/IPACK2022-97382

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Topics: Durability, Failure, Domes (Structural elements), Cantilever beams, Disks, Silver, Additive manufacturing, Bending (Stress), Clamps (Tools), Damage

Proceedings Papers

Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules

Ange-Christian Iradukunda, David Huitink, Tarek Gebrael, Nenad Miljkovic

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, October 26–28, 2021

Paper No: IPACK2021-73313

DOI: https://doi.org/10.1115/IPACK2021-73313

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Topics: Coatings, Coolants, Cooling, Design, Durability, Electric fields, Electronics, Flow (Dynamics), Fluids, Heat

Proceedings Papers

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 7–9, 2019

Paper No: IPACK2019-6408

DOI: https://doi.org/10.1115/IPACK2019-6408

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Topics: Damage, Density, Flexible electronics, Inks, Nanoparticles, Metals, Anodes, Current density, Printing, Reliability

Proceedings Papers

Durability of Large Electronic Components Undergoing Multi-Axial Vibratory Excitation

Abhijit Dasgupta, Ed Habtour, Raman Sridharan, Elaine Lin

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A043, July 6–9, 2015

Paper No: IPACK2015-48709

DOI: https://doi.org/10.1115/IPACK2015-48709

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Topics: Durability, Electronic components, Excitation, Testing, Circuits, Printed circuit boards, Degrees of freedom, Dynamics (Mechanics), Vibration, Damage

Proceedings Papers

Durability of Low Melt Alloys as Thermal Interface Materials

Chandan K. Roy, Daniel K. Harris, Sushil Bhavnani, Michael C. Hamilton, Wayne Johnson, Roy W. Knight

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A071, July 6–9, 2015

Paper No: IPACK2015-48083

DOI: https://doi.org/10.1115/IPACK2015-48083

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Topics: Alloys, Durability, Testing, ASTM International, Copper, Cycles, Gallium, Performance evaluation, Surface finishing, Tin

Proceedings Papers

Computational Strategies to Minimize Transient Response During Time-Domain Analysis of Structures Under Vibratory Loading

Matthew Ernst, Cholmin Choi, Abhijit Dasgupta

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A014, July 16–18, 2013

Paper No: IPACK2013-73200

DOI: https://doi.org/10.1115/IPACK2013-73200

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Topics: Time-domain analysis, Transients (Dynamics), Finite element analysis, Cycles, Dynamic analysis, Vibration, Cantilever beams, Circuits, Durability, Manufacturing

Proceedings Papers

Thermo-Mechanical Reliability of Through Silicon Vias (TSVs) and Solder Interconnects in 3-Dimensional Integrated Circuits

Leila J. Ladani, Omar Rodriguez

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 27-32, July 19–23, 2009

Paper No: InterPACK2009-89056

DOI: https://doi.org/10.1115/InterPACK2009-89056

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Topics: Integrated circuits, Reliability, Silicon, Solders, Thermomechanics, Design, Durability, Solder joints, Copper, Cycles

Proceedings Papers

Sources of Fatigue in Random-Vibration Durability of Surface Mount Interconnects

Y. Zhou, M. Al-Bassyiouni, A. Dasgupta

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 143-148, July 19–23, 2009

Paper No: InterPACK2009-89178

DOI: https://doi.org/10.1115/InterPACK2009-89178

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Topics: Accelerometers, Approximation, Bending (Stress), Damage, Durability, Fatigue, Finite element analysis, Manufacturing, Printed circuit boards, Random excitation

Proceedings Papers

SnAgCu (SAC) Durability Under Vibration Loading at Different Isothermal Temperature Conditions

G. Plaza, Y. Zhou, M. Osterman, A. Dasgupta

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 515-521, July 8–12, 2007

Paper No: IPACK2007-33095

DOI: https://doi.org/10.1115/IPACK2007-33095

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Topics: Durability, Temperature, Vibration, Solders, Damage, Finite element analysis, High cycle fatigue, Printed circuit boards, Electrical wires, Excitation

Proceedings Papers

Failure Site Transition During Drop Testing of Printed Wiring Assemblies

J. Varghese, A. Dasgupta

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 845-848, July 17–22, 2005

Paper No: IPACK2005-73014

DOI: https://doi.org/10.1115/IPACK2005-73014

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Topics: Electrical wires, Failure, Testing, Durability, Intermetallic compounds, Solders, Damage, Surface mount packaging, Brittleness, Deformation

Proceedings Papers

Creep and High-Temperature Isothermal Fatigue of Pb-Free Solders

Qian Zhang, Abhijit Dasgupta, Peter Haswell

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 955-960, July 6–11, 2003

Paper No: IPACK2003-35361

DOI: https://doi.org/10.1115/IPACK2003-35361

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Topics: Creep, Fatigue, High temperature, Lead-free solders, Solders, Durability, Stress, Temperature, Alloys, Damage

Proceedings Papers

Insertion of HDI and Grid Array Technologies Into Military/Space Applications

Jerry D. Keller

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 783-788, July 6–11, 2003

Paper No: IPACK2003-35248

DOI: https://doi.org/10.1115/IPACK2003-35248

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Topics: Military systems, Aerospace industry, Density, Electronics, Ball-Grid-Array packaging, Defense industry, Durability, Electronic packaging, Packaging, Printed circuit boards

NARROW

Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level

Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Durability of Large Electronic Components Undergoing Multi-Axial Vibratory Excitation

Durability of Low Melt Alloys as Thermal Interface Materials

Computational Strategies to Minimize Transient Response During Time-Domain Analysis of Structures Under Vibratory Loading

Thermo-Mechanical Reliability of Through Silicon Vias (TSVs) and Solder Interconnects in 3-Dimensional Integrated Circuits

Sources of Fatigue in Random-Vibration Durability of Surface Mount Interconnects

SnAgCu (SAC) Durability Under Vibration Loading at Different Isothermal Temperature Conditions

Failure Site Transition During Drop Testing of Printed Wiring Assemblies

Creep and High-Temperature Isothermal Fatigue of Pb-Free Solders

Insertion of HDI and Grid Array Technologies Into Military/Space Applications

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