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Proceedings Papers

Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation

Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A018, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74062
https://doi.org/10.1115/IPACK2021-74062
View Paper titled, Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation
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Topics: Delamination, Epoxy adhesives, Epoxy resins, Fracture toughness, High temperature, Reliability, Shock (Mechanics), Stress, Fracture (Materials), Electronic components
Proceedings Papers

Mechanical Behavior of Thermal Interface Materials in Electronic Components Under Dynamic Loading Conditions

Emad A. Poshtan, Sudarshan Hegde, Andreas Roessle
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A016, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74021
https://doi.org/10.1115/IPACK2017-74021
View Paper titled, Mechanical Behavior of Thermal Interface Materials in Electronic Components Under Dynamic Loading Conditions
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Topics: Dynamic testing (Materials), Electronic components, Mechanical behavior, Capacitors, Flat heat pipes, Heat, Materials properties, Reliability, Thermomechanics
Proceedings Papers

Role of Process and Microstructural Parameters on Mixed Mode Fracture of Sn-Ag-Cu Solder Joints Under Dynamic Loading Conditions

P. Kumar, Z. Huang, I. Dutta, R. Mahajan, M. Renavikar, R. Sidhu
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 389-396, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89205
https://doi.org/10.1115/InterPACK2009-89205
View Paper titled, Role of Process and Microstructural Parameters on Mixed Mode Fracture of Sn-Ag-Cu Solder Joints Under Dynamic Loading Conditions
Open the PDF for Role of Process and Microstructural Parameters on Mixed Mode Fracture of Sn-Ag-Cu Solder Joints Under Dynamic Loading Conditions in another window
Topics: Dynamic testing (Materials), Fracture (Materials), Solder joints, Solders, Tin
Proceedings Papers

Modeling and Simulation of Shock and Drop Loading for Complex Portable Electronic Systems

F. Askari Farahani, M. Al-Bassyiouni, A. Dasgupta, S. Tolchinsky, J. Crystal
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 149-154, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89179
https://doi.org/10.1115/InterPACK2009-89179
View Paper titled, Modeling and Simulation of Shock and Drop Loading for Complex Portable Electronic Systems
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Topics: Electronic systems, Modeling, Shock (Mechanics), Simulation, Dynamic response, Batteries, Plastic housings, Circuits, Design, Dynamic testing (Materials)
Proceedings Papers

Plastic Strain Distribution as a Precursor for Transition From Ductile to Brittle Failure in Lead-Free Solder Joints

Feng Gao, Jianping Jing, Frank Z. Liang, Richard L. Williams, Jianmin Qu
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 729-736, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89098
https://doi.org/10.1115/InterPACK2009-89098
View Paper titled, Plastic Strain Distribution as a Precursor for Transition From Ductile to Brittle Failure in Lead-Free Solder Joints
Open the PDF for Plastic Strain Distribution as a Precursor for Transition From Ductile to Brittle Failure in Lead-Free Solder Joints in another window
Topics: Brittleness, Failure, Lead-free solders, Solders, Solder joints, Brittle fracture, Failure mechanisms, Design, Dynamic testing (Materials), Finite element analysis
Proceedings Papers

Continuous Wavelet Transform Based Nanoscale Strain Field Measurement Using Moire´ Interferometry With Phase Shifting

Bicheng Chen, Cemal Basaran
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 647-654, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89016
https://doi.org/10.1115/InterPACK2009-89016
View Paper titled, Continuous Wavelet Transform Based Nanoscale Strain Field Measurement Using Moire´ Interferometry With Phase Shifting
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Topics: Interferometry, Nanoscale phenomena, Wavelet transforms, Resolution (Optics), Tensors, Accelerated life testing, Ball-Grid-Array packaging, Computer software, Design, Dynamic testing (Materials)