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Proceedings Papers

Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 25–27, 2022
Paper No: IPACK2022-97452
DOI: https://doi.org/10.1115/IPACK2022-97452
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Topics: Alloys, Shock (Mechanics), Solders, Vibration, Reliability, Aerospace industry, Climate, Defense industry, Elastic moduli, Electronics
Proceedings Papers

Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints

Mohammad Ashraful Haq, Mohd Aminul Hoque, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A011, October 26–28, 2021
Paper No: IPACK2021-73348
DOI: https://doi.org/10.1115/IPACK2021-73348
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Topics: Intermetallic compounds, Lead-free solders, Solder joints, Alloys, Reliability, Copper, Elastic moduli, Electronic packaging, Nanoindentation, Polishing
Proceedings Papers

Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures

S. M. Kamrul Hasan, Abdullah Fahim, Mohammad Al Ahsan, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A016, October 26–28, 2021
Paper No: IPACK2021-74044
DOI: https://doi.org/10.1115/IPACK2021-74044
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Topics: Lead-free solders, Mechanical properties, Solder joints, Solders, Tensile strength, Thermal shock, Yield strength, Stress, Cycles, High temperature
Proceedings Papers

Degradation Mechanisms of Underfills Subjected to Isothermal Long-Term Aging From 150°C to 200°C

Pradeep Lall, Yunli Zhang, Haotian Wu, Ed Davis, Jeff Suhling
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 27–29, 2020
Paper No: IPACK2020-2677
DOI: https://doi.org/10.1115/IPACK2020-2677
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Topics: Damage, Design, Elastic moduli, Electronic components, Electronic packaging, Elongation, High temperature, Mechanical properties, Mechanical testing, Operating temperature
Proceedings Papers

The Effects of Curing Profile, Temperature, and Aging on the Mechanical Behavior of Solder Mask Materials

Promod R. Chowdhury, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, August 27–30, 2018
Paper No: IPACK2018-8405
DOI: https://doi.org/10.1115/IPACK2018-8405
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Topics: Hardening (Curing), Mechanical behavior, Solder masks, Temperature, Ultraviolet radiation, Creep, Mechanical properties, Elastic moduli, Stress, Tensile testing
Proceedings Papers

On Thermal Interface Materials With Polydisperse Fillers: Packing Algorithm and Effective Properties

Piyas Chowdhury, Kamal Sikka, Anuja De Silva, Indira Seshadri
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, August 27–30, 2018
Paper No: IPACK2018-8337
DOI: https://doi.org/10.1115/IPACK2018-8337
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Topics: Algorithms, Fillers (Materials), Packing (Shipments), Packings (Cushioning), Design, Elastic moduli, Heat, Thermal conductivity, Viscosity, Errors
Proceedings Papers

Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging

Abdullah Fahim, Sudan Ahmed, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, August 27–30, 2018
Paper No: IPACK2018-8408
DOI: https://doi.org/10.1115/IPACK2018-8408
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Topics: Lead-free solders, Mechanical properties, Nanoindentation, Tin, Solder joints, Particulate matter, Composite materials, Creep, Deformation, Elastic moduli
Proceedings Papers

Failure Mechanism Assessment of TO-247 Packaged SiC Power Devices

Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Dag Andersson, Zsolt Toth-Pal, Mattias Forslund, Samer Shisha
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A016, August 27–30, 2018
Paper No: IPACK2018-8385
DOI: https://doi.org/10.1115/IPACK2018-8385
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Topics: Failure mechanisms, Electronics, Reliability, Acoustics, Automotive industry, Cooling, Elastic moduli, Failure analysis, Heating, High temperature
Proceedings Papers

Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading

Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, August 29–September 1, 2017
Paper No: IPACK2017-74279
DOI: https://doi.org/10.1115/IPACK2017-74279
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Topics: Event history analysis, Wire, Reliability, Failure, Solders, Copper, Dielectric materials, Manufacturing, Microelectronic devices, Solder joints
Proceedings Papers

Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials (TIMs) by a Random Network Model

Pavan Kumar Vaitheeswaran, Ganesh Subbarayan
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A020, August 29–September 1, 2017
Paper No: IPACK2017-74129
DOI: https://doi.org/10.1115/IPACK2017-74129
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Topics: Mechanical properties, Network models, Particulate matter, Thermal conductivity, Brittleness, Computer simulation, Elastic moduli, Heat, Heat sinks, Particle size
Proceedings Papers

Anand Parameters for SAC305 Alloys After Prolonged Storage up to 1-Year

Pradeep Lall, Di Zhang, Jeff Suhling, David Locker
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A009, August 29–September 1, 2017
Paper No: IPACK2017-74300
DOI: https://doi.org/10.1115/IPACK2017-74300
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Topics: Alloys, Storage, High temperature, Solders, Temperature, Deformation, Electronics, Operating temperature, Constitutive equations, Elastic moduli
Proceedings Papers

A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A001, July 6–9, 2015
Paper No: IPACK2015-48389
DOI: https://doi.org/10.1115/IPACK2015-48389
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Topics: Alloys, Mechanical properties, Operating temperature, Temperature, Electronic systems, Solders, Vibration, Deformation, Elastic moduli, Electronics
Proceedings Papers

Viscoplastic Constitutive Model for Lead-Free Solder Including Effects of Silver Content, Solidification Profile, and Severe Aging

Munshi Basit, Mohammad Motalab, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A002, July 6–9, 2015
Paper No: IPACK2015-48619
DOI: https://doi.org/10.1115/IPACK2015-48619
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Topics: Constitutive equations, Lead-free solders, Silver, Solidification, Alloys, Mechanical properties, Water, Solders, Reliability, Stress-strain curves
Proceedings Papers

Experimental Characterization of Underfill Materials Exposed to Moisture Including Preconditioning

Promod R. Chowdhury, Nusrat J. Chhanda, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A013, July 6–9, 2015
Paper No: IPACK2015-48622
DOI: https://doi.org/10.1115/IPACK2015-48622
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Topics: Creep, Elastic moduli, Experimental characterization, Flip-chip assemblies, Hardening (Curing), Machinery, Materials properties, Mechanical properties, Microscale devices, Production equipment
Proceedings Papers

Warpage Hysteresis Estimation of an Electronic Package During a Thermal Cycle

Toru Ikeda, Akiko Ozaki, Takuya Hatao, Noriyuki Miyazaki
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A004, July 6–9, 2015
Paper No: IPACK2015-48168
DOI: https://doi.org/10.1115/IPACK2015-48168
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Topics: Cycles, Electronic packages, Warping, Heating, Package on package, Reliability, Resins, Elastic moduli, Hardening (Curing), Relaxation (Physics)
Proceedings Papers

Improved Flexibility of Alumina Ultrathin Barrier Films by Nano-Lamination

Ryan Lewis, Julie Slaughter, Y. C. Lee
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A030, July 6–9, 2015
Paper No: IPACK2015-48503
DOI: https://doi.org/10.1115/IPACK2015-48503
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Topics: Ceramics, Cracking (Materials), Elastic moduli, Flexible electronics, Fracture (Materials), Fracture (Process), Fracture mechanics, Heat pipes, Laminates, Lamination
Proceedings Papers

Mechanical Characterization of Metal Foams for Contact Resistance in Thermal Interface Applications

Ninad Trifale, Eric Nauman, Kazuaki Yazawa
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A075, July 6–9, 2015
Paper No: IPACK2015-48535
DOI: https://doi.org/10.1115/IPACK2015-48535
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Topics: Contact resistance, Metal foams, Porosity, Fillers (Materials), Foams (Chemistry), Aluminum, Elastic moduli, Elasticity, Phase change materials, Simulation
Proceedings Papers

Effect of Isothermal Aging and High Strain Rate on Material Properties of Innolot

Pradeep Lall, Geeta Limaye, Sandeep Shantaram, Jeff Suhling
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A012, July 16–18, 2013
Paper No: IPACK2013-73246
DOI: https://doi.org/10.1115/IPACK2013-73246
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Topics: Materials properties, Alloys, Temperature, Tin, Copper, Creep, Design, Elastic moduli, Electronics, Finite element model
Proceedings Papers

Effect of Additives in an Electrolyte on Mechanical Properties of Electrolytic Copper Foil

Takuya Nagayama, Hiroaki Yoshida, Ikuo Shohji
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A012, July 16–18, 2013
Paper No: IPACK2013-73172
DOI: https://doi.org/10.1115/IPACK2013-73172
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Topics: Copper foil, Electrolytes, Mechanical properties, Copper, Elastic moduli, Fatigue properties, Grain size, Proteins, Tensile strength
Proceedings Papers

Damage Pre-Cursors Based Prognostication of Accrued Damage and Assessment of Operational Readiness of Leadfree Electronics

Pradeep Lall, Mahendra Harsha, Jeff Suhling, Kai Goebel
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A014, July 16–18, 2013
Paper No: IPACK2013-73251
DOI: https://doi.org/10.1115/IPACK2013-73251
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Topics: Damage, Electronics, Cycles, Failure, Alloys, Elastic moduli, Electronic systems, Errors, High temperature, Reliability