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Proceedings Papers

Development of a Novel Test Setup to Study the Combined Effects of Electromigration and Mechanical Stress in Solder Interconnects

Mahsa Montazeri, David R. Huitink
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 27–29, 2020
Paper No: IPACK2020-2598
DOI: https://doi.org/10.1115/IPACK2020-2598
View Paper titled, Development of a Novel Test Setup to Study the Combined Effects of Electromigration and Mechanical Stress in Solder Interconnects
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Topics: Electrodiffusion, Solders, Stress, Reliability, Tension, Copper, Current density, Wire, Bonding, Electrical resistance
Proceedings Papers

Development of Packaging and Modular Control of Thermoelectric Clothes Dryer, With Performance Evaluation

Viral K. Patel, Kyle R. Gluesenkamp
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A009, August 29–September 1, 2017
Paper No: IPACK2017-74243
DOI: https://doi.org/10.1115/IPACK2017-74243
View Paper titled, Development of Packaging and Modular Control of Thermoelectric Clothes Dryer, With Performance Evaluation
Click here to open pdf in another window PDF for Development of Packaging and Modular Control of Thermoelectric Clothes Dryer, With Performance Evaluation
Topics: Design, Drying, Electrical resistance, Energy consumption, Energy efficiency, Engineering prototypes, Heat pumps, Heating, Modeling, Optimization
Proceedings Papers

Heat Transfer in Nanoelectronics by Quantum Mechanics

Thomas Prevenslik
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A011, July 16–18, 2013
Paper No: IPACK2013-73173
DOI: https://doi.org/10.1115/IPACK2013-73173
View Paper titled, Heat Transfer in Nanoelectronics by Quantum Mechanics
Click here to open pdf in another window PDF for Heat Transfer in Nanoelectronics by Quantum Mechanics
Topics: Heat transfer, Nanoelectronics, Quantum mechanics, Heat, Joules, Quantum electrodynamics, Circuits, Phonons, Radiation (Physics), Temperature
Proceedings Papers

Highly Sensitive 2D Strain Sensor Using Carbon Nanotube

Hiroshi Kawakami, Masato Ohnishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A001, July 16–18, 2013
Paper No: IPACK2013-73156
DOI: https://doi.org/10.1115/IPACK2013-73156
View Paper titled, Highly Sensitive 2D Strain Sensor Using Carbon Nanotube
Click here to open pdf in another window PDF for Highly Sensitive 2D Strain Sensor Using Carbon Nanotube
Topics: Carbon nanotubes, Strain sensors, Multi-walled carbon nanotubes, Electrical conductivity, Shapes, Chemical vapor deposition, Electrical resistance, Single-walled carbon nanotubes, Catalysts, Design
Proceedings Papers

Development of Highly Reliable BGA and Flip-Chip Structures by Using Cu-Cored Solder Ball

Hisashi Tanie, Nobuhiko Chiwata, Motoki Wakano, Masaru Fujiyoshi, Shinichi Fujiwara
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 725-732, July 6–8, 2011
Paper No: IPACK2011-52115
DOI: https://doi.org/10.1115/IPACK2011-52115
View Paper titled, Development of Highly Reliable BGA and Flip-Chip Structures by Using Cu-Cored Solder Ball
Click here to open pdf in another window PDF for Development of Highly Reliable BGA and Flip-Chip Structures by Using Cu-Cored Solder Ball
Topics: Ball-Grid-Array packaging, Flip-chip, Solders, Solder joints, Impact strength, Fatigue life, Finite element analysis, Reliability, Crack propagation, Deformation
Proceedings Papers

Two-Dimensional Strain-Distribution Sensor Using Carbon Nanotube-Dispersed Resin

Yusuke Suzuki, Yusuke Ohashi, Masato Ohnishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 381-386, July 6–8, 2011
Paper No: IPACK2011-52062
DOI: https://doi.org/10.1115/IPACK2011-52062
View Paper titled, Two-Dimensional Strain-Distribution Sensor Using Carbon Nanotube-Dispersed Resin
Click here to open pdf in another window PDF for Two-Dimensional Strain-Distribution Sensor Using Carbon Nanotube-Dispersed Resin
Topics: Carbon, Nanotubes, Resins, Sensors, Multi-walled carbon nanotubes, Carbon nanotubes, Electrical conductivity, Electrical resistance, Rubber, Single-walled carbon nanotubes
Proceedings Papers

Comparison of Fatigue Crack Initiation/Propagation and Daisy-Chain Resistance in Lead-Free Solder Joints Under Temperature Cycling Test

Y. Sing Chan, F. B. Song, S. W. Ricky Lee, C. R. Yang, Jeffery C. C. Lo
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 579-583, July 6–8, 2011
Paper No: IPACK2011-52219
DOI: https://doi.org/10.1115/IPACK2011-52219
View Paper titled, Comparison of Fatigue Crack Initiation/Propagation and Daisy-Chain Resistance in Lead-Free Solder Joints Under Temperature Cycling Test
Click here to open pdf in another window PDF for Comparison of Fatigue Crack Initiation/Propagation and Daisy-Chain Resistance in Lead-Free Solder Joints Under Temperature Cycling Test
Topics: Chain, Fatigue cracks, Lead-free solders, Temperature, Solder joints, Electrical resistance, Failure, Fatigue, Fatigue failure, Fracture (Materials)
Proceedings Papers

Detection of Poor Wetting of Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound Technique

Jie Gong, I. Charles Ume
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 95-103, July 6–8, 2011
Paper No: IPACK2011-52294
DOI: https://doi.org/10.1115/IPACK2011-52294
View Paper titled, Detection of Poor Wetting of Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound Technique
Click here to open pdf in another window PDF for Detection of Poor Wetting of Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound Technique
Topics: Ball-Grid-Array packages, Lasers, Lead-free solders, Ultrasound, Wetting, Solders, Inspection, Transients (Dynamics), Ball-Grid-Array packaging, Displacement
Proceedings Papers

Experimental Study of the High Cycle Fatigue of Thin Film Metal on Polyethylene Terephthalate for Flexible Electronics Applications

Khalid Alzoubi, Susan Lu, Bahgat Sammakia, Mark Poliks
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 27-32, July 19–23, 2009
Paper No: InterPACK2009-89247
DOI: https://doi.org/10.1115/InterPACK2009-89247
View Paper titled, Experimental Study of the High Cycle Fatigue of Thin Film Metal on Polyethylene Terephthalate for Flexible Electronics Applications
Click here to open pdf in another window PDF for Experimental Study of the High Cycle Fatigue of Thin Film Metal on Polyethylene Terephthalate for Flexible Electronics Applications
Topics: Flexible electronics, High cycle fatigue, Metals, Thin films, Unsaturated polyesters, Fracture (Materials), Bulk solids, Electrical resistance, Electronic systems, Failure
Proceedings Papers

Fracture Life Evaluation of Cu-Cored Solder Joint in BGA Package

Hisashi Tanie, Nobuhiko Chiwata, Motoki Wakano, Masaru Fujiyoshi, Takeyuki Itabashi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 797-802, July 19–23, 2009
Paper No: InterPACK2009-89232
DOI: https://doi.org/10.1115/InterPACK2009-89232
View Paper titled, Fracture Life Evaluation of Cu-Cored Solder Joint in BGA Package
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Topics: Ball-Grid-Array packages, Fracture (Materials), Solder joints, Solders, Crack propagation, Shapes, Finite element analysis, Particulate matter, Stiffness, Deformation
Proceedings Papers

New Technique for Testing Performance of Thermoelectric Quantum Well Materials

Velimir Jovanovic, Saeid Ghamaty, Norbert B. Elsner, Daniel Krommenhoek, John Morris
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 317-320.8, July 19–23, 2009
Paper No: InterPACK2009-89328
DOI: https://doi.org/10.1115/InterPACK2009-89328
View Paper titled, New Technique for Testing Performance of Thermoelectric Quantum Well Materials
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Topics: Quantum wells, Testing performance, Electrical resistivity, Thin films, Stress, Temperature, Alloys, Bulk solids, Copper, Electrical properties
Proceedings Papers

Remote Strain Measurement by Multi-Walled Carbon Nanotube-Dispersed Resin

Katsuya Osaki, Hideki Fuji, Masato Onishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 569-574, July 19–23, 2009
Paper No: InterPACK2009-89146
DOI: https://doi.org/10.1115/InterPACK2009-89146
View Paper titled, Remote Strain Measurement by Multi-Walled Carbon Nanotube-Dispersed Resin
Click here to open pdf in another window PDF for Remote Strain Measurement by Multi-Walled Carbon Nanotube-Dispersed Resin
Topics: Carbon, Nanotubes, Resins, Strain measurement, Carbon nanotubes, Electrical resistance, Waves, Electrical conductivity, Thermal conductivity, Thin films
Proceedings Papers

Evaluation of Resistance Change as a Predictor of Thermal Actuator Displacement

J. H. Constable, Michael Stevenson, Ming Hung Hung, Bill Infantolino
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 477-484, July 19–23, 2009
Paper No: InterPACK2009-89246
DOI: https://doi.org/10.1115/InterPACK2009-89246
View Paper titled, Evaluation of Resistance Change as a Predictor of Thermal Actuator Displacement
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Topics: Actuators, Displacement, Electrical resistivity, Microelectromechanical systems, Silicon, Temperature, Dimensions, Electrical resistance, Feedback, Heat conduction
Proceedings Papers

Optimized Thermoelectric Refrigeration in the Presence of Thermal Boundary Resistance

Anthony M. Pettes, Marc S. Hodes, Kenneth E. Goodson
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 221-228, July 8–12, 2007
Paper No: IPACK2007-33367
DOI: https://doi.org/10.1115/IPACK2007-33367
View Paper titled, Optimized Thermoelectric Refrigeration in the Presence of Thermal Boundary Resistance
Click here to open pdf in another window PDF for Optimized Thermoelectric Refrigeration in the Presence of Thermal Boundary Resistance
Topics: Interfacial thermal resistance, Refrigeration, Contact resistance, Electrical resistance, Geometry, Heat, Acoustics, Compression, Heat flux, Heat sinks
Proceedings Papers

Sizing of Pellets in Thermoelectric Modules (TEMs)

Marc Hodes
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2123-2131, July 17–22, 2005
Paper No: IPACK2005-73074
DOI: https://doi.org/10.1115/IPACK2005-73074
View Paper titled, Sizing of Pellets in Thermoelectric Modules (TEMs)
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Topics: Contact resistance, Electrical resistance, Energy consumption, Geometry, Heat, Heat flux, Refrigeration, Stress
Proceedings Papers

Wafer-Level Packaging Technology With Through-Hole Interconnections in Silicon Substrate

Satoshi Yamamoto, Masanobu Saruta, Hideyuki Wada, Michikazu Tomita, Tatsuo Suemasu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 757-760, July 17–22, 2005
Paper No: IPACK2005-73298
DOI: https://doi.org/10.1115/IPACK2005-73298
View Paper titled, Wafer-Level Packaging Technology With Through-Hole Interconnections in Silicon Substrate
Click here to open pdf in another window PDF for Wafer-Level Packaging Technology With Through-Hole Interconnections in Silicon Substrate
Topics: Packaging, Semiconductor wafers, Silicon, Reliability, Sensors, Alloys, Copper, Density, Electrical resistance, Electroplating
Proceedings Papers

Effects of Thermal Aging and Au Addition on the Electrical Resistance of Solder Balls in Flip Chip and Ultra-CSP Packages

Xingjia Huang, S. W. Ricky Lee, Ming Li, William Chen
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 831-836, July 6–11, 2003
Paper No: IPACK2003-35246
DOI: https://doi.org/10.1115/IPACK2003-35246
View Paper titled, Effects of Thermal Aging and Au Addition on the Electrical Resistance of Solder Balls in Flip Chip and Ultra-CSP Packages
Click here to open pdf in another window PDF for Effects of Thermal Aging and Au Addition on the Electrical Resistance of Solder Balls in Flip Chip and Ultra-CSP Packages
Topics: Electrical resistance, Flip-chip, Flip-chip devices, Solders, Tin, Chain
Proceedings Papers

Analysis of ACF Contact Resistance

J. H. Constable
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 123-130, July 6–11, 2003
Paper No: IPACK2003-35061
DOI: https://doi.org/10.1115/IPACK2003-35061
View Paper titled, Analysis of ACF Contact Resistance
Click here to open pdf in another window PDF for Analysis of ACF Contact Resistance
Topics: Contact resistance, Particulate matter, Wiedemann-Franz law, Anisotropy, Circuits, Current density, Electrical resistance, Electrical resistivity, Heating, Metals